ls-dyna

Workflows for Shock and Drop Modeling Hands-On Workshop

April 15, 2020

11:00 AM - 2:00 PM (PDT)

FREE to attend

REGISTER ›

Venue:
ANSYS, Inc.
2645 Zanker Road
San Jose, CA 95134
USA

Contact:
Verly Flores

One of the biggest challenges of consumer electronic device durability is to survive in accidental impact and drop-induced-shock. Understanding the damage of shock at the module level can be helpful in identifying design or material issues early in product design. When dropped, all components are exposed to impact and/or shock, for example:

  • Impact/shock at circuit board level, causing damage to solder joints and/or adhesives
  • Impact on glass and fragile components, causing damage and shattering

ANSYS enables drop/impact/shock modeling through a user-friendly graphical user interface.  From the analysis, a user can predict whether a design can pass impact or shock requirement.

Join Ansys for a free, hands-on “Lunch & Learn” workshop focusing on drop and shock analysis using Ansys LS-DYNA.  In this workshop, we will discuss critical explicit dynamics concepts and demonstrate how to set up the following impact and shock analysis models through the Workbench LS-DYNA graphical user interface:

  • Circuit board drop test model
  • Glass impact failure model
  • Board level shock test model per JEDEC standard

Please register early to reserve your spot. Lunch will be provided.

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