ANSYS Icepak

ANSYS Icepak

ANSYS Icepak provides powerful electronic cooling solutions which utilize the industry-leading ANSYS Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The ANSYS Icepak CFD solver uses the ANSYS Electronics Desktop (AEDT) graphical user interface (GUI). This provides a CAD-centric solution for engineers who can leverage the easy-to-use ribbon interface to manage thermal issues within the same unified framework as ANSYS HFSS, ANSYS Maxwell and ANSYS Q3D Extractor. Electrical and mechanical engineers working in this environment will enjoy a completely automated design flow with seamless coupling from HFSS, Maxwell and Q3D Extractor into Icepak for thermal analysis.

Engineers can rely on Icepak for an integrated electronics cooling solution for electronic applications ranging in scale from individual ICs to packages and PCBs, up to computer housings and entire data centers. The Icepak solver performs conduction, convection and radiation conjugate heat transfer analyses. It has many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Icepak provides a vast library of fans, heatsinks and materials to furnish solutions to everyday electronic cooling concerns.


Comprehensive Multiphysics Design Flow

Integration with the ANSYS engineering portfolio gives you an unequaled design flow to analyze difficult issues including PCB warping, motor cooling and more.

Extensive Libraries for Thermal Physics

Provides access to a vast library of standard components to quickly build cooling models for analysis.

ANSYS Icepak: Icepak Libraries
Convenient Slider Bar Meshing

Provides advanced, automatic mesh generation optimized for electronic and electromechanical components.

Optimization in Icepak

Leverage parametric design, “what if” analyses and Design of Experiments for maximum temperature, current and power analyses.


Powerful toolset lets you visualize 3-D flow animation, velocity vectors, temperature contours and more.


Lets you easily import MCAD and EDA geometries for an efficient workflow.

See how our customers are using our software:

Ruggedized Systems: Cool and Collected

Ruggedized Systems: Cool and Collected

To meet demanding military specifications for mobile and interconnected surveillance, communications and operational devices, Kontron uses sophisticated thermal simulation to balance size, weight, power and cooling (SWaP-C) trade-offs for 'ruggedized' modular chassis that support customized solutions for mission-critical operations.

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Ruggedized Systems: Cool and Collected

Keeping the Block Cool

As cars become more complex, companies that manufacture the supporting electronic systems must make them reliable and safe. Automotive electronics system manufacturer Kyungshin improved the thermal management of its smart junction blocks while cutting production time by 80 percent and costs by over 50 percent.

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