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Disruption in High-Tech Is Here: Are You Ready? - White Paper

Smart connected technology first transformed consumer electronics such as phones and tablets. Then it proliferated into cars, jets, health care, manufacturing and beyond. Today every product development team is asking “How can we incorporate smart connected technology to take our products’ performance to a new level?” Industry leaders are tackling this challenge with engineering simulation. Are you ready for innovation through simulation?

Author: ANSYS, Inc. Type: White Paper Date:
Industry: High Tech


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Fast-tracking Safe Autonomous Vehicles - White Paper

Autonomous vehicles are threatening to disrupt the automotive, aerospace and industrial equipment industries with the emergence of self-driving cars, drones and mobile autonomous robots. They promise to drastically reduce accidents, minimize congestion, bring mobility to the immobile and perform mundane or hazardous tasks in a fraction of the time required by human-controlled vehicles. This opportunity is open to traditional industry players as well as new entrants, particularly from the high-tech sector. The race to market is on.

The critical path engineering challenge to be overcome is demonstrating compliance with safety requirements. Research has shown that for a self-driving car, this could take between 8 billion and 11 billion miles of road testing. Because physical testing is clearly not a practical solution, autonomous vehicle makers are turning to “simulated miles driven, fl own or maneuvered” as an alternative means of performing the required testing in a reasonable timeframe. This white paper discusses how ANSYS is building the industry’s only comprehensive, open and confi gurable solution to validate vehicle performance against safety requirements, leveraging best-in-class high-fi delity sensor models and open- and closed-loop simulations to validate the embedded software responsible for perception, localization, motion planning and motion execution.

Author: ANSYS, Inc. Type: White Paper Date:
Industry: Aerospace and Defense, Automotive, High Tech


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Fast-tracking Safe Autonomous Vehicles - White Paper

Autonomous vehicles are threatening to disrupt the automotive, aerospace and industrial equipment industries with the emergence of self-driving cars, drones and mobile autonomous robots. They promise to drastically reduce accidents, minimize congestion, bring mobility to the immobile and perform mundane or hazardous tasks in a fraction of the time required by human-controlled vehicles. This opportunity is open to traditional industry players as well as new entrants, particularly from the high-tech sector. The race to market is on.

The critical path engineering challenge to be overcome is demonstrating compliance with safety requirements. Research has shown that for a self-driving car, this could take between 8 billion and 11 billion miles of road testing. Because physical testing is clearly not a practical solution, autonomous vehicle makers are turning to “simulated miles driven, fl own or maneuvered” as an alternative means of performing the required testing in a reasonable timeframe. This white paper discusses how ANSYS is building the industry’s only comprehensive, open and confi gurable solution to validate vehicle performance against safety requirements, leveraging best-in-class high-fi delity sensor models and open- and closed-loop simulations to validate the embedded software responsible for perception, localization, motion planning and motion execution.

Author: ANSYS, Inc. Type: White Paper Date:
Industry: Aerospace and Defense, Automotive, High Tech


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Engineering Smarter Connected Products for Winning in the Digital Economy - eBook

The Internet of Things (IoT) represents an eleven trillion dollar opportunity. The opportunity will only be fully realized if engineers use best practices to design robust and reliable products. In this e-book we explain the critical design challenges for designing smarter connected products and how ANSYS solutions can help.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS HFSS, ANSYS SIwave, ANSYS Icepak, ANSYS Mechanical, ANSYS RedHawk
Industry: High Tech, Healthcare - BioMed, Aerospace and Defense, Automotive, Energy


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系统感知型SoC的功耗、噪声和可靠性验收

在全球竞争激烈的移动、消费类和汽车电子系统市场中,低功耗、高性能以及高可靠性是至关重要的成功因素。为了应对这些相互冲突的要求,设计团队需要面面俱到地考虑多种方案,例如采用高级工艺技术节点,尤其是基于FinFET的器件。这些高级技术节点让芯片不仅能在更低功耗下以更快的速度运行,同时还可在相同尺寸的硅片中集成更多功能。但是,在这些工艺节点上,由于器件的物理特性、尺寸和形状以及互联等因素,在进行功耗、噪声和可靠性验收时会遇到严重问题。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech


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卓越仿真成就创新型电子设计

我们正处在以电子技术为中心的创新繁荣期,我们的通信、工作、学习和娱乐方式也因为这些创新而改变。技术的创新发展会影响几乎所有的产品。在全球范围内,看得见和看不见的电子应用有很多,其中包括非常智能的手机、光纤和无线网络、可以装在口袋里的计算机、能模拟纸张的LED显示屏以及宠物追踪芯片。进入第二个千禧年后,汽车中配备了各类电子设备,以此来控制发动机功能,防止车轮打滑,避免发生事故,以及指引行驶路线等。航空电子设备包括雷达、电传操纵系统和机载通信。电子技术创新已经应用到了工业和军事领域:智能电子产品正在重新定义一切事物,从准时制生产到国土安全。这些设备对我们的生活质量产生了明显影响。然而,互联产品已经发展到何种程度,又将如何影响我们的安全,这些还有待我们去发现。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS Electronics Desktop, ANSYS Electronics HPC, ANSYS Icepak, ANSYS Maxwell, ANSYS HFSS
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - Integrated Circuits
Industry: High Tech
Sub Industry: Electrical and Electronics


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初级读本:利用CFD解决无人机(UAV)空气动力学问题

作为一位工程经理或分析人员,您的任务是解决与无人飞行系统(UAS)的空气动力学有关的一些问题。您使用CFD(计算流体动力学)的经验比较有限,而您所在公司的无人机(UAV)项目却时间紧迫。本白皮书将向您介绍一些通常可利用CFD软件求解的空气动力学问题,以指导您进行决策。此白皮书中还包含了一系列案例研究,并且每个案例都解释了应用流体工程来解决该特定问题的具体原因。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS CFD, ANSYS CFD Enterprise, ANSYS CFD Premium, ANSYS CFD Professional
Product Category: Fluids
Industry: High Tech
Sub Industry: Aircraft


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研发智能低成本情报、监视与侦查技术:五大趋势值得关注

行业对于情报、监视和侦查(ISR)技术和基础设施的需求正在显著增长。例如,从2002年到2011年的10年间,美国在ISR技术上的国防开支增长了六倍,而同期国防开支总体相对平稳[国会众议院情报委员会(House Permanent Select Committee on Intelligence),2012年]。类似的经费开支模式在全球相当普遍。从无人系统到天线,再到系统和嵌入式软件,仿真工程在推进ISR技术研发方面一直发挥着重要作用。其价值主张早已经过实践验证。

Author: ANSYS Type: White Paper Date:
Industry: High Tech


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利用3D电磁场仿真工具开展板上封装仿真

多年以来,设计人员在仿真中考虑到了封装寄生参数的影响,从使用理想电感+电阻等简单的一阶模型到更为复杂的Spice梯形网络直至最后使用3D电磁场仿真器完整抽取封装的S参数。对于封装和PCB通道相结合的情况,目前最常用的方法是分别抽取封装和电路板作为S参数模型或宽带SPICE模型,然后在电路仿真器中将这两种模型结合起来。由于工作频率不断升高、信号速度不断加快、集成器件日益复杂等因素,这种方法也暴露出越来越多的局限性。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech
Sub Industry: Consumer Electronics


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防止PCB由于热应力和结构应力失效

随着PCB能量耗散逐步上升和尺寸不断减小,PCB热应力和结构应力造成电子系统失效的可能性正在不断上升。由于需要强大计算能力去求解包含PCB详细几何结构的有限元模型,利用仿真得到准确PCB变形是不可行的。当使用分割PCB导入材料性能从而简化PCB几何结构的方法后,这种新型多物理场方法可以用来克服上述难题。在新版本下,工程师可以利用这种新方法来精确预测由于热应力、随机振动、外部冲击所造成的PCB变形。

Author: ANSYS Type: White Paper Date:
Product Category: Electronics
Industry: High Tech


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