Thanks to trends like 5G, internet of things (IoT), electrification and autonomy, the electronics industry depends on robust partner collaborations and electronics supply chains.
As a result, vendors will need to share component models with suppliers and partners to ensure that their technologies play nice together.
However, from an intellectual property (IP) perspective, it isn’t safe to share component models that depict a part’s geometries, materials and simulation parameters.
To that end, ANSYS HFSS 3D Components offers vendors a way to share models of their parts without compromising IP. HFSS 3D Components are compatible with simulations that rigorously analyzes the 3D electromagnetic field behavior of the electronic component. As a result, these models have an advantage over S-parameter models that deliver a component’s response based on its test fixture.
How HFSS 3D Components Protect Vendor IP While Promoting Knowledge Sharing
Vendors and developers can use HFSS 3D Components to break up larger simulations into discrete subcomponents. These components can then be re-used, internally and externally, within larger electromagnetic simulations.
3D component models include the simulation’s geometry, material properties, boundary conditions, mesh settings, excitations and discrete parametric controls. As a result, they make it convenient to re-use devices, like antennas, connectors and surface mount devices, in various simulations.
The 3D components enable collaboration, while maintaining IP, by controlling which features are visible to a component’s end-user. This control is maintained using passwords, file encryptions and component creation settings.
Regardless of how much of the component is visible to the end user, it’s still simulation-ready. This is because HFSS’s simulation engine will be able to access the entire component. The end user just has to add the component to the larger simulation. The simulation will then run, as normal, and assess how the component will interact with the overall design. This eliminates the need for the end user of the component to recreate the model within HFSS. They can immediately simulate the component and its intended system within HFSS and benefit from the increased accuracy and design insight that 3D simulation delivers.
To learn more, attend the International Microwave Symposium and register for the ANSYS and Modelithics, Inc. event where we will discuss this new collaborative technology. Or read the application brief: Creating and Deploying Vendor 3D Components in ANSYS HFSS.