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고속 연결선을 위한 채널 심층 분석 - ANSYS Advantage - Issue 3 | 2017

엔지니어는 시뮬레이션을 활용하여 신호 채널 전반에서 차세대 고성능 상호 연결선을 위한 솔루션을 설계하고 최적화합니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS HPC, ANSYS SIwave
Product Category: Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing, Electronics - Cooling, Electronics - Signal Integrity


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전자기 호환성 보장 - ANSYS Advantage - Issue 3 | 2017

STMicroelectronics는 full-wave 주파수 영역과 회로 시뮬레이션과 결합하여 물리적인 프로토타입 제작 전에 EMI / EMC 및 전자기 간섭 문제를 검증할 수 있는 워크플로를 개발했습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS HFSS, ANSYS HPC
Product Category: Electronics, High Performance Computing


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전자 기기의 혁신 촉진 - ANSYS Advantage - Issue 3 | 2017

선두 전자 기업들은 엔지니어링 시뮬레이션을 활용하여 에너지 소비를 줄이고, 다른 기기와의 간섭을 방지하고, 개발 시간을 단축합니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Maxwell, ANSYS Mechanical, ANSYS HPC, ANSYS HFSS, ANSYS Fluent, EMIT, ANSYS SIwave, ANSYS Icepak
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Fluids
Industry: Aerospace and Defense


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의미 있는 결과 - ANSYS Advantage - Issue 3 | 2017

아스팔트 기업에서 ANSYS EnSight로 여러 시뮬레이션 결과와 여러 설계 대안을 결합하여 의미있는 시뮬레이션 데이터를 얻어냈습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Fluent, ANSYS EnSight, ANSYS HPC
Product Category: Fluids
Industry: Materials and Chemical Processing


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안테나 설계 조정 - ANSYS Advantage - Issue 3 | 2017

Optisys는 엔지니어링 시뮬레이션, 대용량 컴퓨팅 및 3D 프린팅을 사용하여 안테나 크기 및 무게를 수십 배 줄이는 동시에 개발 시간을 단축했습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS HFSS, ANSYS Mechanical, ANSYS HPC
Product Category: Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing


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Driving Innovation with Electronics - Article - ANSYS Advantage - V11 I3

Electronics are pervasive in our world today. From electric machines to high-speed electronic devices to antennas and wireless communication, the demand continues to grow. However, designing innovative products to work reliably in the real world becomes more difficult with the need to reduce energy consumption, avoid interference with other devices and decrease development time. Leading companies leverage engineering simulation to quickly bring to market pioneering products that meet and exceed expectations.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Maxwell, ANSYS Mechanical, ANSYS HPC, ANSYS HFSS, ANSYS Fluent, EMIT, ANSYS Icepak, ANSYS SIwave
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Fluids, Structures, Electronics - Signal Integrity
Industry: Aerospace and Defense


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Meaningful Results - Article - ANSYS Advantage - V11 I3

The performance of an asphalt plant depends upon the interaction of many different processes. Astec has made substantial improvements in its ability to accurately simulate these different processes, generating large quantities of disparate data whose impact on the design issues at hand is often difficult to understand. Astec brings meaning to this data by combining results from different simulation tools and different design alternatives. Animations, graphs and explanatory text are merged into a single composite image using ANSYS EnSight. This gives the decision-maker everything he or she needs to know to improve product performance.

Author: Astec, Inc. Type: Article Date:
Product Name: ANSYS Fluent, ANSYS EnSight, ANSYS HPC
Product Category: Fluids
Industry: Materials and Chemical Processing


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Tuning in to Antenna Design - Article - ANSYS Advantage - V11 I3

Using engineering simulation, big compute and 3-D printing, Optisys achieves orders-of-magnitude reduction in antenna size and weight while reducing development time. By leveraging ANSYS electromagnetic and structural simulation tools running on Rescale’s big compute platform, this startup’s engineers take full advantage of the design freedom offered by 3-D printing to meet radio frequency (RF) performance requirements for an integrated array antenna.

Author: Optisys, LLC Type: Article Date:
Product Name: ANSYS Mechanical, ANSYS HFSS, ANSYS HPC
Product Category: Structures, Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing


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Deep Channel Analysis for High-Speed Interconnect Solutions - Article - ANSYS Advantage - V11 I3

Data center servers, storage and networking equipment communicate over copper and optical cable assemblies joined by ever-faster connectors. Samtec leverages a comprehensive suite of simulation software from ANSYS to design and optimize next-generation, high-performance interconnect solutions across the entire signal channel.

Author: Samtec, Inc. Type: Article Date:
Product Name: ANSYS HPC, ANSYS SIwave
Product Category: Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing, Electronics - Cooling, Electronics - Signal Integrity


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Ensuring Electromagnetic Compatibility - Article - ANSYS Advantage - V11 I3

STMicroelectronics has developed a workflow that combines full-wave frequency domain with circuit simulation to determine electromagnetic interference / electromagnetic compatibility and electromagnetic coexistence issues before physical prototyping. The new approach has been proven to identify and fix, early in the design process, issues that could otherwise delay the product launch by up to four months or 20 percent of the development time.

Author: STMicroelectronics Type: Article Date:
Product Name: ANSYS HFSS, ANSYS HPC
Product Category: Electronics, High Performance Computing


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