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ANSYS 5G Antenna Solutions

Designing 5G wireless systems is a huge undertaking. Antenna beamforming and beamsteering in 5G are key to improve the capacity and data rates for wireless applications. Massive MIMO, for instance, requires phased array antennas to be designed carefully to optimize the gain and ensure targeted coverage. ANSYS tools are ideal for designing and simulating antennas, antenna-to-antenna coupling and environmental effects on signal propagation. ANSYS solutions can enable successful deployment of V2X and V2V systems to improve the safety of self-driving cars that are expected to hit the road in 5G. Read this whitepaper to learn more

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics
Sub Industry: Electrical and Electronics


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ANSYS 5G Mobile/UE Solutions

ANSYS simulation software for 5G provides a compelling set of design solutions from mobile user equipment to networks and beyond. Simulation applications include electronics thermal management, advanced RF front-end design, and radio desensitization and EMI issues in 5G Smartphones. Download this white paper to learn more.

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS Icepak, EMIT, ANSYS RF Option
Product Category: Electronics
Sub Industry: Electrical and Electronics


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Rapid Optimization of Electrical and Thermal Characteristics of Electric Vehicle Batteries

Battery powered electric vehicles (EVs) and hybrid electric vehicles (HEVs) have been gaining market share as the public’s environmental concerns and the depletion of fossil fuels drive the demand for better fuel efficiency. In this white paper we describe a six-step multiphysics simulation involving electrical and thermal parameters to design and validate any battery model. As a case study, we present the battery design for Volkswagen Motorsport’s I.D. R Pikes Peak, which achieved a stunning, record-breaking victory in the 2018 Pikes Peak International Hill Climb.

Author: ANSYS, Inc. Type: White Paper Date:
Product Category: Electronics, Systems
Industry: Automotive


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HFSS Regions in SIwave – Best of Both Worlds

HFSS Regions in SIwave is a hybrid solution technique to obtain 3D full-wave accuracy for the S-parameters of critical nets on a printed circuit board. To demonstrate this feature, a very large PCB, 60 cm long and 42 cm wide, with 20 metal layers is used in ANSYS SIwave. High-speed differential pairs are identified on the PCB and region extents are created for the 3D discontinuities. Everything else is executed in an automated fashion in SIwave and the board is simulated with and without HFSS Regions. This whitepaper will help you develop a solid understanding of this feature.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave
Product Category: Electronics


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Insight into the Evolution of Vehicle Electrification: 2018 SAE Reader Survey - White Paper

This SAE 2018 Reader Survey was conducted on behalf of ANSYS to discover subscribers’ level of involvement with vehicle electrification trends and technologies. Survey respondents work in the automotive industry, with corporate management, management and design engineering job functions and a technology interest in power and propulsion.

Author: ANSYS, Inc. Type: White Paper Date:
Product Category: Electronics, Embedded Software
Industry: Automotive, Industrial Equipment, Aerospace and Defense
Sub Industry: Cars and Light Trucks, Car and Light Truck OEMs, Heavy Truck OEMs, Heavy Trucks and Off-Highway, Tier 1 and 2 Suppliers


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Leveraging Automation to Generate Efficiency Maps for Electrical Machines in ANSYS Maxwell

Using ANSYS Maxwell for designing and simulating machines dramatically reduces the number of hardware prototypes, saves costs, boosts reliability and shortens the time to market. This white paper describes efficiency maps generated automatically in ANSYS Maxwell for predicting a motor’s performance under a broad range of operating scenarios.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Maxwell
Product Category: Electronics
Sub Industry: Electrical and Electronics


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Solving Interference Issues in a Smart Home with ANSYS EMIT - White Paper

Simulation-driven design tools are essential for engineers to create the internet of things and make the smart devices reliable, inexpensive, and energy efficient. This paper describes how ANSYS EMIT is used to address electromagnetic and interference problems in a smart home equipped with many modern connected appliances. The paper dwells on ANSYS EMIT’s link analysis capability for determining a smart device’s performance in presence of other wireless sensors within a smart home environment.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: EMIT
Product Category: Electronics
Sub Industry: Electrical and Electronics


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战胜混合动力/电动汽车牵引电机的设计挑战

混合动力汽车(HEV)和电动汽车(EV)具备优秀的燃料效率,以及近零排放的特性,同时价格也越来越亲民,因此正迅速地获得全球汽车市场的青睐。很多汽车原始设备制造商(OEM)都在研发新型HEV和EV设计;他们面临的一个最大挑战就是牵引电机的设计,大多数产品都采用了内置永磁(IPM)同步电机。为消费者提供最大化的续航里程和燃料效率,关键在于将电气损耗和磁损耗降到最低。与此同时,工程师需要考虑结构、热和电磁场问题,它们对汽车的性能、可靠性和成本等特点具有决定性作用。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Maxwell
Product Category: Electronics, Electronics - Electromechanical
Industry: Automotive
Sub Industry: Electrical and Electronics


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卓越仿真成就创新型电子设计

我们正处在以电子技术为中心的创新繁荣期,我们的通信、工作、学习和娱乐方式也因为这些创新而改变。技术的创新发展会影响几乎所有的产品。在全球范围内,看得见和看不见的电子应用有很多,其中包括非常智能的手机、光纤和无线网络、可以装在口袋里的计算机、能模拟纸张的LED显示屏以及宠物追踪芯片。进入第二个千禧年后,汽车中配备了各类电子设备,以此来控制发动机功能,防止车轮打滑,避免发生事故,以及指引行驶路线等。航空电子设备包括雷达、电传操纵系统和机载通信。电子技术创新已经应用到了工业和军事领域:智能电子产品正在重新定义一切事物,从准时制生产到国土安全。这些设备对我们的生活质量产生了明显影响。然而,互联产品已经发展到何种程度,又将如何影响我们的安全,这些还有待我们去发现。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Electronics Desktop, ANSYS Electronics HPC, ANSYS Icepak, ANSYS Maxwell, ANSYS HFSS
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - Integrated Circuits
Industry: High Tech
Sub Industry: Electrical and Electronics


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混合有限元边界积分法

随着近期积分方程求解效率的提高,现在我们可以在混合有限元边界积分法(FEBI)中将积分方程法和有限元法相结合(FEM)[1]。在电磁学中,FEM是一种通用技术,该技术既支持体积电场求解,又能精确地描述微波组件、天线和信号完整性问题[2,3]。对于天线或散射问题,必须包含围绕模型的空气域,并且用吸收边界条件(ABC)予以闭合。虽然用于直接求解对象表面电流的积分方程(IE)方法不如FEM通用,但它在解决大型开放问题时往往效率更高,因为它不需要周围的空气体积。通过在FEBI方法中结合这两种方法,HFSS用户能够准确高效地仿真非常复杂的大型开放性问题。HFSS™的13.0版将提供这种新方法。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics


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