innovation-conference

ANSYS Innovation Conference - Northern California

September 4, 2019

8:30 AM - 5:30 PM (PDT)

This event is FREE to attend!

REGISTER ›

Venue:
Hyatt Regency
5101 Great America Parkway
Santa Clara, CA 95054
USA

Contact:
Verly Flores, verly.flores@ansys.com
Phoebe Lee, phoebe.lee@ansys.com

Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.

Join us in San Jose, CA for the annual ANSYS Innovation Conference on September 4, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

As an added benefit, we're co-locating this conference with the ANSYS Innovation Conference on Autonomous Technology on September 5th. This conference brings together key industry stakeholders to discuss the newest technological advancements in simulating autonomous vehicles.

Register for both events today and secure your complimentary admission while seats are available. Light breakfast and lunch provided.


What To Expect

What to expect

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Keynote Speakers Include

 

Gunjeet Baweja

Gunjeet Baweja

Jefferies
Managing Director, Global Head of Semiconductors and Electronics

 

Amir Salek

Amir Salek

Google
Senior Director of Engineering

 

Peeyush Tugnawat

Peeyush Tugnawat

Google
Customer Engineer

 

Cetin Kiris 

Cetin Kiris

NASA
Computational Aerosciences Branch Chief

 

Prith Banerjee

Prith Banerjee

ANSYS
Chief Technology Officer


Agenda

Check back frequently for updates

Time Topic
8:30 - 9:00 AM REGISTRATION, BREAKFAST & EXHIBIT
9:00 - 9:05 ANSYS Welcome and Introduction             
9:05 - 9:45 Industry Keynote: Market Trends Driving the 4th Tectonic Shift
Gunjeet Baweja, Managing Director, Global Head of Semiconductors and Electronics, Jefferies
9:45 - 10:25 Solution Keynote: Google's Story of Moving EDA to Cloud
Amir Salek, Senior Director of Engineering, Google
Peeyush Tugnawat, Customer Engineer, Google
10:25 - 10:35 NETWORKING BREAK & EXHIBIT
10:35 - 11:15 The Next Frontier of Modeling and Simulation at NASA: Successes and Challenges
Dr. Cetin C. Kiris, Computational Aerosciences Branch Chief, NASA
11:15 - 11:55 ANSYS Keynote: Future of Simulation-Based Product Innovation in the Digital World
Prith Banarjee, Chief Technology Officer, ANSYS
11:55 - 12:10 Improving ANSYS Engineering Simulation Productivity by Moving from Workstation to HPC
George Puscas, Sales Director, TotalCAE
12:10 - 1:00 LUNCH & EXHIBIT
 12:30 - 12:55   Simulation-driven Design and Optimization: Collaborating to Accelerate Development at Advanced Nodes
Aveek Sarkar, VP of AMS Product Management, Solutions and Field, Synopsys 
FLUID and STRUCTURAL TRACK
ELECTRONICS TRACK 
SEMICONDUCTOR TRACK 
1:00 - 1:30 ANSYS Discovery Live for Interactive Design Exploration; The Perfect Marriage Between Design and Simulation 
Waled Raban, Senior Application Engineer, ANSYS
Shielding Effectiveness (SE) Improvement for OSFP 400G Optical Modules
Pranav Devalla, Hardware Design Engineer, Arista Networks
Data Mining for RTL Power Optimization for Holographic Processing Unit
Anand Iyer, Senior Design Engineer, Microsoft
1:30 - 2:00 Multibody Dynamics Using ANSYS Motion
Devashish Sarkar, Application Engineer, ANSYS
HFSS 3D Layout: Enabling Ease of Use, Capacity, and Speed....While Still Being HFSS Accurate
Aaron Edwards, Manager, Application Engineering, ANSYS
Enabling Power Integrity Analysis for a Large Networking SoC Using RedHawk-SC
Saurabh Patel, Hardware Engineer, Barefoot Networks
Calvin Chow, Director, Application Engineering, ANSYS
2:00 - 2:30 Electromigration Modeling Using ANSYS Software Tools
Metin Ozen, Ph.D., Principal (CEO), Ozen Engineering, Inc.
Considerations & Challenges in Designing Packages for RF Applications
Jitesh Shah, Director of Engineering, Renasas
Design for Reliability Flow in 7nm Products with Data Center and Automotive Applications
Jae-Gyung Ahn, Principal Engineer - Device and Reliability, Xilinx
2:30 - 2:45 NETWORKING BREAK & EXHIBIT
2:45 - 3:15 ANSYS Fluent Mosaic Meshing for CFD Simulations
Hoang Vinh, Application Engineering Manager, ANSYS
5G Design Innovation Through Simulation
Mojtaba Fallahpour, Senior Application Engineer, ANSYS
Matt Harrison, Head of AI, Metawave Corporation
De-Risking High-Speed Serial Links from On-Chip Electromagnetic Crosstalk & Power Distribution Issues
Dai Dai, Mixed Signal Design Manager, NVIDIA
Yorgos Koutsoyannopoulos, Vice President, Engineering, ANSYS
3:15 - 3:45 Solving Singing Capacitor Issues with ANSYS Sherlock and ANSYS Mechanical
MingYao Ding, Founder, Singularity Engineering LLC
Electromagnetic, Thermal, and Structural Simulation Case Studies: Wireless Power Transfer, Electric Machines, and Power Electronics
Pavani Gottipati, Senior Application Engineer, ANSYS
3:45 - 4:15 ANSYS Mechanical 2019 R1 & R2 Update Highlights
Krishna Mellachervu, Senior Application Engineer, ANSYS
ANSYS Cloud Solution within ANSYS HFSS and ANSYS SIwave in Electronics Desktop
Juan Castro, Application Engineer, ANSYS
Two Different Approaches of Power-Integrity Analysis and Correlation with On-Chip Measurement
Oscar Ou, Deputy Technical Director, MediaTek
4:15 - 5:30 NETWORKING RECEPTION, EXHIBIT & RAFFLE

Thank You To Our Exhibitors & Sponsors

totalcae-logo penguin-computing rescale-logo supermicro-logo
ubercloud nimbix logo HBM logo Ozen
Boxx Geminus