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HFSS Regions in SIwave – Best of Both Worlds

HFSS Regions in SIwave is a hybrid solution technique to obtain 3D full-wave accuracy for the S-parameters of critical nets on a printed circuit board. To demonstrate this feature, a very large PCB, 60 cm long and 42 cm wide, with 20 metal layers is used in ANSYS SIwave. High-speed differential pairs are identified on the PCB and region extents are created for the 3D discontinuities. Everything else is executed in an automated fashion in SIwave and the board is simulated with and without HFSS Regions. This whitepaper will help you develop a solid understanding of this feature.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave
Product Category: Electronics


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Engineering Smarter Connected Products for Winning in the Digital Economy - eBook

The Internet of Things (IoT) represents an eleven trillion dollar opportunity. The opportunity will only be fully realized if engineers use best practices to design robust and reliable products. In this e-book we explain the critical design challenges for designing smarter connected products and how ANSYS solutions can help.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS Mechanical, ANSYS RedHawk
Industry: High Tech, Healthcare - BioMed, Aerospace and Defense, Automotive, Energy


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新型埋容材料印刷电路板的仿真和设计

通过将采用埋容材料的多层电路板与采用传统FR-4材料的传统多层电路板进行比较,可仿真和测量新型埋容材料对电源完整性(PI)、信号完整性(SI)以及电磁兼容性(EMC)的影响。SIwave软件可用于在高达4GHz的频率下仿真埋容材料电路板和传统FR-4材料电路板的电气属性和EMC。最后,我们将分析埋容材料的应用前景。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS SIwave
Industry: Consumer Products


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ANSYS SIwave-CPA应用简介

ANSYS SIwave-CPA采用3D快速有限元电磁场求解器提取芯片封装和PCB的RLCK模型。本文包含CPA求解器功能介绍和关键设置指导。此提取功能可作为ANSYS SIwave的附加求解器,也可以独立购买使用。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS SIwave
Industry: High Tech


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高性能电子设计: 预测电磁干扰

在当今竞争激烈的市场中设计电子产品时,满足电磁兼容性(EMC)要求存在一个重要的危险因素,尤其是因为很小的机会也对企业成功至关重要。为精确仿真电子系统的EMI特性,ANSYS提供了同类最佳的工具和已经验证的方法。

这有助于为开发团队提供充分信息、在提交管理认证之前很好地进行设计修改。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS SIwave
Product Category: Electronics, Electronics - Signal Integrity
Industry: High Tech
Sub Industry: Electrical and Electronics


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从信号完整性到产品完整性

我们正处在以电子产品为中心的创新浪潮中,这场浪潮已经改变了我们通信、工作、学习与娱乐的方式。基本上没有产品能够置身于这场创新浪潮之外。在世界各地,无论是您的家中还是办公室里,无论是显而易见的应用还是不太明显的应用,总会有超级智能手机、光纤与无线网络、口袋式计算机、仿真纸张的LED显示屏幕乃至宠物追踪芯片的存在。21世纪的汽车充斥着电子通信设备,它们能够控制发动机功能,防止轮胎打滑,帮助避免事故,和指导我们的旅行路线。航空电子设备则包括雷达、电传操纵系统和机载通信系统。电子创新在工业应用和军事应用中得到了广泛应用。智能电子产品正在重塑从无库存生产到国土安全在内的各个方面。显而易见的是,这些设备正在影响我们的生活品质。但我们不太了解的是这些互联产品如何被开发出来以及它们如何影响我们的安全。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS SIwave
Product Category: Electronics - Signal Integrity
Industry: Consumer Products, High Tech


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Fast-Tracking Advanced Driver Assistance Systems (ADAS) and Autonomous Vehicles Development with Simulation

ADAS and autonomous vehicles will soon be transforming our world. Due to the complexity of this immense engineering challenge, manufacturers now realize producing a reliable autonomous vehicle requires millions of miles of road testing—as onboard computers must be trained, not programmed. A seemingly impossible task.

These same companies also recognize simulation as the only method to test and iterate millions of possible scenarios. Perhaps most impressively, simulation modeling provides greater precision, faster results and significant cost savings.

Download the white paper to learn:

  • Ways of leveraging simulation in autonomous vehicles and ADAS development
  • Simulation examples, benefits and tools
  • A roadmap for simulation implementation

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Simplorer, ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS EKM, ANSYS Mechanical
Industry: Automotive


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Turning Signal Integrity Simulation Inside Out

DesignCon is the premier conference on high-speed electronics at the chip, package and system level. Held annually in the heart of Silicon Valley, it brings together top design engineers, researchers and industry executives who drive the frontier of electronics. At the conference Dr. Zoltan Cendes, the founder of Ansoft Corporation (acquired by ANSYS in 2008) and a Life Fellow of IEEE, delivered a keynote presentation on how signal integrity (SI) simulation has been turned inside out with electromagnetic (EM) field simulation.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave
Product Category: Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Electronics, Electronics - Electromechanical
Sub Industry: Semiconductors


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High-Performance Electronic Design - Predicting Electromagnetic Interference - White Paper

In designing electronics in today’s highly competitive markets, meeting requirements for electromagnetic compatibility (EMC) presents a major risk factor, especially since small windows of opportunity are critical to business success. ANSYS provides best-in-class tools and a proven methodology for accurately simulating EMI characteristics of electronic systems. This benefi ts development teams by providing insight to implement design modifi cations well before regulatory certifi cation submission.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS SIwave, ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics


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Integrated Chip–Package–System Simulation: The Complete Electronics Solution from ANSYS and Apache - White Paper

With electronic systems evolving at a rapid pace, chip designs become increasingly complex, even for mundane tasks. The challenge is managing design specifications (performance) and margins (price) while meeting the demands of a rapidly changing market. Solutions to these engineering challenges rely on accurate, predictive simulation software. ANSYS and Apache Design together offer electronics customers a simulation-driven chip–package–system development methodology that is multiscale, multiphysics and multiuser.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Icepak, ANSYS PowerArtist, ANSYS Sentinel, ANSYS Totem, ANSYS SIwave, ANSYS Designer, ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Semiconductors, Electronics - Cooling
Industry: High Tech


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