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Electro-Thermal Analysis Using Icepak in ANSYS Electronics Desktop

With the native integration of ANSYS Icepak into the ANSYS Electronics Desktop, ANSYS users can now benefit from a highly streamlined electromagnetic-thermal analysis workflow that promotes better collaboration between electrical and thermal engineers. With seamless coupling between Icepak and the ANSYS Electromagnetic (EM) tool suite, accurate and detailed heat losses, determined by EM calculations, can be easily included in the thermal calculations via intuitive right-click operations.

View this on-demand webinar for an overview of ANSYS AEDT Icepak and get a panoramic feel for performing electromagnetic-thermal analysis using ANSYS Electronics Desktop.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Electronics Desktop
Product Category: Electronics


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Radar Cross Section Analysis with ANSYS HFSS SBR+ - Webinar

ANSYS 19 introduces radar cross section (RCS) calculations into the ANSYS Electronics Desktop integrated HFSS SBR+ solver. RCS simulation uses ANSYS’ industry-leading shooting-and-bouncing ray plus (SBR+) method to predict far-field radar signatures for 3D target models. The powerful and accurate asymptotic methods of HFSS SBR+ enable engineers and analysts to solve these computationally large simulations in record times. The speed and accuracy of RCS simulations will be a great asset for military and aerospace engineers designing applications such as advanced detection systems and stealth technology.

View this webinar detailing the new RCS analysis capability in HFSS SBR+.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS, ANSYS Electronics Desktop
Product Category: Electronics


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ANSYS Icepak 19 Product Update - Webinar

Electronic devices today contain many more components within a much smaller form factor than ever before. Even though advances have been made with smaller processor technologies to decrease power draw, the need to predict heat dissipation is now as important as the electrical design itself. More and more layout designs are being done alongside thermal analysis.

View this webinar to learn how ANSYS 19 integrates the ANSYS Icepak electronics cooling product directly into the ANSYS Electronics Desktop. This advancement modernizes and enhances the workflow that our electronics customers are already using. It opens new possibilities for component and system-level multiphysics, automation and robust design. Icepak is in the Electronics Desktop alongside ANSYS HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother, more robust overall workflow for thermal analysis coupled to electromagnetics. Learn about Improvements to the SIwave <--> Icepak solution for ECAD, including automated report generation that helps maximize customer design efficiency. 

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Electronics Desktop
Product Category: Electronics, Electronics - Cooling


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La conception d'antennes dans leur environnement avec la version ANSYS 17.2 - Webinar

Ce webinar aborde la simulation d'antennes dans leur environnement, l'intégration des circuits électroniques avec les antennes ainsi que la simulation d'antennes réseau sur plateforme.

Ce webinar illustre également les nouveautés de la version ANSYS 17.2 comme les ports à impédance complexe, le gain système et l'exposition de ANSYS SAVANT et ANSYS EMIT dans ANSYS Electronics Desktop.

Author: ANSYS Type: Webinar Date:
Product Name: Savant, EMIT, ANSYS Electronics Desktop


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