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Modular and Flexible Approach for Embedded Avionics HMI Design

Discover ANSYS SCADE Display and ANSYS SCADE Solutions for ARINC 661 Compliant Systems. Together, they provide a modular and flexible approach for safety-critical human-machine interface (HMI) specification and development that connects airframers and avionics providers.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS SCADE Suite
Product Category: Electronics
Industry: Aerospace and Defense
Sub Industry: A and D Electronics


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ANSYS Cloud une nouvelle solution SaaS pour les solveurs ANSYS

ANSYS Cloud permet d’accéder très facilement et directement à ses ressources sur le Cloud, depuis l’interface utilisateur Mechanical, Fluent ou Electronics Desktop.

En assistant à ce webinar, vous découvrirez les nouveaux services inclus dans cette solution :

  • Monitoring des calculs lancés dans le Cloud depuis un portail web
  • Post-traitement des résultats avant même de les avoir rapatriés sur votre machine en local

Atouts de la solution ANSYS Cloud :

  • En tant qu’utilisateur, vous ne gérez pas la relation avec le fournisseur Cloud, tout est géré au sein de la solution globale ANSYS.
  • Grâce à la flexibilité du Cloud, vous pouvez accéder à vos ressources de façon sécurisée et à tout moment.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Mechanical, ANSYS HPC, ANSYS Electronics Desktop
Product Category: Electronics, Structures


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VW Motorsport Presents: Battery Simulation - An Essential Technology for the ID. R at Nürburgring and the Record at Pikes Peak

The thermal management of batteries for electric vehicles is critical for performance, safety and cost. It must be investigated on both the component and system levels.

Challenges include:
  • Highly dynamic electrical loads from the driving profile of the line.
  • Optimization of battery performance with minimum cooling mass flow.
  • Development of the racing car within a few months.
View this on-demand webinar to learn from Benjamin Ahrenholz, Head of Calculation/Simulation at Volkswagen Motorsport GmbH, how ANSYS software was used for the Volkswagen Motorsport ID R. race car that broke the all-time record at the Pikes Peak International Hill Climb in June 2018 and how Volkswagen plans to break the electric car record at Nürburgring-Nordschleife later this year.

Discussion topics:
  • Conjugate Heat Transfer in Fluent
  • ECM (Equivalent Circuit Model)
  • LTI-ROM (Linear Time Invariant Reduced Order Model)
  • Twin Builder

Author: ANSYS Type: Webinar Date:
Product Category: Electronics
Industry: Automotive


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ANSYS 2019 R1 HFSS Update

View this on-demand webinar to learn about the new capabilities available in ANSYS HFSS. The new release includes powerful new features for the design of microwave, RF and high-speed electronic devices. Highlights include:
  • Full assembly – ECAD + MCAD mesh assembly
  • Closed loop HFSS – Icepak modeling
  • EMI Design Rule Checking
  • Radar – fascia interaction modeling
    • Ability to model antenna blockage
    • User-defined transmission and reflection boundaries
Watch this this on-demand webinar detailing all the significant advancements in HFSS.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics


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ANSYS 2019 R1 SIwave Update

View this on-demand webinar to learn about the new capabilities available in ANSYS SIwave 2019 R1. The new release includes powerful new features for the design of high-speed electronics devices. New enhancements focus on signal integrity, power integrity and electromagnetic interference analysis including:
  • EMI Scanner – design rule check for EMI/EMC 
  • Electromigration analysis – calculate mean time to failure of metallization
  • High Performance Computing enhancements for faster simulation times

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS SIwave
Product Category: Electronics


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ANSYS 2019 R1 Icepak Update

View this on-demand webinar to learn about the new capabilities available in Icepak 2019.1. The new release includes powerful new features for the design of electronics cooling strategies and electro-thermal analysis. New features include:
  • Electro-thermal analysis — Two-way closed loop coupling between HFSS, Maxwell, Q3D Extractor and Icepak
  • Modeling of inclined PCB
  • DCIR EM loss coupling
Don’t miss this webinar detailing all the significant advancements in Icepak.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak
Product Category: Electronics


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ANSYS 2019 R1 Maxwell Update

View this on-demand webinar to learn about the new capabilities available in ANSYS Maxwell 2019 R1.

ANSYS Maxwell is our low frequency electromagnetic field solver focused on the design of electric motors, actuators, transformers and electromechanical devices.  New capabilities include a powerful noise-vibration-analysis (NVH) workflow, ability to generate full model post-processing from a partial model solution, new mesh density user controls and much more.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Maxwell
Product Category: Electronics


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Developing Next-generation Batteries with 3D Physics and Systems Modeling and Simulation

With the rising demand for ultra-low power design methodologies in power electronics and electric vehicle manufacturing, advances in battery technology have become increasingly important. To save time and costs associated with battery experimentation during R&D, modeling and simulation are essential.

Watch this on-demand webinar to learn how ANSYS Twin Builder can help:
  • Model battery cells using the new Modelica-based library’s equivalent circuit models (ECMs) with state of charge (SOC) or SOC temperature dependency.
  • Create 3D reduced order models (ROMs) in Twin Builder using 3D simulation data from ANSYS Fluent. We will explore the available native applications, ACT Extensions (apps) and other toolkits that help automate the ROM creation process for battery applications.
  • Integrate electrical ECMs with thermal ROMs to provide a systems-level understanding of battery thermal and electrical performance under various load-level scenarios.  We will also discuss how battery models can be incorporated into larger systems-level models, such as those for electric vehicles.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Mechanical, ANSYS Workbench
Product Category: Electronics, Multiphysics


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Multiphysics Optimization of Electronics Systems Using ANSYS Icepak, ANSYS Mechanical and ANSYS optiSLang

Electronics systems are becoming more and more compact and require sophisticated optimization techniques to achieve optimal performance. The growing complexity of the design space makes it very difficult for engineers to identify the key variables that need to be optimized. A multiphysics solution is needed.

View this on-demand webinar to learn about a leading-edge optimization procedure applied to the thermomechanical setup of an electronics system. The procedure involves multiphysics thermomechanical analyses using ANSYS Icepak and ANSYS Mechanical, followed by system optimization using ANSYS optiSLang within the ANSYS Workbench framework. Using this process, you can optimize your design for minimal heat sink mass, fan flow rate and thermal stress while constraining the temperature within a given limit.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS Mechanical, ANSYS Workbench
Product Category: Electronics, Multiphysics


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PCB Capacitor Optimization that Accounts for Gradient Temperatures and DC Biasing

Learn how to account for temperature and bias capacitance dependencies. This on-demand webinar will focus on using Murata's capacitor library — which represents capacitance as a function of voltage and temperature — within ANSYS Icepak and ANSYS SIwave. With this functionality, you can automatically determine capacitance on printed circuit boards (PCB) using DC simulations to find bias conditions and thermal simulations to determine temperature gradients.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Icepak, ANSYS SIwave
Product Category: Electronics


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