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eSilicon Uses ANSYS Multiphysics Simulations to Achieve Silicon to System Success

Watch this video to learn how eSilicon is using ANSYS multiphysics solutions to ensure silicon to system success and drive time-to-market acceleration for its high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure customers. Michael Gianfagna (Vice President, Marketing) and Teddy Lee (Architect, Signal and Power Integrity) of eSilicon explain how ANSYS simulation solutions are critical to meeting the increasingly stringent specifications of their system-in-package designs across all applications.

Author: ANSYS, Inc. Type: Testimonials Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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5G Connectivity with ANSYS - Video

Delivering on the promise of 5G will require engineers to overcome significant design challenges for user equipment, network and data center development. Learn how ANSYS pervasive simulation solutions can help your 5G development efforts.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics, Electronics - Signal Integrity
Industry: High Tech


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ANSYS® 5G SoC Solutions

System-On-Chips for 5G smartphones and networks are complicated since they need to manage huge amounts of antenna data and offer significantly high processing capabilities in a power and thermally constrained environments. ANSYS tools provide thermal, reliability, power-timing and electromagnetic analyses of SoCs that can reveal design weaknesses and prevent system failures. Multiphysics solutions from ANSYS can simultaneously solve these challenges across the chip, package, and system and help increase the reliability of next generation SoCs. To learn more, download this white paper.

Author: Type: White Paper Date:
Product Name: ANSYS RedHawk, ANSYS Totem, ANSYS PowerArtist
Industry: High Tech


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ANSYS for Complex Smartphone Engineering and Design

The engineering complexities of today's smart digital systems are staggering, and simulation is needed to design such complicated devices. Using the smartphone as an example, this video demonstrates how market leaders are using ANSYS simulation solutions to overcome the electromagnetic, thermal and mechanical challenges of design at every step of the process from ideation to production to everyday use.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics
Industry: High Tech


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Shifting Left with ANSYS - ANSYS Advantage - V13 I1

In 2017, Synopsys® and ANSYS partnered to take the best of ANSYS’ power integrity and reliability offerings and create an integrated flow with Synopsys implementation to drive robust semiconductor design optimization. Following the release of RedHawk Analysis Fusion by Synopsys in 2018, customers have shared positive feedback on productivity and design quality impact that have helped drive further innovations on this platform. We sat down with John Lee, vice president and general manager of the semiconductors division at ANSYS, and Jacob Avidan, senior vice president of signoff products at Synopsys, to get their views on the results of this collaboration and how the ANSYS–Synopsys collaboration helps address the challenges of emerging technologies.

Author: Synopsys Type: Article Date:
Product Name: ANSYS RedHawk
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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Today's High Tech World, Demands Simulation

To keep pace with the proliferation of connected devices, engineers and designers must tame product complexity and ensure performance reliability, while reducing time to market. ANSYS simulation makes this possible. Our solutions help the high-tech industry design products across the industrial internet of things (IIoT), engineering physics, organizations and the entire product lifecycle.

Author: ANSYS, Inc. Type: Video Date:
Product Category: Electronics
Industry: High Tech


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커패시터를 이용하여 DDR 시스템의 전원 노이즈 줄이기 - ANSYS Advantage - Issue 3 | 2018

STMicroelectronics 엔지니어들은 ANSYS 툴을 사용하여 DDR 시스템의 설계에서 전력 무결성 문제를 파악하고 수정했습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Additive Print, ANSYS Additive Suite
Industry: High Tech


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앞으로 구현될 형상- ANSYS Advantage - Issue 3 | 2018

적층 제조에는 아직 실현되지 않은 엄청난 잠재력이 있으며, 시뮬레이션은 이러한 잠재력을 구현하는 데 중요한 역할을 할 것입니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Additive Print, ANSYS Additive Suite
Industry: High Tech


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3차원 적층 제조 기술의 성공 보장 - ANSYS Advantage - Issue 3 | 2018

3차원 적층 제조라는 전도 유망한 새로운 분야에서 안정성을 확보할 수 있는 유일한 방법은 전문화된 툴을 활용하는 것입니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Additive Print, ANSYS Additive Suite
Industry: High Tech


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금형을 벗어나다 - ANSYS Advantage - Issue 3 | 2018

Relativity Space는 로켓 설계에 3차원 적층 제조 기술 및 시뮬레이션을 활용합니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Additive Print, ANSYS Additive Suite
Industry: High Tech


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