ANSYS Innovation Conference - Southern California

May 30, 2019

9:00 AM - 5:00 PM (PDT)

UC Irvine Applied Innovation
5141 California Avenue
Suite 250
Irvine, CA 92617


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Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.

Join us in Irvine, CA for the annual ANSYS Innovation Conference on May 30, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

This event is FREE to attend, register early to reserve your spot. Lunch will be provided.
Complimentary parking is available in LOT 70. See below for campus map and parking instructions. 


Time Topic
9:30 - 9:40 ANSYS Introduction and Welcome
Michael Nisenson, Area Sales Director, Americas West, ANSYS
9:40 - 10:20 Keynote: Five Pillars of Innovation
Dr. Larry Williams, Director of Technology, ANSYS
10:20 - 11:00 Keynote: Utilizing ANSYS CFD to Shed Light on Clinical Observations: How ANSYS has Revolutionized Examination of the Effects of MSE on Airway in Adult Orthodontic Patients
Dr. Won Moon, Section Chair, UCLA Orthodontics
Dr. Andrew Fraser, Chief Resident, UCLA Orthodontics
11:00 - 11:10 NETWORKING BREAK
11:10 - 11:40 Image-Based Computational Modeling to Improve Clinical Outcomes 
Marc Horner, Ph.D., Technical Lead, Healthcare, ANSYS
11:40 - 12:10 PM "Honey I Shrunk the Kids" - A New Paradigm for Miniaturizing Industrial and Medical Devices
Paul Dhillon, CEO, Integra Devices
David Ambrose, Director of Engineering, Integra Devices 
1:00 - 1:30 Autonomous Vehicle Lidar, Camera, Radar and Closed-Loop Simulation
Chris Grieve, Business Development Manager, SBU, ANSYS
1:30 - 2:00 Package Development of Large Scale SoCs Using CR-8000 Design Force and ANSYS
Motochika Okano, Chief Specialist, Package Solution Technology Development Dept., Toshiba
2:00 - 2:15 Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs
Lance Wang, Solutions Architect, Zuken
2:30 - 3:00 ANSYS Discovery Live: Real-time Instantaneous Simulation for Concept Design
Waled Raban, Senior Application Engineer, ANSYS
3:00 - 3:30 Granta: Materials Intelligence for Pervasive Simulation
Austin Flanary, Application Engineer, ANSYS
3:30 - 4:00 ANSYS Fluent Mosaic Meshing for CFD Simulations
Hoang Vinh, Application Engineering Manager, ANSYS

Thank you to our sponsor


Keynote Speakers

Dr. Larry Williams
Director of Technology, ANSYS


Dr. Larry Williams is Director of Technology at ANSYS Inc. He is responsible for the strategic direction of the company’s physics simulation products. Dr. Williams is an expert in the application of electromagnetic field simulation to the design of antennas, electromagnetic devices, and high-speed electronics. He has over 20 years’ experience in the fields of electromagnetics and communications engineering, has delivered technical lectures internationally, and has published numerous technical papers on the subject. He and his co-authors won the prestigious H.A. Wheeler Prize Paper Award in the IEEE Transactions on Antennas and Propagation, 1995, and the best paper award at

Dr. Williams held various senior engineering positions in the Engineering Division of Hughes Aircraft Company, Radar Systems Group, where he was responsible for hardware design and development of advanced active phased array radar antennas, array element and aperture design, associated microwave subsystems, and antenna metrology.

He received his Masters, Engineers, and Ph.D. degrees from UCLA in 1989, 1993 and 1995, respectively.

Dr. Won Moon
Section Chair of UCLA Orthodontics


Dr. Won Moon is the Thomas R. Bales Endowed Chair in Orthodontics and serving as the chair and program director for an orthodontic residency program, UCLA School of Dentistry. He has been a Diplomate of the American Board of Orthodontics since 2002. He completed his dental education at Harvard and orthodontic education at UCLA. He studied mathematics prior to dentistry, and his research topics include 3D image analysis utilizing surface mapping functions and Elliptical Fourier’s Descriptors, Genomewide Association Study of Craniofacial Phenotypes, Finite Element Model (FEM) Development and Simulation, Applications of 3D Printing in Orthodontics, Orthopedic Correction, Airway Changes with Orthopedic Corrections, Accelerated Tooth Movement, and Micro-implant (MI) Design study. His work has been published in various journals, not necessarily limited to orthodontics because of his background, and he is a co-author of three textbooks. He has presented these findings in 23 countries, totaling over 300 presentations. His current focus has been establishing protocols for orthopedic corrections with MI, improving the airway for patients with nasal obstruction, and creating virtual patients utilizing image analysis and FEM.

His interest in mid-facial expansion began in 2004 as micro-implant became available in USA, and he is responsible for developing Maxillary Skeletal Expander (MSE), a unique micro-implant assisted rapid palatal expander (MARPE). He has been active in advocating non-surgical skeletal expansion in both children and adult patients, especially for those who may suffer from airway restrictions. His presentation in MSE has been widely accepted internationally, and numerous peer-reviewed publications are available.

Dr. Andrew Fraser
UCLA Orthodontics Chief Resident


Dr. Andrew Fraser is the chief resident at the University of California Los Angeles School of Dentistry Section of Orthodontics. In addition, Dr. Fraser is the lab manager for Professor Won Moon’s research lab, focused on clinical investigation into the effects of Dr. Moon’s patented non-surgical expander, the MSE. Dr. Fraser’s research is focused on the effects of maxillary skeletal expansion on the adult orthodontic patient’s breathing and airway. Dr. Fraser earned his D.M.D. degree from the University of Pennsylvania School of Dental Medicine in 2016. Dr. Fraser has an M.S. in biomedical engineering from Tufts University and was the recipient of a research fellowship in immunology and microfluidics at Harvard University in 2010.




Dr. Won Moon & Dr. Andrew Fraser, UCLA Orthodontics

Utilizing ANSYS CFD to Shed Light on Clinical Observations: How ANSYS has Revolutionized Examination of the Effects of MSE on Airway in Adult Orthodontic Patients

Transverse maxillary arch deficiencies complicate orthodontics and lead to narrow airways. In adults, a problem arises as to how to expand the maxilla when the mid-palatal suture has already fused without surgery. For this scenario, the maxillary skeletal expander (MSE) by Dr. Moon is ideal. In this presentation, we demonstrate how UCLA has integrated ANSYS software to measure changes to airway via segmentation and CFD after non-surgical expansion with the MSE and examine the overall effects of MSE on the patient's ability to breathe.

Marc Horner, Ph.D., ANSYS

Image-Based Computational Modeling to Improve Clinical Outcomes

Image-based computational modeling combines information from medical imaging and physics-based mathematical modeling to provide a virtual clinical environment for healthcare planning and execution. This presentation will review various opportunities for image-based modeling to improve health outcomes, including aneurysm rupture risk estimation and stent deployment in abdominal aortic aneurysms (AAA).

Paul Dhillon & David Ambrose, Integra Devices

"Honey I Shrunk the Kids" - A New Paradigm for Miniaturizing Industrial and Medical Devices

Conventional micro-manufacturing leverages semiconductor-based methods to build small micro-electromechanical systems (MEMs). Using micromachining processes such as deposition, photolithography, and etching, the MEMs industry has successfully miniaturized many electro-mechanical devices, such as accelerometers, microphones, and other sensors. However, due to inherent limitations with these processes, the MEMs industry has only been able to produce a handful of products. Less than 8% of the total industrial components (a $200B market) has been miniaturized. Due to the large, untouched market opportunity, universities and research labs have continued to look and invest in novel ways to fabricate micro-devices. The University of California, Irvine has been a pioneer in this field, investing 15 years and millions of dollars into the exploration of alternative micro-manufacturing methods through grants from both government and industry partners.

In 2014, the University of California Irvine patented a completely new paradigm for building micro-devices. This batch-manufactured approach leverages 3D heterogeneous integration used in the microelectronic packaging industry; stacking and laminating layers instead of monolithically depositing layers. This research has demonstrated over 20 different devices that can be built using this process. This new toolbox and know-how presents a huge opportunity to develop a new breed of miniature products that could not have been built before.

Integra Devices, a UCI spin-out is using this paradigm to develop a new breed of micro-device products. We will present a few of Integra Devices's flagship products, how they are constructed and how the company leverages ANSYS software to assist in their design.

Motochika Okano, Toshiba

Package Development of Large Scale SoCs Using CR-8000 Design Force and ANSYS

Traditional design processes constrain the ability to conduct feasibility studies in identifying optimal package architectures from a system-level perspective. Feedback from these studies are manually communicated for production design, leading to an inefficient process and creates difficulty in correlating analysis data. This presentation will explain how collaboration with ANSYS and Zuken enables a new design and analysis flow that streamlines the feasibility phase and drive intelligent process for production design to help in the implementation of current and future package architectures.

Lance Wang, Zuken

Enabling Early and Fast Thermal Simulation for 3D Multi-Die System Designs

As design complexity increases with 3DICs and time-to-market becomes a critical component in the automotive, wearables and IoT segments, reducing design cycle time while maintaining accuracy of analysis has become all the more important. To address this, a system level co-design approach in step with multi-physics analysis is presented. To mitigate errors due to manual exchange of data between various engineering teams spread across chip, package and board with design and analysis adding further level of exchange, a design flow incorporating simplification at the layout level is shown. The flow enables various levels of simplified models to be used, wherein data transfer between the complex 3D structures in layout to the thermal analysis tool is automated. The efficacy of the model simplification is verified through a test case showing comparable results for the simplified and full models.

Waled Raban

ANSYS Discovery Live: Real-time Instantaneous Simulation for Concept Design

ANSYS Discovery Live is a revolutionary new technology that offers engineers a faster, simpler way to explore and design digitally. Imagine creating a design and obtaining instantaneous 3D simulation results that predicts product performance. Now imagine making a change to that design and finding out in real time how that change will impact performance. With ANSYS Discovery, you can build and optimize lighter and smarter products.

Austin Flanary ANSYS

Granta: Materials Intelligence for Pervasive Simulation

There is an ever growing movement in organizations to digitalize information to improve efficiency at every stage of product development, manufacturing, procurement, etc. Materials information is one of the primary sectors of this digitalization movement that has previously received less emphasis than geometric or analytical counterparts in product development, but remains paramount to the success of products and organizations. Granta Design, now part of ANSYS, provides solutions to this digital materials information dilemma in the form of CES Selector and GRANTA MI that not only provide searchable and comparable professional databases of materials with the ability to readily export information to design and analysis packages, but also the means to utilize, grow, and integrate materials knowledge throughout an organization for greater success.

Hoang Vinh, ANSYS

ANSYS Fluent Mosaic Meshing for CFD Simulations

ANSYS is addressing this challenge with the introduction of Mosaic technology that automatically connects different types of meshes with general polyhedral elements.  The initial implementation of this technology maintains layered poly-prism elements in the boundary layers, fills the bulk region with computationally-efficient and highly-accurate octree hexahedral elements, and conformally connects these two meshes with high-quality polyhedral elements.  The resulting mesh enables faster CFD simulation with greater solution accuracy while using less RAM. 

Parking Information

  • Complimentary parking is available in LOT 70 only. 
  • Mention "ANSYS Conference" to the parking attendant to waive the parking fee. 
  • Shuttle service is available to transport attendees from LOT 70 to UCI Applied Innovation. Service will run from 7:30 AM - 6:00 PM. 


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