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ANSYS NVH Solutions for Electric Motors

Simulating the noise, vibration and harshness (NVH) of an electric motor is important for proper electromagnetic (EM) and vibro-acoustic design of electric vehicles (EVs). This paper describes ANSYS’ solutions to characterize the NVH effects of an electric motor early and accurately in the design cycle to improve vehicle performance and safety. These solutions lower development costs and help support electric mobility (e-mobility) — an application resulting from electrifying transportation. ANSYS solutions enable carmakers to reduce the NVH of electric vehicles, improve customer satisfaction and gain competitive advantage in the automotive sector.

Author: Type: White Paper Date:
Product Name: ANSYS Maxwell
Product Category: Electronics
Industry: Automotive
Sub Industry: Electrical and Electronics


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ANSYS 2019 R3 Capabilities - Brochure

ANSYS delivers innovative, dramatic simulation technology advances in every major physics discipline. We offer the most comprehensive suite of simulation solvers in the world so that you can confidently predict your product’s success. This brochure outlines the capabilities of our various products.

Author: ANSYS, Inc. Type: Brochure Date:
Product Category: 3D Design, Electronics, Embedded Software, Fluids, Materials, Optical, Structures, Systems, Multiphysics, Platform, Semiconductors


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Simulation in the News

A roundup of news items featuring simulation.

Author: Type: Article Date:
Product Category: Semiconductors, Systems, Embedded Software, Electronics
Industry: Automotive, Energy, High Tech, Aerospace and Defense
Sub Industry: Renewable Energy, Semiconductors, Space, Car and Light Truck OEMs, Aircraft


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Energizing Generator Designs - ANSYS Advantage - V13 I2 - Article

Generators serve as the heart of hydroelectric power plants and must be accurately designed to optimize energy output and prevent excessive temperatures that cause energy losses and shorten the machine’s life. Leveraging ANSYS simulation and an improved workflow, INDAR engineers improve generator design accuracy and accelerate all stages of their simulation. This allows them to meet tight delivery deadlines and significantly scale generator production.

Author: INDAR Type: Article Date:
Product Name: ANSYS Maxwell, ANSYS Fluent, ANSYS Mechanical
Product Category: Electronics, Electronics - Electromechanical
Industry: Energy
Sub Industry: Electrical and Electronics


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SPARK Microsystems Innovates Highly Advanced Ultra-Wideband Radio with ANSYS Simulation

SPARK Microsystems, a leading fabless semiconductor, creates the Spark SR1000 Radio, a highly efficient, agile and robust ultra-wideband platform supporting numerous markets including automotive, smart home and many more. In this case study, they detail how they utilized ANSYS high-frequency, full-wave electromagnetic simulations to ensure the radio met challenging efficiency performance requirements and stringent governmental standards.

Author: ANSYS, Inc. Type: Case Study Date:
Product Name: ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics
Sub Industry: Electrical and Electronics


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Implementing Reliability Physics into the Design Process: What Every Manager and Engineer Needs to Know

Most engineers and management will agree that critical decisions regarding design and reliability should be based on robust analyses and data. Despite this concurrence, product teams within the technology space continue to use outmoded approaches for reliability assurance and risk mitigation. This includes empirical handbook predictions like MIL-HDBK-217 and equivalent, arbitrary derating rules, reliability by similarity, prior experience or even no reliability assessment until physical test.

This inertia is partially due to the difficulty of inserting new practices into an ongoing product development process. And the risk is high, since key performance indicators (KPIs) for directors and vice presidents are based on hitting cost and schedule targets, and not on bettering reliability practices.

This presentation reviews the most common design flows and the common insertion points for existing reliability practices. Design flows will include revolutionary (new design), evolutionary (minor changes, such as obsolescence or price reduction) and original design manufacturer (ODM). Within each design flow, ANSYS consultants will provide detailed recommendations on where reliability physics will provide the greatest value, and offer specific details around the activity, information needed and purpose.

At the end of this presentation, engineers and managers will have the foundational knowledge to improve existing processes and educate peers and supervisors as to the value proposition, while minimizing any potential disruption. The long-term goal will be to reduce the engineering resources and time to market necessary to release products into the field, while still reaching or exceeding reliability goals.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Creating a Reliability Physics-Focused Organization

Traditional organizations typically engage with reliability at the end of the product development process. This is because traditional reliability has been defined by testing and after-the-fact reliability prediction. However, companies that care about time to market and are aligned with industry best practices are increasingly incorporating elements of assessment and prediction early in the design process. This webinar introduces a blueprint for structuring your organization to introduce reliability physics into each stage of the product development process, to accelerate time to market and ensure reliability.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Reliability of Microvias/Plated Through-Holes in PCB

Due to the higher I/O density and smaller electronic packages, the demand for high-density interconnects (HDIs) has increased significantly. Microvias are essential elements in HDI printed circuit boards (PCBs). Failure of these structures is the most common cause of open circuits in PCBs. This has created great concern for the reliability of microvias within the electronics industry.

This webinar briefly discusses common failure mechanisms in microvias and plated through-holes, and highlights their differences. It also identifies common manufacturing defects and how they influence the reliability of these structures.

The presentation addresses the challenges and pitfalls associated with the modeling of these devices using the finite element method (FEM), as well as the importance of statistical analysis on fatigue life prediction of plated through-holes (PTHs).

Finally, the webinar provides a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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The Reliability of BGAs, QFNs and Other Critical Packages

There are many factors that determine the thermal cycling robustness of an electronic package. Packages that have known thermal cycling issues include ball grid arrays (BGAs), quad flat no-leads (QFNs) and ceramics. This presentation discusses the critical parameters of these packages that may affect the thermal cycling performance. The webinar also covers other possible reasons why your electronic product may not be robust with regards to thermal cycling.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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Reliability Physics and FEA: A Perfect Match in the Electronics Industry

The electronics industry continues to evolve with innovative technology. With changing needs and deliverables, electronics reliability issues emerge. From smartwatches to wind power to electric vehicles, reliability is the common denominator in manufacturing robust products. Approaching the challenge of developing a durable product requires a deep comprehension of reliability physics and its interplay with finite element analysis (FEA). Implementing both methodologies facilitates a better understanding of a PCBA’s response to environmental conditions. This webinar demonstrates that assessing board-level reliability and computing lifetime predictions — with casing and other mechanical constraints incorporated — are pertinent to successful products.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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