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ANSYS Discovery Live for Automotive Applications

As industries like automotive continue to build increasingly complex products, this leaves much room for efficiency and process improvements. Simulation tools like ANSYS Discovery Live harness the modern compute power of NVIDIA GPUs so design teams can explore more design options earlier in product development. The business benefits are substantial: faster product development time, lower costs and improved product performance.

Join ANSYS and PNY, a global technology leader and supplier of NVIDIA GPUs, as we explore the different ways that this groundbreaking software is being used to improve product performance in automotive applications. In this on-demand webinar you will see demonstrations of ANSYS Discovery Live used in examples such as:
  • Optimizing rear axle strength
  • Observing deflection in a clutch housing
  • Analyzing fluid behavior around vehicles
  • Simulating cooling of an EGR system
You will also learn about NVIDIA GPUs, which provide the computing power enabling this groundbreaking technology to work. You will walk away with a better understanding of how Discovery Live is disruptive to the automotive industry, how it promotes better communication between design and analyst teams, and how it can be used in your own applications.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Discovery Live
Industry: Automotive


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PCB Capacitor Optimization that Accounts for Gradient Temperatures and DC Biasing

Learn how to account for temperature and bias capacitance dependencies. This on-demand webinar will focus on using Murata's capacitor library — which represents capacitance as a function of voltage and temperature — within ANSYS Icepak and ANSYS SIwave. With this functionality, you can automatically determine capacitance on printed circuit boards (PCB) using DC simulations to find bias conditions and thermal simulations to determine temperature gradients.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS SIwave
Product Category: Electronics


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High Coverage, Multivariable Build Quality Metrics in Power Integrity Signoff

The availability of ubiquitous data and compute power to solve seemingly unsolvable problems is driving the artificial intelligence (AI) revolution in high tech today. Semiconductor chips for next-generation automotive, mobile and high-performance computing applications — powered by AI and machine learning algorithms — require the use of advanced 16/7nm systems-on-chips (SoCs), which are bigger, faster and more complex. For these SoCs, the margins are smaller, schedules are tighter and costs are higher. Faster convergence with exhaustive coverage is therefore imperative for first-time silicon success. A big data-enabled simulation platform that offers elastic scalability is required for enabling rapid design iterations to create a robust power grid design. Multivariable analytics and machine learning technologies are key for gaining valuable insights from the vast amount of simulation data to accelerate design closure.

In this on-demand webinar, leading semiconductor company Nvidia will discuss the limitations of traditional voltage drop analysis methodologies and share how ANSYS RedHawk-SC’s elastic compute scalability and powerful data analytics can be leveraged to accelerate next-generation SoC power integrity and reliability signoff. A new workflow using multivariable analytics, which considers grid criticality, timing criticality and simultaneous switching noise, is used for predicting the worst, local dynamic voltage drop (DvD) hotspots without running any transient simulation. This enables early detection of hotspots and offers feedback to the physical design team, making it possible to address design issues without impacting the tapeout schedule. The issues identified by this new flow were found to correlate well with vector-based dynamic voltage drop analysis with much faster turnaround time.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Sub Industry: Semiconductor Design, Semiconductors


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A Model-Based Safety Critical Code Generation Flow for Multicore Platforms

In this on-demand webinar, we will demonstrate a model-based development flow that targets parallel execution on various multicore chips for safety-critical software applications (including Kalray MPPA and Infineon's latest generation AURIX™).

The flow is based on an extension of ANSYS SCADE Suite, which generates parallel code from any legacy SCADE application. The generated parallel code is target independent; an integration step is performed to instantiate OS-specific services like communication, synchronization or memory protection. An automated integration process has been developed for several operating systems (including PXROS-HR, developed by HighTec EDV-Systeme, a multicore real-time operating system designed for embedded safety-critical applications, able to take full advantage of Infineon AURIX performance and safety functionalities).

SCADE Suite certified generated code embedded in PXROS-HR certified RTOS provides the streamlined answer to challenging development of critical multicore embedded applications by enabling seamless automated flow from the application model down to executable binary running on a target embedded processor.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS SCADE Suite
Product Category: Embedded Software


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5G and the Connected Vehicle

Combining fully autonomous (AV) technology with 5G-delivered, high-speed and low-latency wireless data promises a safer, more user-friendly driving experience. This impending merger is a result of the developing 5G infrastructure that will provide reliable vehicle-to-vehicle (V2V), vehicle-to-infrastructure (V2I) and vehicle-to-everything (V2X) connectivity for a variety of new, real-time communication services.

The simulation of these connected systems is key to assessing their performance and limits before deployment to ensure maximum performance and reliability. In this on-deman webinar, we will show you how design engineers use ANSYS simulation tools to create reliable 5G systems for automotive applications.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics
Industry: Automotive


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Analyze Visualize and Communicate Your Simulation Data with ANSYS EnSight

See more with ANSYS EnSight.

Learn to use this powerful, post-processing tool to gain new design insights and effectively communicate your results and recommendations. You’ll see the many recent enhancements that allow you to process very large datasets on a computer cluster and create new visualizations offline.

In this on-demand webinar, learn how EnSight will help you:
  • Explore and explain complex systems and processes by consolidating data from multiple engineering simulations and other sources.
  • Handle simulation and other fluids, structures, particles and crash data.
  • Process even the largest simulation datasets with ANSYS EnSight Enterprise. This parallel version of EnSight facilitates the post-processing of results from models with 100 million or more cells on a computer cluster.
  • Display multiple viewports that simultaneously offer macroscopic and microscopic views or multiple models.
  • Interact with the data offline to create new views anywhere and anytime with EnVision Pro, a free 3D viewer.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS EnSight
Product Category: Fluids


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Addressing the Challenges of the Design of Hypersonic Vehicles with Simulations

The recent surge in interest in hypersonic technology has highlighted the need to accurately and efficiently simulate these complex flow-fields using simulation tools. Computer simulations for the design and analysis of hypersonic vehicles are critical as it is often impossible to reproduce the high-Mach number, high-enthalpy conditions experienced at the high speeds of these vehicles in a wind tunnel.

Simulating the hypersonic flow regime with CFD tools presents several challenges, ranging from the accurate modeling of complex physical phenomena, such as compressibility effects, shock-boundary layer interaction, high temperatures, dissociation and ionization of air, ablation of solid surfaces and, ultimately, magnetohydrodynamics effects, to the stabilization of the numerical algorithms used to solve the governing equations.

In this on-demand webinar we will show how ANSYS tools are used to simulate high speed flows and to design hypersonic vehicles, by highlighting the capabilities of the CFD and multiphysics tools and by showing select case studies.

Author: ANSYS Type: Webinar Date:
Product Category: Fluids
Industry: Aerospace and Defense


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ANSYS Twin Builder for Heating and Cooling Systems

ANSYS Twin Builder combines the power of a multidomain systems modeler with extensive 0D application-specific libraries, 3D physics solvers and reduced-order modeling (ROM).

View this on-demand webinar to discover how the Modelica libraries can be used to assemble and simulate system models for heating and cooling applications. Learn how such models can be enriched by integrating third party models through the Functional Mock-up Interface, and how model fidelity can be increased by using ROMs generated by ANSYS 3D physics solvers. Once the models are assembled, use ANSYS Twin Builder to validate the system representation and optimize its performance before exporting the generated model for product operation and predictive maintenance.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Twin Builder
Product Category: Systems


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Noise Vibration Analysis of Electric Machines

This on-demand webinar introduces the latest technology for accurately predicting electrical machine noise, vibration and harshness (NVH). Using a permanent magnet motor example, ANSYS engineers demonstrate new equivalent radiated power (ERP) capabilities that make harmonic structural analysis more robust, and a comprehensive workflow to perform NVH analysis.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics


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Tips and Tricks: ANSYS HFSS 3D Components

ANSYS HFSS can utilize ready-made 3D component models for simulation. These components include antennas, radio frequency (RF) connectors and surface-mount devices (e.g., chip capacitors and inductors). A 3D component model contains all relevant information: geometry, materials, boundary conditions, design parameters and ports (when necessary), for inclusion in a fully coupled, 3D electromagnetic simulation. In addition, a patented encryption technology allows component providers to hide and protect critical intellectual property (IP), while fully describing their parts for downstream simulation. The benefits of using 3D components range from design reuse to collaboration enablement with vendors, partners or customers.

This on-demand webinar will provide tips on creating, editing, managing and sharing HFSS 3D components in your design and simulation flow.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics


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