Joins us for an ANSYS Webinar

Advances in High Speed Channel and PDN Modeling

May 19, 2020

11:30 AM (IST)

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Venue:
Online

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Attend this webinar to learn about the new capabilities available in Ansys SIwave and Ansys HFSS 3D Layout in 2020 R1. The latest release includes powerful new features for the design of high-speed electronics devices. New capabilities and enhancements focus on signal integrity, power integrity and electromagnetic interference analysis, including:

  • EMI Xplorer – new technology to perform “what if” analyses to improve EMI characteristics in real time
  • Chip Model Analyzer for system simulations containing cascaded models of ICs, packages and PCBs
  • Stack-up wizard enhancements
  • SIwave simulation with parallel HFSS regions
  • Via Backdrill UI
  • Multizone PCB support within HFSS 3D Layout [beta]
  • Native 3D component support in HFSS 3D Layout designs [beta]
  • SIwave AC solver Advanced Coupling Detection
  • SIwave/Ansys Icepak package on PCB enhancements

Speaker: Vasanth R D, Senior Application Engineer

Vasanth R D is a signal/power integrity (SI/PI), EMC technology specialist at Ansys. He has close to nine years of experience in helping customers with electromagnetic simulations across various industry verticals from semiconductor and automotive to aerospace and defense. Vasanth has been actively working with the electronics industry in establishing workflows for SI/PI and EMC aware design workflows as a “pre-compliance” exercise. He holds a master’s degree in RF and microwave engineering from IIT Kharagpur.

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