Save Query
Load Query

Narrow Your Search

Language

Resource Type

Product Category

Product Name

Industry

Sub Industry

Show Results
1 - 9 Of 9 Results
1
Arrow

ANSYS 5G Mobile/UE Solutions

ANSYS simulation software for 5G provides a compelling set of design solutions from mobile user equipment to networks and beyond. Simulation applications include electronics thermal management, advanced RF front-end design, and radio desensitization and EMI issues in 5G Smartphones. Download this white paper to learn more.

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS Icepak, EMIT, ANSYS RF Option
Product Category: Electronics
Sub Industry: Electrical and Electronics


Request
Arrow

Engineering Smarter Connected Products for Winning in the Digital Economy - eBook

The Internet of Things (IoT) represents an eleven trillion dollar opportunity. The opportunity will only be fully realized if engineers use best practices to design robust and reliable products. In this e-book we explain the critical design challenges for designing smarter connected products and how ANSYS solutions can help.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS Mechanical, ANSYS RedHawk
Industry: High Tech, Healthcare - BioMed, Aerospace and Defense, Automotive, Energy


Request
Arrow

卓越仿真成就创新型电子设计

我们正处在以电子技术为中心的创新繁荣期,我们的通信、工作、学习和娱乐方式也因为这些创新而改变。技术的创新发展会影响几乎所有的产品。在全球范围内,看得见和看不见的电子应用有很多,其中包括非常智能的手机、光纤和无线网络、可以装在口袋里的计算机、能模拟纸张的LED显示屏以及宠物追踪芯片。进入第二个千禧年后,汽车中配备了各类电子设备,以此来控制发动机功能,防止车轮打滑,避免发生事故,以及指引行驶路线等。航空电子设备包括雷达、电传操纵系统和机载通信。电子技术创新已经应用到了工业和军事领域:智能电子产品正在重新定义一切事物,从准时制生产到国土安全。这些设备对我们的生活质量产生了明显影响。然而,互联产品已经发展到何种程度,又将如何影响我们的安全,这些还有待我们去发现。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Electronics Desktop, ANSYS Electronics HPC, ANSYS Icepak, ANSYS Maxwell, ANSYS HFSS
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - Integrated Circuits
Industry: High Tech
Sub Industry: Electrical and Electronics


Request
Arrow

电子器件电源与热管理:新一代无人机面临的重大工程挑战

无人机在世界各地的军事行动中已上升到显著的地位,今后十年的趋势是打造出更加复杂的系统,并提升制导控制、武器和侦察方面的能力。高度复杂的系统要求在极为有限的空间内集成大量的电子元件。这会带来前几代电子系统未曾遇到过的电源和热管理难题。要取得成功,就必须要在设计流程的最初阶段就采用先进的电源和热管理策略,并评估从组件到系统各个层面的电源和热问题。本文将介绍一套综合而全面的工具与方法,有助于解决这些系统中遇到的电源和热管理难题。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Icepak, ANSYS Fluent, ANSYS Maxwell
Product Category: Electronics, Fluids
Industry: Consumer Products
Sub Industry: Aircraft


Request
Arrow

高级电子冷却系统的评估方法

根据摩尔定律预测,微处理器功耗会稳步上升。另外,当前技术也在不断支持特征尺寸显著降低,从而导致晶片中局部热通量大幅增加。如果当前趋势保持不变,据估计最终会达到100W/cm2的功率密度。事实上硬件制造商已经把双核处理器技术视为盈利之路。在特定情况下,配备2个2.5GHz核的处理器在性能上会超过配备单个3.5GHz处理器的芯片。标准半导体的温度越高,其性能可靠性与预期使用寿命就会越低。这个反比例是指数性而非线性,其意味着仅仅降低芯片温度就会同时对性能和耐用性产生显著影响。由于最终散热器温度和环境空气温度不变,因此只有通过引入高级冷却系统才能消除不断增加的热通量,同时保持相同的结点到环境温度。相关例子包括主动式散热器、喷射冲击、微通道冷却、热管、沉浸冷却和喷淋冷却。这些系统虽然散热率出色,但是会给设计人员带来更棘手的难题,而且需要创新的设计与分析工具。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Fluent, ANSYS Icepak
Product Category: Electronics - Cooling


Request
Arrow

Fast-Tracking Advanced Driver Assistance Systems (ADAS) and Autonomous Vehicles Development with Simulation

ADAS and autonomous vehicles will soon be transforming our world. Due to the complexity of this immense engineering challenge, manufacturers now realize producing a reliable autonomous vehicle requires millions of miles of road testing—as onboard computers must be trained, not programmed. A seemingly impossible task.

These same companies also recognize simulation as the only method to test and iterate millions of possible scenarios. Perhaps most impressively, simulation modeling provides greater precision, faster results and significant cost savings.

Download the white paper to learn:

  • Ways of leveraging simulation in autonomous vehicles and ADAS development
  • Simulation examples, benefits and tools
  • A roadmap for simulation implementation

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Simplorer, ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS Mechanical
Industry: Automotive


Request
Arrow

Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages - White Paper

This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS. This approach can be utilized for all electrical CAD (ECAD) types such as IC packages, touch panel displays, and glass and silicon interposers. The authors followed this reference design flow for analyzing a PCB virtual prototype used in the consumer electronics industry. The design flow details nearly all aspects of the modeling technique from studying electrical connections in a schematic and setting up the PCB to analyzing the electrical, thermal and mechanical characteristics of the board — all using ANSYS tools. The multiphysics simulation yields power losses across the entire board and its objects, determines whether the integrated circuit (IC) and overall board temperatures lie within safe operating limits and predicts overall PCB reliability, taking into account all its components and heat sinks.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS Icepak
Product Category: Electronics, Electronics - Cooling, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity


Request
Arrow

Multiphysics Simulations of an Energy Efficient IoT-Based Smart Home - White Paper

Smart homes are the future of living where home appliances can communicate and be remotely controlled for an improved user experience. In this work, a home model is analyzed to demonstrate an energy efficient IoT based smart home.

Author: Type: White Paper Date:
Product Name: ANSYS Icepak, ANSYS Fluent, ANSYS Mechanical, ANSYS HFSS, ANSYS CFD
Product Category: Fluids, Electronics - High Frequency Electromagnetics, Structures
Industry: High Tech, Construction, Energy
Sub Industry: Appliances, Building HVAC, Consumer Electronics, HVAC Equipment


Request
Arrow

Integrated Chip–Package–System Simulation: The Complete Electronics Solution from ANSYS and Apache - White Paper

With electronic systems evolving at a rapid pace, chip designs become increasingly complex, even for mundane tasks. The challenge is managing design specifications (performance) and margins (price) while meeting the demands of a rapidly changing market. Solutions to these engineering challenges rely on accurate, predictive simulation software. ANSYS and Apache Design together offer electronics customers a simulation-driven chip–package–system development methodology that is multiscale, multiphysics and multiuser.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Icepak, ANSYS PowerArtist, ANSYS Sentinel, ANSYS Totem, ANSYS SIwave, ANSYS Designer, ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Semiconductors, Electronics - Cooling
Industry: High Tech


Request
1 - 9 Of 9 Results
1
 

click below to start a conversation with ANSYS

Contact Us
Contact Us
Contact