Modeling of Thermomechanical Processes in Semiconductor Fabrication, Packaging and Reliability Testing
The semiconductor industry is adapting to market demands spurred by innovations in AI, autonomous driving, 5G wireless systems and IoT, which have led to a “More than Moore” approach to product design. As newer products have shorter design and test cycles, comprehending thermomechanical effects at all stages of semiconductor fabrication, packaging and reliability testing through simulation has become indispensable.
Ansys Mechanical, Ansys LS-DYNA and Ansys Sherlock provide a compelling set of tools for thermomechanical modeling of complex semiconductor manufacturing processes and reliability testing per industry standards. In this webinar, some of the advanced Ansys solutions for these challenging problems will be presented:
- Modeling of chip-package interactions.
- Modeling of semiconductor fabrication processes like polishing, grinding and laser cutting.
- Modeling of solder shape evolution at reflow.
- Predicting package cracking under temperature cycling and humidity exposure.
Please join us for a webinar on the overview of our structural solutions for semiconductor processes to learn how to effectively use these tools to design your cutting-edge semiconductor devices.