Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.
Join us for the annual ANSYS Innovation Conference on September 17th! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.
This event is FREE to attend and breakfast and lunch will be provided. Please register to reserve your spot!
What To Expect
Keynote Speakers Include
Mark was recruited from academia by Medtronic in 2014 where he now leads internal and external collaborations for Human Simulation Platform Technologies in Corporate Core Technologies and supports the business units in the strategic implementation of in silico methods. Mark also leads the Pan-Medtronic Working Group for Modeling and Simulation. In this role, he regularly reports on modeling strategy and initiatives to the Board of Directors, Executive Committee, R&D Council and Clinical Research Council.
Mark holds 2 patents in computational modeling, has 12 publications on the application of modeling and simulation in leading Biomechanics, Physiology, and Orthopedic journals, and he has served as an invited speaker or presenter at over 40 national and international conferences.
Senior Principal Scientist
Prith Banerjee is the Chief Technology Officer of ANSYS where he is responsible for leading the evolution of ANSYS’ technology strategy and champion the company’s next phase of innovation and growth. He also serves on the Board of Directors of Cray, Inc. and Cubic Corporation.
Previously, he was the Senior Client Partner at Korn Ferry where he was responsible for IoT and Digital Transformation in the Global Industrial Practice. Prior to that, he was Executive Vice President, Chief Technology Officer of Schneider Electric, Managing Director of Global Technology Research and Development at Accenture, Chief Technology Officer and Executive Vice President of ABB, Senior Vice President of Research at HP and Director of HP Labs, Dean of the College of Engineering at the University of Illinois at Chicago and Professor and Chairman of Electrical and Computer Engineering at Northwestern University.
In 2000, he founded AccelChip, a developer of products for electronic design automation, which was acquired by Xilinx Inc. in 2006. During 2005-2011, he was Founder, Chairman and Chief Scientist of BINACHIP Inc., a developer of products in electronic design automation. He was listed in the FastCompany list of 100 top business leaders in 2009. He is a Fellow of the AAAS, ACM and IEEE, and a recipient of the 1996 ASEE Terman Award and the 1987 NSF Presidential Young Investigator Award. He received a B.Tech. in electronics engineering from the Indian Institute of Technology, Kharagpur, and an M.S. and Ph.D. in electrical engineering from the University of Illinois, Urbana.
Customer Keynote: Achieving the Medtronic Mission With the Help of Simulation Mark Palmer, MD, PhD, Senior Principal Scientist, Medtronic
10:30 AM - 11:00 AM
OTA Test Solutions for High Volume Production Test of AIP devices Jason Mroczkowski, Director RF Product Development and Marketing, Cohu
11:00 AM - 11:30 AM
Using Rocky DEM to Understand Fouling of Heat Exchangers Anderson Bortoletto, Principal Engineer, Sub-Zero Group Inc.
11:30 AM - 12:00 PM
Global Strategy for Simulation Deployment TBA
12:00 PM - 1:00 PM
NEXT GENERATION ELECTRONICS
1:00 PM - 1:40 PM
Rocky DEM TBA
Bridging the Gap from 3D Imaging to Analysis with Synopsys-ANSYS: Applications in Healthcare
Kerim Genc, PhD – Business Development Manager, Synopsys
Marc Horner, PhD – Principal Engineer, Healthcare, ANSYS
1:40 PM - 2:20 PM
Wireless Charging TBA
Material Intelligence with ANSYS Granta Alexander Berry, Lead Application Engineer, ANSYS
2:20 PM - 2:40 PM
2:40 PM - 3:20 PM
Designing for Electronics Reliability: Most Common Failure Modes and Their Mitigation TBA
Multibody Dynamics Using ANSYS Motion Qida Bing, Lead Application Engineer, ANSYS
3:20 PM - 4:00 PM
Model Based Functional Safety & Embedded Software Solutions Peter Haniak, ANSYS