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Introduction to ANSYS SIwave

Overview

The Introduction to ANSYS SIwave course covers analyses types within SIwave including DC IR drop, PCB characteristic impedance and NEXT and FEXT scanning, TDR (time domain reflectometry), near-and-far-field extraction, and thermal coupling with the ANSYS Icepak thermal simulation product.  PCB layout geometry import formats, workflow, verification, and visibility are covered.  The course also covers setting up hybrid-full wave simulations and how they are set up.

Prerequisites

  • Familiarity with high-speed digital signal electronic engineering, including transmission line characteristic impedance, differential pairs, NEXT (near end cross talk) and FEXT (far end cross talk), and S-parameters.
  • Familiarity with printed circuit board (PCB) layouts, workflows (formats for import and export), and standards (e.g. DDR).
  • Prior experience with full wave electromagnetic simulation is helpful but not required.

Target Audience: Engineers and Designers

Teaching Method: Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course.

 

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Topics Covered :

Course Topics Include

  • Basics: importing 3rd party files, Layout operations, Component configuration, etc.

  • Signal Integrity

  • Power integrity

  • Near-field and Far-Field Analysis/Extraction

  • Virtual Compliance

  • PSI, CPA, CPM transient

Agenda :

This is a 1 day classroom course covering both lectures and workshops. For virtual training, this course is covered over 2 x 2 hour sessions.

  • Live Classroom Day 1
    • Lecture 01: Basics

    • Workshop 1.1: Layout Import

    • Workshop 1.2: Layout Scan

    • Workshop 1.3: Component Configuration

    • Lecture 02: Signal Integrity

    • Workshop 2.1: Port Setup and SYZ

    • Workshop 2.2: TDR Wizard

    • Workshop 2.3: Parametric Analysis

    • Lecture 03: Power Integrity

    • Workshop 3.1: Package PDN RLGC

    • Workshop 3.2a: IRDrop Analysis singlephase

    • Workshop 3.2b: IRDrop Analysis multiphase

    • Workshop 3.3: Decap. Optimization PI Advisor

    • Workshop 4.1: Near field and Far field extraction

    • Workshop 4.2: DDR4 Channel Compliance

    • Workshop 5.1: PSI Setup and SYZ Extraction

    • Workshop 5.2: CPA Setup and RLC Extraction

    • Workshop 5.3: CPM Model for Transient Analysis

Filter By Country :
Date/Time Duration Event Type Location Language Class Cost
mai 13 2019
15:00 - 17:00   CEST (GMT +2)
mai 13 2019 2 sessions
May 13-14
Virtual Virtual - WebEx English Subscription Only Register  ›
avril 24 2019
08:30 - 17:00   EST (GMT -5)
avril 24 2019 1 day
Apr 24
Live Ann Arbor , Michigan , United States English Subscription Only Register  ›
juin 5 2019
09:00 - 17:00   PST (GMT -8)
juin 5 2019 1 day
Jun 5
Live Irvine , California , United States English Subscription Only Register  ›
mai 23 2019
08:30 - 17:00   PST (GMT -8)
mai 23 2019 1 day
May 23
Live San Jose , California , United States English Subscription Only Register  ›
mai 9 2019
9:30 - 17:00   KST (GMT +9)
mai 9 2019 2일
May 9-10
Live Seoul , South Korea Korean 600000   KRW Register  ›
juin 18 2019
9:30 - 17:00   KST (GMT +9)
juin 18 2019 2일
Jun 18-19
Live Seoul , South Korea Korean 600000   KRW Register  ›
juin 4 2019
13:00 - 15:00   EST (GMT -5)
juin 4 2019 3 sessions
Jun 4-6
Virtual Virtual - WebEx English Subscription Only Register  ›

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