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Elastic Compute Scalable Design Methodologies for Next-Generation FPGAs

Next-generation field programmable gate arrays (FPGAs) for 5G, AI, automotive, cloud and data center applications are getting bigger, faster and more complex. With the market’s continuous demand for higher performance and lower power products, FPGA designers strive hard to achieve stringent power, performance, area and reliability goals to stay ahead of the game. Traditional electronic design automation (EDA) techniques for full-chip critical path timing analysis and power integrity signoff cannot meet the capacity, performance and accuracy requirements for these complex FPGAs. Productivity and project schedules are negatively impacted as a result.

In this webinar, FPGA inventor Xilinx discusses the many applications for its innovative elastic compute scalable design methodologies, including:

  • Large design scaling for timing analysis using ANSYS SeaScape
  • Full-chip EM/IR signoff using ANSYS RedHawk-SC
  • Accelerated chip-scale interconnect delay calculation for timing capture flow using ANSYS Path FX

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Semiconductors, Cloud and IT Solutions
Industry: Automotive


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Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

Automotive electronics systems depend on an ever-increasing number of electronic sensors and processing elements, which allow for 360-degree surveillance and object identification/classification. Designing and verifying these systems is, however, as complex as the systems themselves.

This white paper examines how automotive chip designers can achieve the stringent safety and reliability requirements for advanced FinFET designs. It explores analysis solutions for electromigration reliability (EM), electrostatic discharge (ESD), thermal reliability, statistical electromigration budgeting (SEB) and functional safety.

Author: ANSYS, Inc. Type: White Paper Date:
Product Category: Semiconductors, Multiphysics
Industry: Automotive


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eSilicon Uses ANSYS Multiphysics Simulations to Achieve Silicon to System Success

Watch this video to learn how eSilicon is using ANSYS multiphysics solutions to ensure silicon to system success and drive time-to-market acceleration for its high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure customers. Michael Gianfagna (Vice President, Marketing) and Teddy Lee (Architect, Signal and Power Integrity) of eSilicon explain how ANSYS simulation solutions are critical to meeting the increasingly stringent specifications of their system-in-package designs across all applications.

Author: ANSYS, Inc. Type: Testimonials Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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ANSYS RaptorX Datasheet

ANSYS RaptorX is a novel, pre-LVS EM modeling software for the electromagnetic expert and the IC design engineer. The limitless capacity of its engine, in combination with highly accurate results and blazing fast modeling times, differentiates it from currently available, traditional EM tools.

Author: ANSYS Inc. Type: Brochure Date:
Product Name: ANSYS RaptorX
Product Category: Semiconductors
Sub Industry: Semiconductors


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ANSYS Exalto Datasheet

ANSYS Exalto is a powerful post-LVS RLCk extraction software for IC design engineers. It enables accurate prediction of electromagnetic coupling effects during the signoff phase.

Author: ANSYS Inc. Type: Brochure Date:
Product Name: ANSYS Exalto
Product Category: Semiconductors
Sub Industry: Semiconductors


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ANSYS VeloceRF Datasheet

ANSYS VeloceRF is an inductive device compiler and modeling tool that solves some of your most complex challenges for as low as 5nm geometries.

Author: ANSYS Inc. Type: Brochure Date:
Product Name: ANSYS VeloceRF
Product Category: Semiconductors
Sub Industry: Semiconductors


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Differential Energy Analysis to Optimize Mobile GPU Power

Operating power has become one of the most important metrics for modern electronic devices. Qualcomm Technologies, a world-class mobile solution provider, significantly reduced power consumption in an already challenging market by performing power analysis at RTL using ANSYS PowerArtist. Qualcomm Technologies was able to reduce dynamic power by 10 percent through this approach.

Author: ANSYS Inc. Type: White Paper Date:
Product Name: ANSYS PowerArtist, ANSYS RedHawk
Product Category: Semiconductors
Sub Industry: Electrical and Electronics


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Leveraging Chip Power Models for System-Level EMC Simulation of Automotive ICs

The design of integrated circuits (ICs) for electromagnetic compatibility (EMC) is a fundamental requirement for the security and safety of automotive electronics systems. These must be tested for noise emission, electromagnetic interference (EMI) and for electromagnetic susceptibility (EMS) with intentional radio frequency (RF) disturbance. To achieve safety goals, chip power model (CPM) simulation is extended to evaluate the creation of noise from ICs and to capture the response of ICs to RF disturbance. This is done by leveraging the ANSYS chip ESD compact model (CECM) that captures the snapback current-voltage transfer characteristics of the ESD protection devices, silicon substrate coupling around the devices and also the chip-package-printed circuit board (PCB) interaction. The measurements and simulation are demonstrated with silicon test chips.

In this on-demand webinar,  Karthik Srinivasan, senior product manager from ANSYS and Dr. Makoto Nagata from Kobe University, Japan, will demonstrate how integrated circuit (IC), package and board designers can leverage ANSYS chip models in system-level simulations to meet the strict EMC requirements.

Author: ANSYS, Inc Type: Webinar Date:
Product Category: Semiconductors
Industry: Automotive


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Addressing Multiphysics Challenges in 7nm FinFET Designs

Variability has become the new enemy in 7nm FinFET designs. You can’t fix what you can’t find, and variability takes many forms (e.g., voltage drop, temperature, process). Increased cross-coupling of various multiphysics effects such as timing, power and thermal in 7nm designs poses significant challenges for design closure. Traditional solutions using margin-based methodologies are inadequate. Increased variability makes it hard to predict true silicon behavior and impacts both time-to- result (TTR) and time-to-market (TTM) goals in complex design projects.

View this on-demand webinar to learn how ANSYS multiphysics simulations can address the different forms of variability and their impact on performance. With an understanding of the true limits of built-in margins, you can achieve the target maximum frequency on silicon, while drastically improving the functional yield of your chips.

Author: ANSYS Type: Webinar Date:
Product Category: Semiconductors


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Shifting Left with ANSYS - ANSYS Advantage - V13 I1

In 2017, Synopsys® and ANSYS partnered to take the best of ANSYS’ power integrity and reliability offerings and create an integrated flow with Synopsys implementation to drive robust semiconductor design optimization. Following the release of RedHawk Analysis Fusion by Synopsys in 2018, customers have shared positive feedback on productivity and design quality impact that have helped drive further innovations on this platform. We sat down with John Lee, vice president and general manager of the semiconductors division at ANSYS, and Jacob Avidan, senior vice president of signoff products at Synopsys, to get their views on the results of this collaboration and how the ANSYS–Synopsys collaboration helps address the challenges of emerging technologies.

Author: Synopsys Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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