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eSilicon Uses ANSYS Multiphysics Simulations to Achieve Silicon to System Success

Watch this video to learn how eSilicon is using ANSYS multiphysics solutions to ensure silicon to system success and drive time-to-market acceleration for its high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure customers. Michael Gianfagna (Vice President, Marketing) and Teddy Lee (Architect, Signal and Power Integrity) of eSilicon explain how ANSYS simulation solutions are critical to meeting the increasingly stringent specifications of their system-in-package designs across all applications.

Author: ANSYS, Inc. Type: Testimonials Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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ANSYS RaptorX Datasheet

ANSYS RaptorX is a novel, pre-LVS EM modeling software for the electromagnetic expert and the IC design engineer. The limitless capacity of its engine, in combination with highly accurate results and blazing fast modeling times, differentiates it from currently available, traditional EM tools.

Author: ANSYS Inc. Type: Brochure Date:
Product Name: ANSYS RaptorX
Product Category: Semiconductors
Sub Industry: Semiconductors


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ANSYS Exalto Datasheet

ANSYS Exalto is a powerful post-LVS RLCk extraction software for IC design engineers. It enables accurate prediction of electromagnetic coupling effects during the signoff phase.

Author: ANSYS Inc. Type: Brochure Date:
Product Name: ANSYS Exalto
Product Category: Semiconductors
Sub Industry: Semiconductors


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ANSYS VeloceRF Datasheet

ANSYS VeloceRF is an inductive device compiler and modeling tool that solves some of your most complex challenges for as low as 5nm geometries.

Author: ANSYS Inc. Type: Brochure Date:
Product Name: ANSYS VeloceRF
Product Category: Semiconductors
Sub Industry: Semiconductors


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Differential Energy Analysis to Optimize Mobile GPU Power

Operating power has become one of the most important metrics for modern electronic devices. Qualcomm Technologies, a world-class mobile solution provider, significantly reduced power consumption in an already challenging market by performing power analysis at RTL using ANSYS PowerArtist. Qualcomm Technologies was able to reduce dynamic power by 10 percent through this approach.

Author: ANSYS Inc. Type: White Paper Date:
Product Name: ANSYS PowerArtist, ANSYS RedHawk
Product Category: Semiconductors
Sub Industry: Electrical and Electronics


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Leveraging Chip Power Models for System-Level EMC Simulation of Automotive ICs

The design of integrated circuits (ICs) for electromagnetic compatibility (EMC) is a fundamental requirement for the security and safety of automotive electronics systems. These must be tested for noise emission, electromagnetic interference (EMI) and for electromagnetic susceptibility (EMS) with intentional radio frequency (RF) disturbance. To achieve safety goals, chip power model (CPM) simulation is extended to evaluate the creation of noise from ICs and to capture the response of ICs to RF disturbance. This is done by leveraging the ANSYS chip ESD compact model (CECM) that captures the snapback current-voltage transfer characteristics of the ESD protection devices, silicon substrate coupling around the devices and also the chip-package-printed circuit board (PCB) interaction. The measurements and simulation are demonstrated with silicon test chips.

In this on-demand webinar,  Karthik Srinivasan, senior product manager from ANSYS and Dr. Makoto Nagata from Kobe University, Japan, will demonstrate how integrated circuit (IC), package and board designers can leverage ANSYS chip models in system-level simulations to meet the strict EMC requirements.

Author: ANSYS, Inc Type: Webinar Date:
Product Category: Semiconductors
Industry: Automotive


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Addressing Multiphysics Challenges in 7nm FinFET Designs

Variability has become the new enemy in 7nm FinFET designs. You can’t fix what you can’t find, and variability takes many forms (e.g., voltage drop, temperature, process). Increased cross-coupling of various multiphysics effects such as timing, power and thermal in 7nm designs poses significant challenges for design closure. Traditional solutions using margin-based methodologies are inadequate. Increased variability makes it hard to predict true silicon behavior and impacts both time-to- result (TTR) and time-to-market (TTM) goals in complex design projects.

View this on-demand webinar to learn how ANSYS multiphysics simulations can address the different forms of variability and their impact on performance. With an understanding of the true limits of built-in margins, you can achieve the target maximum frequency on silicon, while drastically improving the functional yield of your chips.

Author: ANSYS Type: Webinar Date:
Product Category: Semiconductors


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Shifting Left with ANSYS - ANSYS Advantage - V13 I1

In 2017, Synopsys® and ANSYS partnered to take the best of ANSYS’ power integrity and reliability offerings and create an integrated flow with Synopsys implementation to drive robust semiconductor design optimization. Following the release of RedHawk Analysis Fusion by Synopsys in 2018, customers have shared positive feedback on productivity and design quality impact that have helped drive further innovations on this platform. We sat down with John Lee, vice president and general manager of the semiconductors division at ANSYS, and Jacob Avidan, senior vice president of signoff products at Synopsys, to get their views on the results of this collaboration and how the ANSYS–Synopsys collaboration helps address the challenges of emerging technologies.

Author: Synopsys Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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Speeding 5G Network Infrastructure Design - ANSYS Advantage - V13 I1 - Article

As the world becomes more connected and digital, the need for more data and higher speed is evident. The increase in global internet traffic, along with decentralization of cloud and data centers, has driven wired and wireless networks to support 5G network infrastructures. 5G technology promises to enable 1,000 times more traffic, 10 times faster speed, and a 10 times increase in throughput. These systems are highly complex and push the boundaries of silicon and manufacturing technologies. eSilicon uses ANSYS’ chip-package-system modeling and simulation software in a design-and-verification methodology that serves this ever-evolving market with timeliness and precision.

Author: eSilicon Corporation Type: Article Date:
Product Name: ANSYS HFSS, ANSYS RedHawk, ANSYS SIwave
Product Category: Electronics - High Frequency Electromagnetics, Semiconductors, Electronics - Signal Integrity
Industry: High Tech
Sub Industry: Semiconductors, Semiconductor Design


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IP Design Exchange Format for FMEDA and Fault Injection (IPD-XML) - Brochure

A key challenge for complex semiconductor chips is to pass safety and reliability assessments for application in safety and mission-critical systems. Safety standards, such as IEC 61508, ISO 26262, ARP4761, EN 50126 and others, have identified failure mode, effects and diagnostic analysis (FMEDA) as the state-of-the-art method to assess and quantify the failure characteristics of an integrated circuit (IC).

With the advent of ISO/PAS 19451 (2016) and the corresponding ISO 26262, Part 11: “Guidelines on application of ISO 26262 to semiconductors” (2018), a detailed approach exists to perform FMEDA in the context of automobile systems.

This technical specification document details how ANSYS medini analyze can be used to meet these requirements for semiconductors.

Author: ANSYS, Inc. Type: Brochure Date:
Product Name: ANSYS medini analyze
Product Category: Semiconductors


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