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Ensuring the Power and Signal Integrity of Your High-Performance PCBS and Packages Using ANSYS SIwave - Webinar

ANSYS® SIwave is a specialized design platform for DC power and signal integrity, as well as EMI analysis of IC packages and PCBs.  Watch this video to learn how SIwave enables you to simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. Discover the new capability to automatically solve user-defined “3D” regions of packages and PCBs using ANSYS HFSS from within SIwave.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS SIwave, ANSYS HFSS
Product Category: Electronics


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Radar Cross Section Analysis with ANSYS HFSS SBR+ - Webinar

ANSYS 19 introduces radar cross section (RCS) calculations into the ANSYS Electronics Desktop integrated HFSS SBR+ solver. RCS simulation uses ANSYS’ industry-leading shooting-and-bouncing ray plus (SBR+) method to predict far-field radar signatures for 3D target models. The powerful and accurate asymptotic methods of HFSS SBR+ enable engineers and analysts to solve these computationally large simulations in record times. The speed and accuracy of RCS simulations will be a great asset for military and aerospace engineers designing applications such as advanced detection systems and stealth technology.

View this webinar detailing the new RCS analysis capability in HFSS SBR+.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS, ANSYS Electronics Desktop
Product Category: Electronics


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ANSYS Maxwell 19 Product Update - Webinar

ANSYS Maxwell is our low-frequency electromagnetic field solver focused on the design of electric motors, actuators, transformers and other electromechanical devices. In ANSYS 19, Maxwell has been upgraded to include the modern look and feel of a ribbon-based interface.  In addition, new advanced analysis and automation features have been added for electric machine design. An integrated motor design toolkit and automated motor efficiency maps aid design set up and post-processing of transient electromagnetic solutions.

In this webinar, we will demonstrate how Maxwell has been upgraded with the new capability to simulate the effects of the manufacturing process on electrical steel. The electromagnetic characteristics of electrical steel change as they go through the process of forming core laminations through mechanical cutting or laser cutting. These characteristic changes can affect the simulated performance of the device. Join us to learn how our new algorithm ensures higher simulation accuracy of devices that utilize laminated cores, such as motors and transformers, and eliminates the need to manually calibrate the simulation with physical measurements.

View this webinar detailing all the significant advancements in Maxwell.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Maxwell
Product Category: Electronics, Multiphysics


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Winning in the Digital Economy - Engineering Smart, Connected Products, Operations and Services - Webinar

The digital economy presents a unique, never-before opportunity to connect humanity. The Internet of Things (IoT) and digital technologies (e.g., digital twins) are revolutionizing nearly every industry imaginable, and personalized healthcare, connected cars and wearable electronics are just a few of the many applications. Engineering simulation provides a competitive edge for companies looking to develop better products – faster.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Integrated Circuits, Electronics - Signal Integrity, Embedded Software, Electronics, Semiconductors
Industry: Healthcare - BioMed, High Tech, Consumer Products, Automotive
Sub Industry: Biomedical Devices, Computer and Storage Devices, Consumer Electronics, Diagnosis and Personalized Medicine, Electrical and Electronics, Household Goods, Mobile Computing


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ANSYS Icepak 19 Product Update - Webinar

Electronic devices today contain many more components within a much smaller form factor than ever before. Even though advances have been made with smaller processor technologies to decrease power draw, the need to predict heat dissipation is now as important as the electrical design itself. More and more layout designs are being done alongside thermal analysis.

View this webinar to learn how ANSYS 19 integrates the ANSYS Icepak electronics cooling product directly into the ANSYS Electronics Desktop. This advancement modernizes and enhances the workflow that our electronics customers are already using. It opens new possibilities for component and system-level multiphysics, automation and robust design. Icepak is in the Electronics Desktop alongside ANSYS HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother, more robust overall workflow for thermal analysis coupled to electromagnetics. Learn about Improvements to the SIwave <--> Icepak solution for ECAD, including automated report generation that helps maximize customer design efficiency.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Electronics Desktop
Product Category: Electronics, Electronics - Cooling


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Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems - Webinar

Design for reliability is a key consideration for the successful use of next-generation systems-on-chip (SoCs) in ADAS, infotainment and other critical automotive electronics systems. The SoCs manufactured with TSMC’s 16FFC process are advanced multicore designs with significantly higher levels of integration, functionality and operating speed. These SoCs must meet the rigorous requirements for automotive electronics functional safety and reliability.

Working together, ANSYS and TSMC have defined workflows that enable electromigration, thermal and ESD verification and signoff across the design chain (IP to SoC to package to system). Within the comprehensive workflows, multiphysics simulations capture the various failure mechanisms and provide signoff confidence not only to guarantee first-time product success, but also to ensure regulatory compliance.

Attend this ANSYS and TSMC webinar to learn about ANSYS’ chip-package-system reliability signoff solutions for creating robust and reliable electronics systems for next-generation automotive applications, and to explore case studies based on TSMC’s N16FFC technology.

Author: ANSYS, Inc. Type: Webinar Date:
Product Category: Electronics
Industry: Automotive


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ANSYS HFSS 19 Product Update - Webinar

ANSYS 19 introduces Radar Cross Section (RCS) calculations into the ANSYS Electronics Desktop integrated HFSS SBR+ solver. This capability is based on ANSYS’ industry- leading shooting-and-bouncing ray plus (SBR+) method to predict far-field radar signatures for 3-D target models. The powerful and accurate asymptotic methods of HFSS SBR+ allow our users to solve these computationally large simulations very quickly, and will be a great asset for design engineers working in military and aerospace applications, such as advanced detection systems and stealth technology. In addition, the continued integration of the SBR+ technology into the Electronics Desktop will enable comprehensive and accurate large-scale, near-field radar analysis for performing automotive radar simulation for ADAS and autonomous vehicle applications.

ANSYS HFSS and the Electronics Desktop are transformed with a new, intuitive ribbon-based interface. This new modern look and feel streamlines and directs the simulation process and enables users with little or no simulation experience to set up and solve high-frequency electromagnetic field simulations with ease.

Along with the new user interface, we’ve added significant solver and HPC capability to the ANSYS HFSS product for greater value-add for our users. HFSS now includes our finite element transient, or time-domain-based, high-frequency EM solver to go along with the existing frequency domain-based solvers for finite elements and Method of Moments (MoM). In one package, HFSS delivers both frequency and time-domain finite element solvers along with 2.5-D and 3-D MoM technology. And, to deliver more computational power to our users, HFSS also includes as standard four computational cores that will add to existing HPC products and provide further simulation acceleration. Finally, the technology available with the electronics high-performance computing products can now be enabled with the broader ANSYS HPC products. With all these ANSYS 19 enhancements, HFSS delivers the most comprehensive set of solvers and HPC technologies in a single package on the market. Users can now perform more comprehensive design exploration through simulation using the accurate and reliable gold standard technology of HFSS.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics


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Enabling ESD Reliability Signoff for AMS IPs - Webinar

View this webinar to discover how ANSYS PathFinder can help you solve the challenges you face in trying to ensure ESD robustness in today’s AMS IPs. Watch a live demonstration of ANSYS PathFinder on an IP-level test case to highlight the benefits of a layout-based ESD integrity solution for resistance and current density checks.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS PathFinder
Product Category: Electronics


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ANSYS in ACTION: Enabling FinFET Thermal Reliability Signoff for IPs - Webinar

ANSYS Totem can solve the challenges faced by engineers trying to ensure thermal and electromigration (EM) reliability in advanced IPs. View this webinar to see a demonstration of self-heat analysis on an IP test case using ANSYS Totem’s rich GUI interface. The demonstration will cover flow setup, debugging and result exploration for reliability signoff.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Product Category: Electronics


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Enabling Power and Reliability Signoff for AMS Designs - Webinar

View this webinar to learn how ANSYS Totem can model and simulate the required power and reliability signoff checks for AMS designs. This presentation will demonstrate the benefits of using Totem to perform dynamic voltage drop and EM checks through its rich GUI interface, which can also be leveraged for debugging purposes.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Totem
Product Category: Electronics
Sub Industry: Electrical and Electronics


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