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Receiver Desense Analysis and Mitigation for Consumer Electronics

Learn the basics of receiver desensitization and power flow analysis using ANSYS electromagnetic, circuit and system tools to investigate and identify unexpected sources of radio frequency interference (RFI). In this on-demand webinar, you’ll also learn to apply system-level RFI analysis to understand how sensitivity degradation impacts radio performance and explore potential mitigation measures. This webcast will be especially relevant for designers of consumer electronics and IoT sensors that incorporate a mix of digital sources, which can interfere with one or more on-board wireless transceivers.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics
Sub Industry: Consumer Electronics


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ANSYS HFSS SBR+ for Large Target Radar Signature Analysis

ANSYS HFSS SBR+ is a high-frequency solver for modeling high-frequency electromagnetic (EM) scattering from electrically large structures. Shawn Carpenter, senior product manager for high-frequency electronics  will present the best-practice workflow for using the HFSS SBR+ solver within the ANSYS Electronics Desktop to simulate the radar cross section (RCS) of large targets. In addition to RCS, Shawn will demonstrate the use of the ANSYS toolkit to produce range/echo profiles, time-domain waterfall plots and inverse synthetic aperture radar (ISAR) images for pinpointing localized centers of radar scattering.

Presenter:
Shawn Carpenter is a senior product manager for radio frequency (RF) products with ANSYS, and has responsibility over product strategy and customer solutions involving installed performance modeling of antennas in electrically large environments, large target radar signature analysis, advanced driver-assistance systems (ADAS) radar sensor modeling and RF system cosite interference analysis. He served as vice president of marketing and sales for Delcross Technologies, before it was acquired by ANSYS in 2015. Shawn holds a B.S.E.E. from the University of Minnesota and an M.S.E.E. from Syracuse University, and has over 25 years of experience in applications, marketing and sales of high-frequency electromagnetic and RF system analysis electronic design automation (EDA) software. He has also served as vice president of marketing and sales at Sonnet Software, and as a senior microwave and radar systems engineer with GE Aerospace.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics


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ANSYS Mechanical Solutions for Electronics Reliability - Webinar

With increasing demands being placed on modern electronics systems, it is imperative that engineers consider the common failure modes and scenarios when developing their products.

ANSYS provides a powerful set of tools to support you in improving your product’s performance and reliability. View this on-demand webinar to learn about common mechanical failure modes in electronic systems, and how ANSYS simulation solutions can be used to predict product performance and reliability in a variety of environments (thermal, vibration, humidity, etc.). With cutting edge modeling features such as trace modeling and industry-leading physics solvers, ANSYS can play a major role in your product development process.

Specifically, this on-demand webinar covers the following topics:
  • Modeling techniques for electronics systems (including trace mapping and submodeling)
  • Common failure modes in electronics systems (thermal, vibration, moisture)
  • Solder joint fatigue – life prediction techniques for solder ball connections
  • Shock, vibration and drop studies of electronic systems
  • Discussion of available ANSYS resources and getting started

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Structures, Electronics


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Ensuring the Power and Signal Integrity of Your High-Performance PCBS and Packages Using ANSYS SIwave - Webinar

ANSYS® SIwave is a specialized design platform for DC power and signal integrity, as well as EMI analysis of IC packages and PCBs.  Watch this video to learn how SIwave enables you to simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. Discover the new capability to automatically solve user-defined “3D” regions of packages and PCBs using ANSYS HFSS from within SIwave.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS SIwave, ANSYS HFSS
Product Category: Electronics


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Radar Cross Section Analysis with ANSYS HFSS SBR+ - Webinar

ANSYS 19 introduces radar cross section (RCS) calculations into the ANSYS Electronics Desktop integrated HFSS SBR+ solver. RCS simulation uses ANSYS’ industry-leading shooting-and-bouncing ray plus (SBR+) method to predict far-field radar signatures for 3D target models. The powerful and accurate asymptotic methods of HFSS SBR+ enable engineers and analysts to solve these computationally large simulations in record times. The speed and accuracy of RCS simulations will be a great asset for military and aerospace engineers designing applications such as advanced detection systems and stealth technology.

View this webinar detailing the new RCS analysis capability in HFSS SBR+.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS, ANSYS Electronics Desktop
Product Category: Electronics


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ANSYS Maxwell 19 Product Update - Webinar

ANSYS Maxwell is our low-frequency electromagnetic field solver focused on the design of electric motors, actuators, transformers and other electromechanical devices. In ANSYS 19, Maxwell has been upgraded to include the modern look and feel of a ribbon-based interface.  In addition, new advanced analysis and automation features have been added for electric machine design. An integrated motor design toolkit and automated motor efficiency maps aid design set up and post-processing of transient electromagnetic solutions.

In this webinar, we will demonstrate how Maxwell has been upgraded with the new capability to simulate the effects of the manufacturing process on electrical steel. The electromagnetic characteristics of electrical steel change as they go through the process of forming core laminations through mechanical cutting or laser cutting. These characteristic changes can affect the simulated performance of the device. Join us to learn how our new algorithm ensures higher simulation accuracy of devices that utilize laminated cores, such as motors and transformers, and eliminates the need to manually calibrate the simulation with physical measurements.

View this webinar detailing all the significant advancements in Maxwell.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Maxwell
Product Category: Electronics, Multiphysics


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Winning in the Digital Economy - Engineering Smart, Connected Products, Operations and Services - Webinar

The digital economy presents a unique, never-before opportunity to connect humanity. The Internet of Things (IoT) and digital technologies (e.g., digital twins) are revolutionizing nearly every industry imaginable, and personalized healthcare, connected cars and wearable electronics are just a few of the many applications. Engineering simulation provides a competitive edge for companies looking to develop better products – faster.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Integrated Circuits, Electronics - Signal Integrity, Embedded Software, Electronics, Semiconductors
Industry: Healthcare - BioMed, High Tech, Consumer Products, Automotive
Sub Industry: Biomedical Devices, Computer and Storage Devices, Consumer Electronics, Diagnosis and Personalized Medicine, Electrical and Electronics, Household Goods, Mobile Computing


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ANSYS Icepak 19 Product Update - Webinar

Electronic devices today contain many more components within a much smaller form factor than ever before. Even though advances have been made with smaller processor technologies to decrease power draw, the need to predict heat dissipation is now as important as the electrical design itself. More and more layout designs are being done alongside thermal analysis.

View this webinar to learn how ANSYS 19 integrates the ANSYS Icepak electronics cooling product directly into the ANSYS Electronics Desktop. This advancement modernizes and enhances the workflow that our electronics customers are already using. It opens new possibilities for component and system-level multiphysics, automation and robust design. Icepak is in the Electronics Desktop alongside ANSYS HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother, more robust overall workflow for thermal analysis coupled to electromagnetics. Learn about Improvements to the SIwave <--> Icepak solution for ECAD, including automated report generation that helps maximize customer design efficiency.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Electronics Desktop
Product Category: Electronics, Electronics - Cooling


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Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems - Webinar

Design for reliability is a key consideration for the successful use of next-generation systems-on-chip (SoCs) in ADAS, infotainment and other critical automotive electronics systems. The SoCs manufactured with TSMC’s 16FFC process are advanced multicore designs with significantly higher levels of integration, functionality and operating speed. These SoCs must meet the rigorous requirements for automotive electronics functional safety and reliability.

Working together, ANSYS and TSMC have defined workflows that enable electromigration, thermal and ESD verification and signoff across the design chain (IP to SoC to package to system). Within the comprehensive workflows, multiphysics simulations capture the various failure mechanisms and provide signoff confidence not only to guarantee first-time product success, but also to ensure regulatory compliance.

Attend this ANSYS and TSMC webinar to learn about ANSYS’ chip-package-system reliability signoff solutions for creating robust and reliable electronics systems for next-generation automotive applications, and to explore case studies based on TSMC’s N16FFC technology.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Electronics
Industry: Automotive


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ANSYS HFSS 19 Product Update - Webinar

ANSYS 19 introduces Radar Cross Section (RCS) calculations into the ANSYS Electronics Desktop integrated HFSS SBR+ solver. This capability is based on ANSYS’ industry- leading shooting-and-bouncing ray plus (SBR+) method to predict far-field radar signatures for 3-D target models. The powerful and accurate asymptotic methods of HFSS SBR+ allow our users to solve these computationally large simulations very quickly, and will be a great asset for design engineers working in military and aerospace applications, such as advanced detection systems and stealth technology. In addition, the continued integration of the SBR+ technology into the Electronics Desktop will enable comprehensive and accurate large-scale, near-field radar analysis for performing automotive radar simulation for ADAS and autonomous vehicle applications.

ANSYS HFSS and the Electronics Desktop are transformed with a new, intuitive ribbon-based interface. This new modern look and feel streamlines and directs the simulation process and enables users with little or no simulation experience to set up and solve high-frequency electromagnetic field simulations with ease.

Along with the new user interface, we’ve added significant solver and HPC capability to the ANSYS HFSS product for greater value-add for our users. HFSS now includes our finite element transient, or time-domain-based, high-frequency EM solver to go along with the existing frequency domain-based solvers for finite elements and Method of Moments (MoM). In one package, HFSS delivers both frequency and time-domain finite element solvers along with 2.5-D and 3-D MoM technology. And, to deliver more computational power to our users, HFSS also includes as standard four computational cores that will add to existing HPC products and provide further simulation acceleration. Finally, the technology available with the electronics high-performance computing products can now be enabled with the broader ANSYS HPC products. With all these ANSYS 19 enhancements, HFSS delivers the most comprehensive set of solvers and HPC technologies in a single package on the market. Users can now perform more comprehensive design exploration through simulation using the accurate and reliable gold standard technology of HFSS.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics


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