With the continuing challenges involving miniaturization of electronics devices, designers are compelled to place more and more functionality on individual PCB's and packages. As a result, trace layers within these components are becoming more non-uniform and for accurate thermal analysis, it is prudent to use locally varying thermal conductivity. ANSYS Icepak supports electronic CAD data import from various ECAD vendors for both PCB and Packages and allow to accurately consider the thermal conductivity effect. Based on electronic trace information, ANSYS Icepak computes detailed thermal conductivity maps for PCBs and package substrate layers. Localized orthotropic thermal conductivity for PCBs and package substrate layers enables users to accurately represent thermal conduction in multi-layer structures, providing increased accuracy for their thermal solutions. This webinar will focus on various ECAD import options available within ANSYS Icepak, best practices, guidelines and related tips and tricks.
Prior to joining Fluent Inc. in August 2000 (which became a part of ANSYS, Inc. in 2006), as a Technical Services Engineer, Rabindra also work as a post-doctoral fellow in the computational combustion laboratory, in Georgia Tech Atlanta where he performed Large Eddy Simulations and Direct Numerical Simulations on combustion problems. He has a B. Sc. Engineering (Mechanical) and M. Sc. Engineering (Mechanical) from Bangladesh University of Engineering and Technology and he received his Ph.D. in Mechanical Engineering in the field of Combustion from Cambridge University, England.
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