Today’s system-on-chip (SoC) designs — regardless of application — just keep getting more complex. Specifically, high-speed chips become even more daunting when it comes to rooting out electromagnetic (EM) crosstalk. See how NVIDIA relied on Ansys RaptorX and Ansys Exalto to examine aggressors and victims that might cause EM crosstalk.
Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliable supply of power, and stable voltage levels at the transistor connection points, the entire system power delivery network (PDN) must be optimized and validated, including the impact of package on a chip.
ANSYS Exalto is a powerful post-LVS RLCk extraction software for IC design engineers. It enables accurate prediction of electromagnetic coupling effects during the signoff phase.
Ansys VeloceRF is an inductive device compiler and modeling tool that solves some of your most complex challenges for as low as 5nm geometries.
ANSYS RaptorX is a novel, pre-LVS EM modeling software for the electromagnetic expert and the IC design engineer. The limitless capacity of its engine, in combination with highly accurate results and blazing fast modeling times, differentiates it from currently available, traditional EM tools.
Operating power has become one of the most important metrics for modern electronic devices. Qualcomm Technologies, a world-class mobile solution provider, significantly reduced power consumption in an already challenging market by performing power analysis at RTL using ANSYS PowerArtist. Qualcomm Technologies was able to reduce dynamic power by 10 percent through this approach.