Proven sign-off leader for integrity and reliability of ICs
ANSYS RedHawk is an industry standard power noise and reliability sign-off solution for your SoC designs. With a track record of thousands of designs in silicon, RedHawk enables you to create high-performance SoCs that are still power efficient and reliable against thermal, electromigration (EM) and electrostatic discharge (ESD) issues for markets such as mobile, communications, high-performance computing, automotive and Internet of Things (IoT).
Redhawk has been the go-to sign-off solution for all foundries and processes since 2006, enabling you to create robust, low-power, high-performance SoCs in the most advanced FinFET technology. This includes accurate self-heat and thermal-aware EM analyses.
RedHawk’s advanced Distributed Machine Processing (DMP) enables significantly higher capacity and better performance for full-chip IR/dynamic voltage drop, power/signal electromigration (EM) and electrostatic discharge (ESD) analyses.
System-Aware Chip Design
RedHawk’s complete and accurate model-based interoperability with ANSYS board and system-level tools ensures that your chip works as intended in the system.
- White Papers
- A Novel Multicycle Vectorless Dynamic IR Signoff Flow to Capture Hotspots and Achieve Near 100 Percent Coverage
- Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems - TSMC - Webinar
- System Level Chip-Package-System Power Integrity Co-analysis Solutions for 3DICs - Webinar
- Acceleration of Design Closure and Sign-Off for 7-nm FinFET Technology - Webinar
- Hardware Simulations for Next Generation Advanced Driver Assistance Systems - Webinar
Chip-package-system co-analysis provides superior simulation accuracy and greater design insight than current independent analyses of chip and package.Learn More
Redhawk identifies thermal integrity and thermal-aware reliability issues, which can have a significant impact on power (leakage), IR, timing and electromigration (EM), especially in automobile applications.Learn More
Capacity and Performance
RedHawk offers you the capacity and performance to simulate designs having over 1 billion instances using advanced Distributed Machine Processing (DMP) techniques.Learn More
Silicon-Validated Signoff Accuracy
Provides foundry-certified accuracy for the reduced noise margins and higher voltage drops typical for FinFET designs.Learn More
Power Noise Impact on Timing
RedHawk helps you understand the impact of dynamic voltage drop on timing for clock and critical paths using full-chip-level timing-impact analysis in a SPICE-based sign-off simulation.Learn More
Integrity and Reliability of Advanced IC Packaging
Encapsulating chips within a 2.5-D or 3D package improves power, performance and form factor. Redhawk is qualified for the 2.5-D and 3D package reference flows.Learn More
See how our customers are using our software:
Automotive Thermal Reliability
Electronics in modern automobiles must operate in a high-temperature under the hood environment without sacrificing performance or reliability. Traditional approaches to thermal design based on constant-temperature are no longer reliable. ANSYS’ fine-grain temperature calculation enables NXP to perform thermal-aware electromigration (EM) analysis.View Case Study