Chip Package System Co-design

Power integrity and signal integrity simulation for any IC should be performed with the proper noise model of the IC, along with the channel model of the package and board.

  • ANSYS RedHawk for chip power modeling
  • ANSYS RedHawk for chip signal modeling
  • ANSYS RedHawk-CPA/SIwave for package modelling
  • ANSYS RedHawk for chip thermal modeling
  • ANSYS IcePak for system level thermal modeling chip-aware system and system-aware chip design, CPM, CTA, CTM, etc.

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Chip Package Co-Analysis of Thermal-Induced Stress for Fan-Out Water Level Packaging

CPS Co Design