Power integrity and signal integrity simulation for any IC should be performed with the proper noise model of the IC, along with the channel model of the package and board.

  • ANSYS RedHawk for chip power modeling
  • ANSYS RedHawk for chip signal modeling
  • ANSYS RedHawk-CPA/SIwave for package modelling
  • ANSYS RedHawk for chip thermal modeling
  • ANSYS IcePak for system level thermal modeling chip-aware system and system-aware chip design, CPM, CTA, CTM, etc.