Q3D Extractor 3D Solver Option
Automatic, Adaptive Meshing
A key benefit of ANSYS Q3D Extractor software is its automatic adaptive meshing techniques. Engineers are required to specify only geometry, material properties and the desired output. The meshing process uses a highly robust volumetric meshing technique and includes a multithreading capability that reduces the amount of memory used and speeds the simulation time. This proven technology eliminates the complexity of building and refining a finite element mesh, and makes advanced numerical analysis practical for all levels of your organization.
3D Quasi-static Field Solver
ANSYS Q3D Extractor contains an advanced quasi-static 3D electromagnetic field solver based on the method of moments (MoM) and accelerated by the fast multipole method (FMM). The results provided by this solver include proximity and skin effect, dielectric and ohmic loss, and frequency dependencies. Q3D Extractor easily and quickly provides 3D extraction of resistance (R), partial inductance (L), capacitance (C) and conductance (G).
IBIS Package Model Extraction
The ability to generate highly accurate reduced-order SPICE models for use in circuit simulation makes ANSYS Q3D Extractor the ideal software to create IBIS package models. Engineers can study crosstalk, ground bounce, interconnect delays and ringing; this helps them to understand the performance of high-speed electronic designs, such as multilayer printed circuit boards, advanced electronic packages and 3D on-chip passive components. In addition, Q3D Extractor is essential for extracting accurate electrical parasitics of critical interconnect components in the package (bondwires), on the board (critical nets), and for the connection path between the chip, package and board (i.e., connectors, cables, sockets and transmission lines).
Power Converter Design
ANSYS Q3D Extractor is ideal for the design of power electronic equipment used in hybrid-electric technologies and power distribution applications to optimize inverter/converter architectures and minimize bus inductance, overvoltage situations and short circuit currents. Q3D Extractor can extract resistance, partial inductance and capacitance parasitics from high-power bus bars, cables and high-power inverter/converter modules, and input them into ANSYS Twin Builder to study the EMI/EMC performance of a power electronic system. Links to ANSYS Icepak and Mechanical enable you to study electro-thermal stresses caused by electrical currents.
With ANSYS Q3D Extractor you can solve design challenges by analyzing the RLCG matrix data of touchscreen devices. The ability to efficiently solve thin conductive layers, such as ITO, can provide speedup of up to 22 times the traditional thick metal solution.
Equivalent Circuit Model Creation
ANSYS Q3D Extractor can be used to create equivalent circuit models (SPICE sub-circuits/ladder-type lumped models). The type of model produced by Q3D Extractor depends on which solver was used. The 2D and 3D field solvers create common formats such as Simplorer SML, HSPICE Tabular W-Element, PSpice, Spectre, IBIS ICM/PKG models and ANSYS CPP models.
Fast Package Analysis using the Q3D Extractor 3D Solver
Utilizing the SIwave GUI with the Q3D 3D Solver enables characterization of an entire package structure and automatically produces lumped or distributed RLCG (Resistance, Inductance, Capacitance, and Conductance) values. A SPICE circuit may be exported for analysis within circuit simulators.