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Implementing Reliability Physics into the Design Process: What Every Manager and Engineer Needs to Know

Most engineers and management will agree that critical decisions regarding design and reliability should be based on robust analyses and data. Despite this concurrence, product teams within the technology space continue to use outmoded approaches for reliability assurance and risk mitigation. This includes empirical handbook predictions like MIL-HDBK-217 and equivalent, arbitrary derating rules, reliability by similarity, prior experience or even no reliability assessment until physical test.

This inertia is partially due to the difficulty of inserting new practices into an ongoing product development process. And the risk is high, since key performance indicators (KPIs) for directors and vice presidents are based on hitting cost and schedule targets, and not on bettering reliability practices.

This presentation reviews the most common design flows and the common insertion points for existing reliability practices. Design flows will include revolutionary (new design), evolutionary (minor changes, such as obsolescence or price reduction) and original design manufacturer (ODM). Within each design flow, ANSYS consultants will provide detailed recommendations on where reliability physics will provide the greatest value, and offer specific details around the activity, information needed and purpose.

At the end of this presentation, engineers and managers will have the foundational knowledge to improve existing processes and educate peers and supervisors as to the value proposition, while minimizing any potential disruption. The long-term goal will be to reduce the engineering resources and time to market necessary to release products into the field, while still reaching or exceeding reliability goals.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Reliability of Microvias/Plated Through-Holes in PCB

Due to the higher I/O density and smaller electronic packages, the demand for high-density interconnects (HDIs) has increased significantly. Microvias are essential elements in HDI printed circuit boards (PCBs). Failure of these structures is the most common cause of open circuits in PCBs. This has created great concern for the reliability of microvias within the electronics industry.

This webinar briefly discusses common failure mechanisms in microvias and plated through-holes, and highlights their differences. It also identifies common manufacturing defects and how they influence the reliability of these structures.

The presentation addresses the challenges and pitfalls associated with the modeling of these devices using the finite element method (FEM), as well as the importance of statistical analysis on fatigue life prediction of plated through-holes (PTHs).

Finally, the webinar provides a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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ANSYS Fluent Fault-Tolerant Workflow Speeds Meshing for Dirty, Non-watertight Geometries

Join us for this free webinar that spotlights how ANSYS Fluent’s new fault-tolerant workflow may be used to simplify and speed meshing for even the dirtiest geometries with no geometry preparation required.

  • Learn how the mesh wrapper seals leakages and imperfections to virtually eliminate manual efforts otherwise needed to patch and repair geometries.
  • Understand how the task-based workflow guides users through the meshing process, enabling them to quickly achieve maximum results with minimum training.
  • Compare and contrast Fluent’s fault-tolerant workflow with the workflow for watertight geometries.
  • Discover how to effectively mesh a dirty geometry during a live demonstration.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Fluent
Product Category: Fluids


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Creating a Reliability Physics-Focused Organization

Traditional organizations typically engage with reliability at the end of the product development process. This is because traditional reliability has been defined by testing and after-the-fact reliability prediction. However, companies that care about time to market and are aligned with industry best practices are increasingly incorporating elements of assessment and prediction early in the design process. This webinar introduces a blueprint for structuring your organization to introduce reliability physics into each stage of the product development process, to accelerate time to market and ensure reliability.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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How to Handle Underfill in ANSYS Sherlock

Underfill materials are actively used to fortify printed circuit board (PCB) designs, to allow the PCBs to fulfill a plethora of applications and industry standards. From NASA’s space probe (Juno) to autonomous vehicles, underfill materials are present everywhere. While underfilling is a decades long technique, the materials implemented are continuously evolving in response to the growing needs of the electronics industry. New materials require extensive time and resources to fully characterize the mechanical properties and their influence on key components on an assembly.

To alleviate the need for some testing, simulation is used as a complementary effort to qualify material changes. ANSYS Sherlock distinguishes itself as the only simulation tool used in the electronics industry to predict the success of underfill materials. This webinar demonstrates how Sherlock uses a combination of finite element analysis (FEA) and reliability physics to quantify the life of a product stressed by its field and test environments.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Reliability Modeling and Simulation of COTS Assemblies Using ANSYS Sherlock

The reliability risks associated with commercial-off-the-shelf (COTS) electronics and printed circuit board assemblies (PCBAs) can be challenging to evaluate. The integration of COTS PCBAs into larger systems often results from the need to reduce cost and design timelines. In these cases, there is often minimal design information available from the manufacturer. Additionally, COTS assemblies are increasingly utilized in noncommercial environments (i.e., military, aerospace). Dedicated resources and significant testing time can be required to assess these assemblies.

This webinar provides a demonstration of how a COTS PCBA can be assessed using ANSYS Sherlock software, when only a physical sample — and no design information — is available. This approach is a cost-effective way to assess board-level reliability and better understand a PCBA’s response to environmental conditions.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Reliability Physics and FEA: A Perfect Match in the Electronics Industry

The electronics industry continues to evolve with innovative technology. With changing needs and deliverables, electronics reliability issues emerge. From smartwatches to wind power to electric vehicles, reliability is the common denominator in manufacturing robust products. Approaching the challenge of developing a durable product requires a deep comprehension of reliability physics and its interplay with finite element analysis (FEA). Implementing both methodologies facilitates a better understanding of a PCBA’s response to environmental conditions. This webinar demonstrates that assessing board-level reliability and computing lifetime predictions — with casing and other mechanical constraints incorporated — are pertinent to successful products.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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The Reliability of BGAs, QFNs and Other Critical Packages

There are many factors that determine the thermal cycling robustness of an electronic package. Packages that have known thermal cycling issues include ball grid arrays (BGAs), quad flat no-leads (QFNs) and ceramics. This presentation discusses the critical parameters of these packages that may affect the thermal cycling performance. The webinar also covers other possible reasons why your electronic product may not be robust with regards to thermal cycling.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Erosion Analysis in ANSYS Fluent

In this webinar, we discuss erosion modeling and erosion mesh deformation capabilities in ANSYS Fluent. Material erosion under a sand–liquid flow is a serious problem in many engineering applications, especially oil and gas. The ability to predict the progress of erosion in pipelines is critical. The erosion process is complex and often depends on many factors, such as fluid parameters, particle parameters, impact parameters and material parameters. Depending upon the pipe wall material and the solid particle, erosion could be high, leading to material loss and geometry deformation. In some cases, the shape deformation due to erosion can change the flow behavior and, as a result, the erosion rate. Thus, it is important to be able to model shape deformation.

Author: Type: Webinar Date:
Product Name: ANSYS Fluent
Product Category: Fluids
Sub Industry: Oil and Gas


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5G - Antenna Phased Array Design and Beam Forming et Simulations à grande échelle dans un environnement urbain

La démonstration dans ce webinar illustre la conception d'un réseau d'antenne adapté pour la 5G. L'antenne élémentaire est d'abord créée par un wizard et optimisée ensuite pour une mise en réseau. Le calcul complet du réseau sera ensuite fait par la méthode FADDM qui permet d'étudier et de finaliser les performances en gain et adapation du réseau. On illustrera l'utilisation de nos outils pour le Beam Forming utilisé en 5G sur un exemple d'objet connecté dans un bâtiment.

Author: ANSYS, Inc. Type: Webinar Date:
Industry: High Tech


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