Electrothermal Analysis of a PCB

Electrical and Thermal Reliability Analysis of Printed Circuit Board with Ansys SIwave, Icepak, Mechanical and Sherlock

April 23, 2020

11:00 AM - 12:00 PM (PDT)

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Online

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When evaluating printed circuit board designs, engineers are faced with the challenge of balancing the requirements of multiple physics disciplines to optimize PCB reliability. Three broad areas of product reliability – electrical, thermal and mechanical reliability – require evaluation to produce reliable PCB designs with a long service life and reduced product failures. This presentation outlines a workflow between Ansys Sherlock, Ansys Icepak, Ansys SIwave, and Ansys Mechanical that combines simulations with reliability physics principles to evaluate and mitigate potential failure risks early in the design phase. Utilizing a simulation-based reliability physics analysis early in the design phase allows engineers to better understand how reliability changes with duty cycle. Reliability physics analysis makes possible the rapid identification and mitigation of certain failure risks with an overall goal of ensuring product safety, meeting warranty targets, and reducing physical test times.

Join us for a free webinar and learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.

Please register early to reserve your spot.

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