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Engineering Smarter Connected Products for Winning in the Digital Economy - eBook

The Internet of Things (IoT) represents an eleven trillion dollar opportunity. The opportunity will only be fully realized if engineers use best practices to design robust and reliable products. In this e-book we explain the critical design challenges for designing smarter connected products and how ANSYS solutions can help.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS Mechanical, ANSYS RedHawk
Industry: High Tech, Healthcare - BioMed, Aerospace and Defense, Automotive, Energy


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系统感知型SoC的功耗、噪声和可靠性验收

在全球竞争激烈的移动、消费类和汽车电子系统市场中,低功耗、高性能以及高可靠性是至关重要的成功因素。为了应对这些相互冲突的要求,设计团队需要面面俱到地考虑多种方案,例如采用高级工艺技术节点,尤其是基于FinFET的器件。这些高级技术节点让芯片不仅能在更低功耗下以更快的速度运行,同时还可在相同尺寸的硅片中集成更多功能。但是,在这些工艺节点上,由于器件的物理特性、尺寸和形状以及互联等因素,在进行功耗、噪声和可靠性验收时会遇到严重问题。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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使用ANSYS RedHawk-CPA进行芯片封装协同分析

ANSYS RedHawk-CPA是一款集成型芯片封装协同分析解决方案,其可利用ANSYS RedHawk实现快速准确的封装布局建模,充分满足片上电源的完整性仿真需求。有了RedHawk-CPA,设计人员可分别遵循Redhawk的静态和动态分析,来执行封装布局的静态IR压降分析和AC热点分析。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductor Design


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ANSYS RedHawk - White Paper

With integrated circuits (ICs) driving everything from high-performance computing and communications to automotive, health care and industrial, it is paramount to ensure power integrity and reliability of those ICs. ANSYS RedHawk as Industry’s leading solution for power, noise, and reliability sign-off, and with over 1000s of customer designs in production, offers you the least risk.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Electronics


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A Methodology for Comprehensive and Productive Power Noise and Reliability Closure for Advanced SoC Designs - White Paper

One of the key technology trends driving the semiconductor industry is the adoption of FinFET processes. As opposed to a traditional planar transistor, the FinFET has an elevated channel or 'fin', which the gate wraps around. Due to their structure, FinFETs consume much lower leakage power and allow greater device density. Compared to planar transistors, FinFETs operate at a lower voltage and offer higher drive current. All of these properties lead to lower circuit delay, lower leakage and higher performance packed into a smaller area. This also means that FinFETs offer reduced cost per unit performance. Designing a complex SoC using advanced FinFET-based technologies for first pass silicon success requires proven tools and methodology.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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Chip-Package Co-analysis Using ANSYS RedHawk-CPA - White Paper

ANSYS RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using ANSYS RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliable supply of power, and stable voltage levels at the transistor connection points, the entire system power delivery network (PDN) must be optimized and validated, including the impact of package on a chip.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: Automotive, High Tech


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System-Aware SoC Power, Noise and Reliability Sign-off - White Paper

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate faster at lower power and to pack more functionality within the same size of silicon. In these process nodes, however, power, noise and reliability sign-off create significant problems arising out of the physics, size and shape of the devices and interconnects.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors


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