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ANSYS Self-Heat, Power Integrity and Electromigration Solutions Enabled On Samsung's Latest FinFET Technology

CNC Times, May 2017

Certification of self-heat for 10 nm chip technologies and enablement of electromigration (EM) and voltage drop (IR) for the latest 7LPP/8LPP technologies reduces customers' design risk while providing robustness and reliability to their high-performance computing, mobile and automotive applications.