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ANSYS 19.2 Capabilities - Brochure

ANSYS delivers innovative, dramatic simulation technology advances in every major physics discipline, along with rapid computing speed and enabling technologies such as geometry handling, meshing and post-processing. We offer the most comprehensive suite of simulation solvers in the world so that you can confidently predict your product’s success. This brochure outlines the capabilities of our various products.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS ACT, ANSYS Additive Print, ANSYS Additive Suite, ANSYS Aqwa, ANSYS Autodyn, ANSYS BladeModeler, ANSYS CFD Enterprise, ANSYS CFD Premium, ANSYS CFD Professional, ANSYS CFX, ANSYS Chemkin-Pro, ANSYS Chemkin Enterprise, ANSYS DesignSpace, ANSYS DesignXplorer, ANSYS Discovery AIM, ANSYS Discovery Live, ANSYS Discovery SpaceClaim, ANSYS Electronics Desktop, ANSYS EKM, ANSYS EnSight, ANSYS FENSAP-ICE, ANSYS FENSAP-ICE TURBO, ANSYS Fluent, ANSYS Forte, ANSYS HFSS, ANSYS HPC, ANSYS Icepak, ANSYS LS-DYNA, ANSYS Maxwell, ANSYS Mechanical, ANSYS Meshing, ANSYS Model Fuel Library, ANSYS Path FX, ANSYS PathFinder, ANSYS Polyflow, ANSYS PowerArtist, ANSYS Q3D Extractor, ANSYS RedHawk, ANSYS SCADE Architect, ANSYS SCADE Display, ANSYS SCADE Lifecycle, ANSYS SCADE Server, ANSYS SCADE Suite, ANSYS SCADE Test, ANSYS SIwave, ANSYS Totem, ANSYS Twin Builder, ANSYS Variance FX, ANSYS Vista TF, ANSYS medini analyze, ANSYS nCode, ANSYS AIM, ANSYS SpaceClaim Direct Modeler
Product Category: 3-D Design, Electronics, Embedded Software, Fluids, Multiphysics, Platform, Semiconductors, Structures, Systems, Cloud and IT Solutions, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Integrated Circuits, Electronics - Signal Integrity, High Performance Computing, Academic, Other Products


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고속 연결선을 위한 채널 심층 분석 - ANSYS Advantage - Issue 3 | 2017

엔지니어는 시뮬레이션을 활용하여 신호 채널 전반에서 차세대 고성능 상호 연결선을 위한 솔루션을 설계하고 최적화합니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS HPC, ANSYS SIwave
Product Category: Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing, Electronics - Cooling, Electronics - Signal Integrity


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전자기 호환성 보장 - ANSYS Advantage - Issue 3 | 2017

STMicroelectronics는 full-wave 주파수 영역과 회로 시뮬레이션과 결합하여 물리적인 프로토타입 제작 전에 EMI / EMC 및 전자기 간섭 문제를 검증할 수 있는 워크플로를 개발했습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS HFSS, ANSYS HPC
Product Category: Electronics, High Performance Computing


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전자 기기의 혁신 촉진 - ANSYS Advantage - Issue 3 | 2017

선두 전자 기업들은 엔지니어링 시뮬레이션을 활용하여 에너지 소비를 줄이고, 다른 기기와의 간섭을 방지하고, 개발 시간을 단축합니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Maxwell, ANSYS Mechanical, ANSYS HPC, ANSYS HFSS, ANSYS Fluent, EMIT, ANSYS SIwave, ANSYS Icepak
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Fluids
Industry: Aerospace and Defense


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의미 있는 결과 - ANSYS Advantage - Issue 3 | 2017

아스팔트 기업에서 ANSYS EnSight로 여러 시뮬레이션 결과와 여러 설계 대안을 결합하여 의미있는 시뮬레이션 데이터를 얻어냈습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Fluent, ANSYS EnSight, ANSYS HPC
Product Category: Fluids
Industry: Materials and Chemical Processing


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안테나 설계 조정 - ANSYS Advantage - Issue 3 | 2017

Optisys는 엔지니어링 시뮬레이션, 대용량 컴퓨팅 및 3D 프린팅을 사용하여 안테나 크기 및 무게를 수십 배 줄이는 동시에 개발 시간을 단축했습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS HFSS, ANSYS Mechanical, ANSYS HPC
Product Category: Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing


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在32核高性能计算集群上将ANSYS Maxwell DSO提速16倍,通用汽车实现牵引电机设计生产力翻番

在设计电动车(EV)和混合动力车(HEV)的牵引电机时,设计优化工作充满了挑战,因为汽车制造商在这个领域经验不足。电磁仿真在评估设计概念的性能方面起着关键作用,如计算机器的扭矩参数等。过去单次设计迭代上的电磁仿真需耗时数百小时,工程师不得不等待结果,严重影响生产力。通用汽车(GM)研发出一种高性能计算(HPC)环境,它使用32核计算机集群的多余硬件为电磁仿真带来16倍加速,将求解时间缩短到不足5小时。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Maxwell, ANSYS HPC
Product Category: High Performance Computing
Industry: Automotive


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Deep Channel Analysis for High-Speed Interconnect Solutions - Article - ANSYS Advantage - V11 I3

Data center servers, storage and networking equipment communicate over copper and optical cable assemblies joined by ever-faster connectors. Samtec leverages a comprehensive suite of simulation software from ANSYS to design and optimize next-generation, high-performance interconnect solutions across the entire signal channel.

Author: Samtec, Inc. Type: Article Date:
Product Name: ANSYS HPC, ANSYS SIwave
Product Category: Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing, Electronics - Cooling, Electronics - Signal Integrity


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Ensuring Electromagnetic Compatibility - Article - ANSYS Advantage - V11 I3

STMicroelectronics has developed a workflow that combines full-wave frequency domain with circuit simulation to determine electromagnetic interference / electromagnetic compatibility and electromagnetic coexistence issues before physical prototyping. The new approach has been proven to identify and fix, early in the design process, issues that could otherwise delay the product launch by up to four months or 20 percent of the development time.

Author: STMicroelectronics Type: Article Date:
Product Name: ANSYS HFSS, ANSYS HPC
Product Category: Electronics, High Performance Computing


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Tuning in to Antenna Design - Article - ANSYS Advantage - V11 I3

Using engineering simulation, big compute and 3-D printing, Optisys achieves orders-of-magnitude reduction in antenna size and weight while reducing development time. By leveraging ANSYS electromagnetic and structural simulation tools running on Rescale’s big compute platform, this startup’s engineers take full advantage of the design freedom offered by 3-D printing to meet radio frequency (RF) performance requirements for an integrated array antenna.

Author: Optisys, LLC Type: Article Date:
Product Name: ANSYS Mechanical, ANSYS HFSS, ANSYS HPC
Product Category: Structures, Electronics, Electronics - High Frequency Electromagnetics, High Performance Computing


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