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ANSYS 19.1 Capabilities - Brochure

ANSYS delivers innovative, dramatic simulation technology advances in every major physics discipline, along with rapid computing speed and enabling technologies such as geometry handling, meshing and post-processing. We offer the most comprehensive suite of simulation solvers in the world so that you can confidently predict your product’s success. This brochure outlines the capabilities of our various products.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS ACT, ANSYS Additive Print, ANSYS Additive Suite, ANSYS Aqwa, ANSYS Autodyn, ANSYS BladeModeler, ANSYS CFD Enterprise, ANSYS CFD Premium, ANSYS CFD Professional, ANSYS CFX, ANSYS Chemkin-Pro, ANSYS Chemkin Enterprise, ANSYS DesignSpace, ANSYS DesignXplorer, ANSYS Discovery AIM, ANSYS Discovery Live, ANSYS Discovery SpaceClaim, ANSYS Electronics Desktop, ANSYS EKM, ANSYS EnSight, ANSYS FENSAP-ICE, ANSYS FENSAP-ICE TURBO, ANSYS Fluent, ANSYS Forte, ANSYS HFSS, ANSYS HPC, ANSYS Icepak, ANSYS LS-DYNA, ANSYS Maxwell, ANSYS Mechanical, ANSYS Meshing, ANSYS Model Fuel Library, ANSYS Path FX, ANSYS PathFinder, ANSYS Polyflow, ANSYS PowerArtist, ANSYS Q3D Extractor, ANSYS RedHawk, ANSYS SCADE Architect, ANSYS SCADE Display, ANSYS SCADE Lifecycle, ANSYS SCADE Server, ANSYS SCADE Suite, ANSYS SCADE Test, ANSYS SIwave, ANSYS Totem, ANSYS Twin Builder, ANSYS Variance FX, ANSYS Vista TF, ANSYS medini analyze, ANSYS nCode, ANSYS AIM, ANSYS SpaceClaim Direct Modeler
Product Category: 3-D Design, Electronics, Embedded Software, Fluids, Multiphysics, Platform, Semiconductors, Structures, Systems, Cloud and IT Solutions, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Integrated Circuits, Electronics - Signal Integrity, High Performance Computing, Academic, Other Products


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ANSYS Discovery 19.1 Update - Video

In ANSYS 19.1 you’ll see many speed and workflow improvements to the Discovery family of products, making your 3D modeling and simulation tasks easier than ever. With many graphics and visualization enhancements in the products, finding the right data at the right time has never been easier. Watch this video to learn about some enhancements, and be sure to view an update webinar to learn even more.

Author: Type: Video Date:
Product Name: ANSYS HFSS, ANSYS Maxwell, ANSYS Icepak, ANSYS Q3D Extractor
Product Category: Multiphysics


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ANSYS 19.0 Capabilities - Brochure

ANSYS delivers innovative, dramatic simulation technology advances in every major physics discipline, along with rapid computing speed and enabling technologies such as geometry handling, meshing and post-processing. We offer the most comprehensive suite of simulation solvers in the world so that you can confidently predict your product’s success. This brochure outlines the capabilities of our various products.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS Mechanical, ANSYS DesignSpace, ANSYS Autodyn, ANSYS LS-DYNA, ANSYS AIM, ANSYS Fluent, ANSYS CFX, ANSYS Polyflow, ANSYS Forte, ANSYS FENSAP-ICE, ANSYS Maxwell, ANSYS HFSS, ANSYS SIwave, ANSYS Q3D Extractor, ANSYS Icepak, ANSYS Simplorer, ANSYS SCADE Architect, ANSYS SCADE Suite, ANSYS SCADE Display, ANSYS DesignModeler, ANSYS SpaceClaim Direct Modeler, ANSYS SpaceClaim, ANSYS Discovery Live
Product Category: 3-D Design, Electronics, Embedded Software, Fluids, Multiphysics, Platform, Semiconductors, Structures, Systems


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ANSYS 18 Innovations - Signal Integrity, Power Integrity and EMI - Webinar

ANSYS 18 delivers new key functionalities for high-speed digital design. The powerful new 3-D assembly capability in ANSYS HFSS links ECAD and MCAD with transient circuit simulation and IC models, so you can solve the ‘Connector on Board’ problem within a single design flow using a single mesh. ANSYS SIwave features fast extraction technology, new high-performance computing (HPC) functionality for capacity and speed, and support for PSPICE Voltage Regulator Modules. SIwave also includes enhancements in IBIS-AMI, eye analysis, and state-space fitting within the circuit solver.

Attend this webinar to learn how ANSYS 18 has enhanced the Chip-Package-System workflow to address design challenges in power integrity, signal integrity, ESD, thermal and structural challenges Discover how ANSYS solutions provide a unique virtual prototyping flow to simulate the electrical, thermal, and mechanical behaviors of high-speed electronics, allowing you to meet your system power and performance targets while reducing cost.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics - Signal Integrity


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ANSYS 18 Innovations - High Frequency Electromagnetics - Webinar

High-frequency, high-speed electronic devices are increasingly critical for microwave, RF and high-speed digital applications. ANSYS HFSS software is the industry standard for simulating 3-D, full-wave, electromagnetic fields for such applications. Its state-of the-art solver technologies based on finite element, integral equation, asymptotic and advanced hybrid methods are essential tools for engineers tasked with executing accurate and rapid design of high-frequency electronic devices.

Attend this webinar to learn about the latest innovations in ANSYS HFSS 18, including a new streamlined antenna workflow with an enhanced antenna design kit, broadband adaptive meshing for improved accuracy and reliability, and the integration of our Delcross Savant technology into the new HFSS SBR+ (shooting and bouncing ray) workflow. Discover new productivity enhancements such as breakthrough HPC technology for faster and more memory-efficient frequency sweeps, and advances in 3-D component technology that provide a powerful collaborative platform for EM simulation.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS, Savant
Product Category: Electronics - High Frequency Electromagnetics


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KSR International and ANSYS

KSR International: Reducing Inductance Sensor Design from Three Months to Two Weeks

Author: ANSYS, Inc. Type: Case Study Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics
Industry: Automotive


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ANSYS HFSS - Brochure

Achieve high-frequency, high-speed component design with state-of-the-art tools from ANSYS. ANSYS HFSS delivers the most accurate EM simulation results, every time.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics


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ANSYS HFSS 16.0 Update: New Methodologies for 3-D Electromagnetic Simulations - Webinar

ANSYS HFSS 16.0 is the industry standard for simulating full-wave 3-D electromagnetic fields. The software accurately, automatically and reliably replicates the electro-magnetic behavior of high-frequency and high-speed electronic devices such as antennas, filters, PCBs, connectors, IC packages and on-chip passive components.

During this webinar, we will learn about improvements in the updated HFSS. These upgrades include a new, integrated desktop that delivers a combined circuit and 3-D simulation methodology, improvements to our 3-D component capability, enhancements to our transient method of solver technologies, and new, ease-of-use functionality for high-performance computing. You will discover how these new enhancements can boost your simulation workflow and provide the ability to quickly design products and accelerate time to market.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics


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ANSYS Icepak 16.0: New Features and Enhancements - Webinar

ANSYS Icepak simulates thermal and fluid flow in ICs and PCBs, including all modes of heat transfer — conduction, convection and radiation — for steady-state and transient electronics cooling applications. Keeping electronic components cool is a key to preventing degradation of their performance.

Join us for this webinar to learn about new features added to ANSYS Icepak 16.0, including improvements in multiphysics coupling of electromagnetics and thermal simulation for increasing the fidelity of electronic designs. Discover how Icepak 16.0 can couple with other ANSYS electronics software solutions, such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor, ANSYS Sentinel-TI and ANSYS SIwave for comprehensive analysis and design. The new and improved ECAD import option will also be discussed.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Maxwell, ANSYS Icepak, ANSYS Sentinel, ANSYS Q3D Extractor, ANSYS SIwave, ANSYS HFSS
Product Category: Electronics


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Juniper Networks and ANSYS

Juniper Networks is a manufacturer of high-performance network equipment. ANSYS HFSS provides Juniper with fast and accurate results, leading to better products.

Author: ANSYS, Inc. Type: Testimonials Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics
Sub Industry: Communication and Storage and Networking Equipment


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