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ANSYS 2019 R1 SIwave Update

View this on-demand webinar to learn about the new capabilities available in ANSYS SIwave 2019 R1. The new release includes powerful new features for the design of high-speed electronics devices. New enhancements focus on signal integrity, power integrity and electromagnetic interference analysis including:
  • EMI Scanner – design rule check for EMI/EMC 
  • Electromigration analysis – calculate mean time to failure of metallization
  • High Performance Computing enhancements for faster simulation times

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS SIwave
Product Category: Electronics


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ANSYS 2019 R1 Icepak Update

View this on-demand webinar to learn about the new capabilities available in Icepak 2019.1. The new release includes powerful new features for the design of electronics cooling strategies and electro-thermal analysis. New features include:
  • Electro-thermal analysis — Two-way closed loop coupling between HFSS, Maxwell, Q3D Extractor and Icepak
  • Modeling of inclined PCB
  • DCIR EM loss coupling
Don’t miss this webinar detailing all the significant advancements in Icepak.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak
Product Category: Electronics


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ANSYS 2019 R1 Maxwell Update

View this on-demand webinar to learn about the new capabilities available in ANSYS Maxwell 2019 R1.

ANSYS Maxwell is our low frequency electromagnetic field solver focused on the design of electric motors, actuators, transformers and electromechanical devices.  New capabilities include a powerful noise-vibration-analysis (NVH) workflow, ability to generate full model post-processing from a partial model solution, new mesh density user controls and much more.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Maxwell
Product Category: Electronics


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Developing Next-generation Batteries with 3D Physics and Systems Modeling and Simulation

With the rising demand for ultra-low power design methodologies in power electronics and electric vehicle manufacturing, advances in battery technology have become increasingly important. To save time and costs associated with battery experimentation during R&D, modeling and simulation are essential.

Watch this on-demand webinar to learn how ANSYS Twin Builder can help:
  • Model battery cells using the new Modelica-based library’s equivalent circuit models (ECMs) with state of charge (SOC) or SOC temperature dependency.
  • Create 3D reduced order models (ROMs) in Twin Builder using 3D simulation data from ANSYS Fluent. We will explore the available native applications, ACT Extensions (apps) and other toolkits that help automate the ROM creation process for battery applications.
  • Integrate electrical ECMs with thermal ROMs to provide a systems-level understanding of battery thermal and electrical performance under various load-level scenarios.  We will also discuss how battery models can be incorporated into larger systems-level models, such as those for electric vehicles.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Mechanical, ANSYS Workbench
Product Category: Electronics, Multiphysics


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Multiphysics Optimization of Electronics Systems Using ANSYS Icepak, ANSYS Mechanical and ANSYS optiSLang

Electronics systems are becoming more and more compact and require sophisticated optimization techniques to achieve optimal performance. The growing complexity of the design space makes it very difficult for engineers to identify the key variables that need to be optimized. A multiphysics solution is needed.

View this on-demand webinar to learn about a leading-edge optimization procedure applied to the thermomechanical setup of an electronics system. The procedure involves multiphysics thermomechanical analyses using ANSYS Icepak and ANSYS Mechanical, followed by system optimization using ANSYS optiSLang within the ANSYS Workbench framework. Using this process, you can optimize your design for minimal heat sink mass, fan flow rate and thermal stress while constraining the temperature within a given limit.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Mechanical, ANSYS Workbench
Product Category: Electronics, Multiphysics


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PCB Capacitor Optimization that Accounts for Gradient Temperatures and DC Biasing

Learn how to account for temperature and bias capacitance dependencies. This on-demand webinar will focus on using Murata's capacitor library — which represents capacitance as a function of voltage and temperature — within ANSYS Icepak and ANSYS SIwave. With this functionality, you can automatically determine capacitance on printed circuit boards (PCB) using DC simulations to find bias conditions and thermal simulations to determine temperature gradients.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS SIwave
Product Category: Electronics


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5G and the Connected Vehicle

Combining fully autonomous (AV) technology with 5G-delivered, high-speed and low-latency wireless data promises a safer, more user-friendly driving experience. This impending merger is a result of the developing 5G infrastructure that will provide reliable vehicle-to-vehicle (V2V), vehicle-to-infrastructure (V2I) and vehicle-to-everything (V2X) connectivity for a variety of new, real-time communication services.

The simulation of these connected systems is key to assessing their performance and limits before deployment to ensure maximum performance and reliability. In this on-deman webinar, we will show you how design engineers use ANSYS simulation tools to create reliable 5G systems for automotive applications.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics
Industry: Automotive


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Noise Vibration Analysis of Electric Machines

This on-demand webinar introduces the latest technology for accurately predicting electrical machine noise, vibration and harshness (NVH). Using a permanent magnet motor example, ANSYS engineers demonstrate new equivalent radiated power (ERP) capabilities that make harmonic structural analysis more robust, and a comprehensive workflow to perform NVH analysis.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics


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Tips and Tricks: ANSYS HFSS 3D Components

ANSYS HFSS can utilize ready-made 3D component models for simulation. These components include antennas, radio frequency (RF) connectors and surface-mount devices (e.g., chip capacitors and inductors). A 3D component model contains all relevant information: geometry, materials, boundary conditions, design parameters and ports (when necessary), for inclusion in a fully coupled, 3D electromagnetic simulation. In addition, a patented encryption technology allows component providers to hide and protect critical intellectual property (IP), while fully describing their parts for downstream simulation. The benefits of using 3D components range from design reuse to collaboration enablement with vendors, partners or customers.

This on-demand webinar will provide tips on creating, editing, managing and sharing HFSS 3D components in your design and simulation flow.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics


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Electro-Thermal Analysis Using Icepak in ANSYS Electronics Desktop

With the native integration of ANSYS Icepak into the ANSYS Electronics Desktop, ANSYS users can now benefit from a highly streamlined electromagnetic-thermal analysis workflow that promotes better collaboration between electrical and thermal engineers. With seamless coupling between Icepak and the ANSYS Electromagnetic (EM) tool suite, accurate and detailed heat losses, determined by EM calculations, can be easily included in the thermal calculations via intuitive right-click operations.

View this on-demand webinar for an overview of ANSYS AEDT Icepak and get a panoramic feel for performing electromagnetic-thermal analysis using ANSYS Electronics Desktop.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Electronics Desktop
Product Category: Electronics


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