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Aircraft Engine Icing

Recent events of high-altitude turbofan engine malfunctions characterized by sudden power loss and flameouts have been attributed to ice crystal formation in the compressor core. The understanding of ice accretion on rotor/stator blades is paramount and needs to be accounted for and integrated into the gas turbine design process.

Designing optimal anti/de-icing systems requires detailed understanding of complex icing phenomena and their interaction with air flow and ingested particles. Regulatory certification processes are often underpinned with expensive ice tunnel and flight tests with limited data points. High-fidelity CFD/icing models can help engineers develop a better understanding of complex icing processes and design better systems at a fractional cost.

ANSYS icing solutions empower engineers with high fidelity CFD/icing models to account for ice accretion and flow interactions early in the design phase in a seamless manner while harnessing the power of high-performance computing. Attend this webinar to get an overview of ANSYS icing solutions with a focus on ice crystal formation in turbomachinery compressors.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS CFD
Product Category: Fluids
Industry: Aerospace and Defense
Sub Industry: Aircraft


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Elastic Compute Scalable Design Methodologies for Next-Generation FPGAs

Next-generation field programmable gate arrays (FPGAs) for 5G, AI, automotive, cloud and data center applications are getting bigger, faster and more complex. With the market’s continuous demand for higher performance and lower power products, FPGA designers strive hard to achieve stringent power, performance, area and reliability goals to stay ahead of the game. Traditional electronic design automation (EDA) techniques for full-chip critical path timing analysis and power integrity signoff cannot meet the capacity, performance and accuracy requirements for these complex FPGAs. Productivity and project schedules are negatively impacted as a result.

In this webinar, FPGA inventor Xilinx discusses the many applications for its innovative elastic compute scalable design methodologies, including:

  • Large design scaling for timing analysis using ANSYS SeaScape
  • Full-chip EM/IR signoff using ANSYS RedHawk-SC
  • Accelerated chip-scale interconnect delay calculation for timing capture flow using ANSYS Path FX

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Semiconductors, Cloud and IT Solutions
Industry: Automotive


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ANSYS SPEOS 2019 R2のご紹介 (ウェビナー)

ANSYS SPEOS 2019 R2は、ANSYSプラットフォームでの初めてのSPEOSになります。本ウェビナーでは、SPEOS Live Previewといった革新的な新機能のほか、GPUパフォーマンスやGPUアクセラレーション、また最適化設計機能やANSYSプラットフォームによるマルチフィジックスについてご紹介します。最近SPEOSファミリーから新たに加わったいくつかの新機能についてもご紹介します。

Author: ANSYS, Inc. Type: Webinar Date:


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GRANTA CES Selectorのご紹介 (ウェビナー)

GRANTA CES Selectorは材料選定ソフトウェアで、物理素材を使用して製品を開発している企業で利用いただけるソフトウェアです。製品を開発する上で、製品の最適化は不可欠です。通常は、長い時間と労力をかけてコンポーネントをモデリングし、形状、運用荷重、境界条件を調べ、製品の最適化も行います。しかし、材料に関する調査にはそれほど時間をかけていません。最適な製品を開発する上では、設計の最適化のみならず材料の最適化も極めて重要です。つまり、最適な製品を得るには、最適な材料から開始して、その材料に基づいて設計を最適化する必要があります。これが大きな課題の一つです。本ウェビナーでは、より詳細に材料を考慮する方法や手順について説明します。

Author: ANSYS, Inc. Type: Webinar Date:


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SpaceClaim Hex Meshing

Attend this webinar to learn how new meshing capabilities available in ANSYS SpaceClaim can reduce the time it takes to hex mesh complicated models. SpaceClaim now provides flexible, interactive meshing tools to tackle complex meshing jobs.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS SpaceClaim
Product Category: 3D Design


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Accurate Prediction of Panel Flutter Applicable to Supersonic or High Lift Flight: Results and Comparison to NASA Wind Tunnel Data

Avoiding flutter of an aircraft's skin is important for safe and robust operation. Traditional panel flutter prediction tools fall short for conditions where the boundary layer thickness varies. ANSYS’ fluid–structure interaction (FSI) capability accurately predicts panel flutter under the most challenging conditions. ANSYS simulation results will be compared to NASA supersonic wind tunnel data. The simple simulation process and surprisingly small computational requirements for accurate results will also be summarized. Prime applications for the ANSYS FSI capability include next generation supersonic transports heralded by NASA's (X-59) low boom demonstrator or high lift flight conditions of subsonic aircraft.

Presented by: Luke Munholand, Ph.D.
Luke Munholand, Ph.D. is a lead application engineer at ANSYS. For more than 14 years he has provided technical guidance to customers who seek maximum value for their simulation effort. Luke specializes in computational fluid dynamics for the defense and biotechnology areas.

Coauthor: Vinod Rao
Vinod Rao is a computational fluid dynamics (CFD) specialist at ANSYS, where he has been working for over six years on advanced aerospace, turbomachinery and automotive applications. His main areas of expertise include aeromechanics/fluid–structure interaction (FSI), compressible flows, aircraft icing and aeroacoustics.

Author: ANSYS Inc,. Type: Webinar Date:
Product Category: Fluids
Industry: Aerospace and Defense
Sub Industry: Aircraft


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ANSYS HFSS – 2019 R2 Update

Engineers worldwide use ANSYS HFSS to design high-frequency, high-speed electronics found in communications systems, radar systems, advanced driver assistance systems (ADAS), satellites, internet-of-things (IoT) products and other high-speed RF and digital devices. This webinar describes updates to HFSS in release 2019 R2, including extension of the capability to more efficiently model complex antenna scenarios, new capabilities in the ADAS solution space for advanced Doppler processing, improvements to ECAD/MCAD mesh assembly and lightweight MCAD in layout, and the ability to launch HFSS on the ANSYS cloud service.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech


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Implementing Reliability Physics into the Design Process: What Every Manager and Engineer Needs to Know

Most engineers and management will agree that critical decisions regarding design and reliability should be based on robust analyses and data. Despite this concurrence, product teams within the technology space continue to use outmoded approaches for reliability assurance and risk mitigation. This includes empirical handbook predictions like MIL-HDBK-217 and equivalent, arbitrary derating rules, reliability by similarity, prior experience or even no reliability assessment until physical test.

This inertia is partially due to the difficulty of inserting new practices into an ongoing product development process. And the risk is high, since key performance indicators (KPIs) for directors and vice presidents are based on hitting cost and schedule targets, and not on bettering reliability practices.

This presentation reviews the most common design flows and the common insertion points for existing reliability practices. Design flows will include revolutionary (new design), evolutionary (minor changes, such as obsolescence or price reduction) and original design manufacturer (ODM). Within each design flow, ANSYS consultants will provide detailed recommendations on where reliability physics will provide the greatest value, and offer specific details around the activity, information needed and purpose.

At the end of this presentation, engineers and managers will have the foundational knowledge to improve existing processes and educate peers and supervisors as to the value proposition, while minimizing any potential disruption. The long-term goal will be to reduce the engineering resources and time to market necessary to release products into the field, while still reaching or exceeding reliability goals.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Reliability of Microvias/Plated Through-Holes in PCB

Due to the higher I/O density and smaller electronic packages, the demand for high-density interconnects (HDIs) has increased significantly. Microvias are essential elements in HDI printed circuit boards (PCBs). Failure of these structures is the most common cause of open circuits in PCBs. This has created great concern for the reliability of microvias within the electronics industry.

This webinar briefly discusses common failure mechanisms in microvias and plated through-holes, and highlights their differences. It also identifies common manufacturing defects and how they influence the reliability of these structures.

The presentation addresses the challenges and pitfalls associated with the modeling of these devices using the finite element method (FEM), as well as the importance of statistical analysis on fatigue life prediction of plated through-holes (PTHs).

Finally, the webinar provides a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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ANSYS Fluent Fault-Tolerant Workflow Speeds Meshing for Dirty, Non-watertight Geometries

Join us for this free webinar that spotlights how ANSYS Fluent’s new fault-tolerant workflow may be used to simplify and speed meshing for even the dirtiest geometries with no geometry preparation required.

  • Learn how the mesh wrapper seals leakages and imperfections to virtually eliminate manual efforts otherwise needed to patch and repair geometries.
  • Understand how the task-based workflow guides users through the meshing process, enabling them to quickly achieve maximum results with minimum training.
  • Compare and contrast Fluent’s fault-tolerant workflow with the workflow for watertight geometries.
  • Discover how to effectively mesh a dirty geometry during a live demonstration.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Fluent
Product Category: Fluids


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