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5G Connectivity with ANSYS - Video

Delivering on the promise of 5G will require engineers to overcome significant design challenges for user equipment, network and data center development. Learn how ANSYS pervasive simulation solutions can help your 5G development efforts.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics, Electronics - Signal Integrity
Industry: High Tech


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Enabling the Next Wave of Mobile Data: A Perspective on RF EDA Technologies for 5G - Video

In this keynote presentation from the ANSYS 5G workshop at DesignCon 2019, Peter A. Rabbeni, vice president, RF Business unit of GLOBALFOUNDRIES, talks about the challenges associated with 5G design. Specifically, he discusses how RF EDA technologies will play a crucial role in enabling the next generation of wireless technology, which will transform the way we communicate, commute and collaborate with machines and humans alike.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics


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ANSYS 2019 R1 Version up 온라인 세미나 - Electromagnetics-HF Update 발표영상

ANSYS HFSS와 SIwave를 중심으로 ANSYS 2019 R1에서 업데이트 된 HF 부문의 주요 기능을 소개합니다.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS HFSS, ANSYS SIwave
Product Category: Electronics


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ANSYS 2019 R1 Version up 온라인 세미나 - Electromagnetics-LF Update 발표영상

ANSYS 2019 R1 Maxwell에서 업데이트된 회전 기기 관련 기능과 Multiphysics 기능 그리고 해석 속도에 대한 개선 내용을 소개합니다. 이어, ANSYS 2019 R1 Icepak에서 업데이트된 AEDT Iepak Coupling Update 내용과 Classic Icepak Update 내용을 소개합니다.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS Icepak, ANSYS Maxwell
Product Category: Electronics


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ANSYS for Complex Smartphone Engineering and Design

The engineering complexities of today's smart digital systems are staggering, and simulation is needed to design such complicated devices. Using the smartphone as an example, this video demonstrates how market leaders are using ANSYS simulation solutions to overcome the electromagnetic, thermal and mechanical challenges of design at every step of the process from ideation to production to everyday use.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics
Industry: High Tech


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Today's High Tech World, Demands Simulation

To keep pace with the proliferation of connected devices, engineers and designers must tame product complexity and ensure performance reliability, while reducing time to market. ANSYS simulation makes this possible. Our solutions help the high-tech industry design products across the industrial internet of things (IIoT), engineering physics, organizations and the entire product lifecycle.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics
Industry: High Tech


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ANSYS Solutions for Sensor Development, Simulation and Testing

With ANSYS’ unique approach, you can design and validate sensors throughout development — from analysis at the component level to the virtual test drive. This video demonstrates how ANSYS software is used to design, simulate and test radar, lidar and cameras on a virtual vehicle in isolation and in a simulated real-world environment.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS Geometry Interface
Product Category: Electronics
Industry: Automotive


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Boost Signal Integrity of PCBs with HFSS Regions & SIWave

This video describes HFSS Regions within SIwave, a unique ANSYS SIwave technology that bolsters the accuracy of simulating signal nets with 3D discontinuities such as bondwires, vias and solderballs.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS SIwave
Product Category: Electronics
Sub Industry: Electrical and Electronics


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Mitigate EMI Issues in PCBs using SIwave

EMI Scanner can quickly identify areas of potential interference on your PCB design prior to simulation. This new feature included within ANSYS SIwave and ANSYS HFSS quickly identifies potential trouble spots that require further investigation. It eliminates errors and speeds time to market.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS SIwave
Product Category: Electronics
Sub Industry: Electrical and Electronics


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Find Electromigration Vulnerabilities on IC Packages Using SIwave

Learn how to perform electromigration analysis with SIwave to predict mean time-to-failure for on-chip and advanced electronic packaging structures.

Author: ANSYS, Inc. Type: Video Date:
Product Name: ANSYS SIwave
Product Category: Electronics
Industry: Consumer Products
Sub Industry: Electrical and Electronics


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