This webinar highlights Ansys HFSS’s many dynamic new enhancements provided in Ansys 2020 R2 and delivers a deep dive into powerful new HFSS features for simulating integrated circuits (ICs), microwave/RF components and high-speed electronic devices. We will preview six major breakthrough advances including:
Using direct matrix solving in 3D component domain decomposition method (DDM) for designing complex 5G mmWave antenna arrays.
Leveraging Ansys 5G Wizard for simulating bio-compatibility of 5G user equipment to ensure products achieve design specs and meet regulatory standards.
Employing Ansys ECAD Xplorer to enable electromagnetic (EM) simulation for ICs with dense functionality and tight design margins at scale and speed.
Applying multipaction analysis for electromagnetic breakdown in vacuum environments to support design for tighter margins in space-borne devices, saving on weight and power requirements.
Utilizing Ansys EMA3D Cable for providing platform-level electromagnetic interference (EMI)/electromagnetic compatibility (EMC) analysis of cable harnesses.
Teaming Ansys RaptorH, a dedicated workflow for IC simulation, with HFSS to provide a gold standard verification for sensitive IC designs.
Matthew Commens, PhD, principal product manager, HF, Ansys