ANSYS Solutions for Interconnected Smart Devices & 5G Applications

March 6, 2019

12:00 PM - 4:30 PM (PST)


Crowne Plaza Palo Alto
4290 El Camino Real
Palo Alto, CA 94306

Verly Flores

5G, the fifth-generation wireless technology, will enable a smarter world. 5G promises to deliver ultra fast data speeds, extreme low latency, and increased ability to connect to more devices in a given area. Combined, these capabilities will drive autonomous vehicles, unlock industrial IoT and smart city initiatives, and deliver rich multimedia application, to name a few.

While these capabilities will delight the customers, engineers designing 5G systems - from devices to networks to cloud infrastructure - face daunting design and verification challenges. Engineering simulation has been proven to be a key enabler in helping organizations overcome these challenges.

We invite you to join us at this seminar where you will learn how you can deliver innovative designs for 5G using physics-based simulation. Our experts will share their insights into 5G system development and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity.

This event is FREE to attend and will fill quickly, so register early to reserve your spot. Lunch will be provided! 


Time Topic
12:00 - 12:30 PM Registration & Lunch
12:30 - 12:35 ANSYS Introduction and Welcome
12:35 - 1:00 5G Design Innovation Through Simulation
Dr. Larry Williams, Director of Technology, ANSYS
1:00 - 1:45 Industry Keynote: 5G: The Next Generation Mobile Wireless Network
Dr. Joseph Ho, Distinguished Member of Technical Staff, Verizon 5G Lab
1:45 - 2:15 Emerging Challenges of Power and Reliability Signoff for 5G Designs
Karthik Srinivasan, Corporate Application Engineer Manager, Semiconductor, ANSYS
2:15 - 2:30 Networking Break
2:30 - 3:00 Simulating Your Way to 5G Connectivity Using ANSYS
Arien Sligar, Lead Application Engineer, ANSYS
Mojtaba Fallahpour, Application Engineer, ANSYS
3:00 - 3:30 Signal Integrity of Edge Compute System for 5G Applications
Wade Smith, Manager, Application Engineering, ANSYS
3:30 - 4:00 Electro-Thermal Simulation for 5G Wireless Systems
David Geb, Application Engineer, ANSYS
4:00 - 4:30 CPS Analysis
Robert Myoung, ANSYS CPS Solution Architect, ANSYS

Featured Presentations

Dr. Joseph Ho
Distinguished Member of Technical Staff, Verizon 5G Lab


Dr. Joseph Ho is with the Verizon 5G Lab responsible for 5G digital ecosystem development through strategic partnerships with startups, incubators and leading technology companies. He focuses on a broad range of technologies and use cases, including robotics, Industrial IoT, smart vehicles and transportation, AI/analytics, AR/VR and immersive communications. Prior to Verizon, Dr. Ho was the Director of Technical Marketing at Qualcomm Research leading the evangelization of 5G technologies worldwide.

Dr. Ho obtained a PhD degree specializing in mobile networking from Georgia Tech as well as MSEE and BSEE degrees from the University of Washington at Seattle. He holds more than 10 US and international patents.

Dr. Larry Williams
Director of Technology, ANSYS


Dr. Larry Williams is Director of Technology at ANSYS Inc. He is responsible for the strategic direction of the company’s physics simulation products. Dr. Williams is an expert in the application of electromagnetic field simulation to the design of antennas, electromagnetic devices, and high-speed electronics. He has over 20 years’ experience in the fields of electromagnetics and communications engineering, has delivered technical lectures internationally, and has published numerous technical papers on the subject. He and his co-authors won the prestigious H.A. Wheeler Prize Paper Award in the IEEE Transactions on Antennas and Propagation, 1995, and the best paper award at DesignCon 2005. He serves on the UC Irvine Henry Samueli School of Engineering Dean’s Leadership Council and on the California State Polytechnic University Electrical Engineering Department Advisory Board.

Dr. Williams held various senior engineering positions in the Engineering Division of Hughes Aircraft Company, Radar Systems Group, where he was responsible for hardware design and development of advanced active phased array radar antennas, array element and aperture design, associated microwave subsystems, and antenna metrology. He received his Masters, Engineers, and Ph.D. degrees from UCLA in 1989, 1993 and 1995, respectively.



Dr. Larry Williams
Director of Technology, ANSYS

Modern electromagnetic simulation is founded on the vision that all electronic design is fundamentally based on Maxwell’s Equations, thus solving them directly would one day become the basis for the highest performance design. That day is today.

In this forward-looking presentation, Dr. Williams will show how engineers deliver design innovation for 5G systems using advanced physics-based simulation. You will see that superior design can be delivered using advanced engineering simulation and high-performance computing leading to advantage for both large corporations and small start-ups.

Industry examples from 5G applications will be highlighted. An active phased array antenna system for real-time beamforming and high-bandwidth communications will be shown using multi-scale and multi-domain simulation. It will be shown that modern electromagnetic field solvers can combine with circuits and systems for base station antenna system modeling.

Topics in RFIC module design for sub-6GHz applications will be described, and layout-based design assembly will be covered to illustrate how a combination of multi-die laminate structures can be designed.

5G systems require significant signal processing and data center switching resulting in new challenges in chip, package, printed circuit board integration. Examples will be shown where electrical signal integrity, power integrity, thermal behavior, and EMI can be addressed.

Applications of 5G for future Autonomous vehicles and smart cities will also be explored illustrating challenges and opportunities. The presentation concludes with Dr. Williams’ vision on what the future will bring and how it will impact organizations that embrace it.

Emerging Challenges of Power and Reliability Signoff for 5G Designs
Karthik Srinivasan, ANSYS

Reliability at the system level as well as at the package and chip level is impacted by ESD and thermal issues. Guaranteed performance needs to take aging and power into account. Newer interconnect, changing communication protocols and wide range of operating conditions for systems require enhanced reliability for power and signal interconnects. This talk will discuss the needs of enabling 5G system reliability for advanced FinFET designs.

Simulating Your Way to 5G Connectivity Using ANSYS
Arien Sligar, Mojtaba Fallahpour, ANSYS

5G networks are the next generation of mobile access and connectivity technologies, expected to provide significant performance enhancements compared with the available 4G networks. High speed video streaming, autonomous driving, virtual reality, internet of things (IoT), and other potentially disruptive technologies can flourish, and change the way people interact with each other and with their surroundings.

Despite the revolutionary impacts, the realization of 5G technology needs addressing some key issues including carrier aggregation, network densification, and new waveforms and modulation schemes. To address the carrier aggregation, the current proposed 5G architectures are using both microwave (sub-6 GHz) and millimeter wave (>26 GH) bands. Moreover, for the efficient usage of the available spectrum to support higher data rates and more users, massive MIMO has been proposed. Developing these new technologies is a costly and time-consuming procedure. However, comprehensive simulation and modeling techniques can help reducing the prototyping cost, exploring new technologies, and giving design insights to expedite the technology growth.

To this end, this presentation describes a pervasive modeling and design approach, including full-wave electromagnetics simulations to help design the backbone of the 5G networks. This will include modeling massive MIMO antenna arrays (for the base station), user equipment (UE) hardware, characterization of channel state information (CSI), and environment effect on the 5G system performance.

Signal Integrity of Edge Compute System for 5G Applications
Wade Smith, ANSYS

With 5G wireless communication coming to real world, it will bring revolutionary amounts of data that needs to be handled by future networks. Due to latency issues, cloud datacenters to process data is no longer an option. Instead, multiple Gbps data speed Edge Computing is a revolutionary method to break up the internet data near to the user.

ANSYS leading edge electronics simulation solution, combining with cloud computing power, will effectively address the Edge Computer system's Signal integrity problem, and compromise with power integrity and thermal integrity problem under unified platform.

Electro-Thermal Simulation for 5G Wireless Systems
David Geb, ANSYS

The arrival of fifth generation (5G) technology presents unique challenges to designing wireless systems. To help address these challenges multiphysics simulation analysis can provide important insight. This presentation will show a tightly integrated simulation workflow, along with an example, which illustrates the importance of a comprehensive electro-thermal simulation approach to 5G designs. Electromagnetic (EM) results are incorporated into a thermal analysis to determine the spatial variation of temperature. This temperature field is fed back into the EM simulation to understand electrical performance under the influence of radio frequency (RF) heating. This tightly integrated workflow and multiphysics simulation capability enables engineers to understand potential for performance degradation of their 5G wireless systems.

CPS Analysis
Robert Myoung, ANSYS

The modern electronic system’s including 5G electronics Power Efficiency/Integrity and Reliability analysis is a critical area that we need to justify based on the dynamic voltage noise budget at chip, package and board level PDN target impedance calculation with EM(Electro Magnetic) coupling prediction without diminishing the accuracy and performance of the full system simulation.

This technical session will share ANSYS vision/ leading technology on how ANSYS simulation has been turned into multi scale, full fidelity, physics based simulation. ANSYS has a specialized design platform for 5G RF, signal integrity, power integrity and EM analysis of IC packages and PCBs.

Presentation will focus on the fundamentals of simulating the Chip, 3D IC, Package and printed circuit board (PCB) to determine and validate 5G network system's performance and system integrity challenges.