Introduction to Ansys SIwave

Course Overview

SIwave is an advanced analysis and design tool for complex PCBs, packages, silicon interposers, and RDLs. Employing multiple state-of-the-art full-wave EM solvers, SIwave helps designers solve SI, PI, EMI/EMC problems of Chip/Package/Board systems. In addition to generating S-parameters, RLCG extractions, and SPICE netlists, SIwave offers an array of different analyses, including impedance scan, DC IR drop, time-domain reflectometry (TDR), and impedance optimization of PDN using decoupling capacitors. Ports, terminations, and circuit elements can be inserted into the design to set up the simulation and to model the system end-to-end.

This training course walks new Ansys SIwave users through simulation steps to run various types of SI/PI analyses using real high-speed boards as examples. These steps include the use of AEDT (Ansys Electronics Desktop) circuit simulation and post-processing capabilities.

Prerequisites

  • Familiarity with high-speed digital signal electronic engineering, including transmission line characteristic impedance, differential pairs, NEXT (near end cross talk) and FEXT (far end cross talk), and S-parameters.
  • Familiarity with printed circuit board (PCB) layouts, workflows (formats for import and export), and standards (e.g. DDR)
  • Prior experience with full wave electromagnetic simulation is helpful but not required.

Target Audience:

Electronic engineers involved in high-speed PCB design and validation, including both signal integrity and power integrity

Teaching Method:

Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course.

Learning Path

ansys-siwave-advanced-pathway.png

Learning Outcome

  • Know how to set up SI analyses in SIwave, including impedance scan, SYZ and TDR.
  • Know how to set up PI analyses in SIwave, including SYZ, RLGC, and decoupling capacitor optimization.
  • Know how to configure components including R, L, C, ports, terminations.
  • Know how to configure SPICE and S-parameter component models.

 Available Dates

Time Duration Event Type Location Language Course cost Registration
March 1, 2021
09:00 - 11:00   EST (GMT -5)
2 Sessions
Mar 01-02
Virtual Virtual - WebEx English Subscription Only REGISTER
March 9, 2021
15:00 - 17:00   CET (GMT +1)
2 Sessions
Mar 9-10
Virtual Virtual - WebEx English Subscription Only REGISTER

Learning Options

Training materials for this course are available with a Ansys Learning Hub Subscription. If there is no active public schedule available, private training can be arranged. Please contact us.

 

Agenda

This is a one-day classroom course covering both lectures and workshops. For virtual training, this course is covered over 3 x 2 hour sessions.

  • Basics: Importing 3rd party files, Layout operations, Component configuration, etc.
  • Signal Integrity
  • Power Integrity
  • EMI Scanner and EMI Xplorer
  • Induced Voltage, Resonant Mode, Near Field, and Far Field Simulations
  • Virtual Compliance
  • PSI, CPA, CPM transient

Virtual Classroom Session 1 / Live Classroom Day 1

  •  Lecture M01.1: Intros
  • Lecture M01.2  Import Scans
  • Workshop 1.1: Layout Import
  • Workshop 1.2: Layout Scan
  • Lecture 02: Signal Integrity
  • Workshop 2.1: Port Setup and SYZ

Virtual Classroom Session 2 / Live Classroom Day 1

  • Workshop 2.2: TDR Wizard
  •  Workshop 2.3: Parametric Analysis
  • Lecture M03.1: Power Integrity
  • Lecture M03.2: Component Configuration
  •  Workshop 3.1: Package PDN RLGC

Virtual Classroom Session 3 / Live Classroom Day 1   

  • Workshop 3.2a: IRDrop Analysis singlephase
  • Workshop 3.2b: IRDrop Analysis multiphase
  • Workshop 3.3: Decap. Optimization PI Advisor       

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