A Novel Multicycle Vectorless Dynamic IR Signoff Flow to Capture Hotspots and Achieve Near 100 Percent Coverage
Next-generation mobile, automotive and networking applications require the use of advanced SoCs to deliver greater functionality and higher performance at much lower power. For these SoCs, the margins are smaller, schedules are tighter while costs are higher. Faster convergence with exhaustive coverage is therefore imperative for first time silicon success. For next gen applications, the numbers of vectors for which you need to run simulations have increased multi-fold. It is nearly impossible to uncover potential design weaknesses when you are simulating a handful of vectors for just a fraction of second. How do you ensure you have enough design coverage? The common approach for dynamic IR signoff uses vector-patterns with true delay information. This approach is performed late in the design cycle, requires long simulation time and yields limited IR coverage due to limited vector-patterns. Published traditional vectorless approaches produce unsatisfactory IR coverage and correlation to vector-patterns.
View this on-demand webinar to learn how MediaTek’s novel multicycle vectorless flow uses a design power target, selectively sets a high toggle rate and enables state-propagation features in ANSYS RedHawk. The new flow achieves 97 percent IR coverage of non-memory cells and 100 percent IR coverage of memory cells, captures IR hotspots and reduces run time by 3X, accelerating signoff processes and improving power grid quality.