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Dimensions Summer 2019 - 成功への電動化

本号では、シミュレーションを使用してコストを削減しながら製品の設計と開発を改善し、電動化、5G、デジタルツインなどの新たなイノベーションに対応する事例を紹介します。

Author: ANSYS, Inc. Type: Article Date:
Industry: High Tech
Sub Industry: Electrical and Electronics


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インデザイン解析、ビッグデータアーキテクチャ他ANSYS半導体関連最新情報

約1,000 名を超えるお客様にご来場いただいた「ANSYS DAY 2017」にて発表された資料をご覧いただけます。本プレゼンテーションでは、インデザイン解析、ビッグデータアーキテクチャ他ANSYS半導体関連の最新情報をご紹介します。

Author: ANSYS, Inc. Type: Presentation Date:
Product Name: ANSYS Path FX, ANSYS RedHawk
Product Category: Electronics - Signal Integrity, Semiconductors
Industry: High Tech


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チップパッケージシステムのパワーインテグリティ解析フロー

ANSYS Convergence 2016 & ANSYS Electronics Simulation Expo 2016 の講演資料です。本プレゼンテーションでは、チップ-パッケージ-システムのパワーインテグリティ解析フローを説明します。

Author: ANSYS, Inc. Type: Presentation Date:
Product Name: ANSYS SIwave
Industry: High Tech
Sub Industry: Semiconductors


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「モノのインターネット」のエンジニアリング

ANSYS Convergence 2016 & ANSYS Electronics Simulation Expo 2016 の講演資料です。IoTにより高まる製品の複雑性と多くの課題、その製品開発を支えるANSYS製品の最新情報とソリューション例をご紹介します。

Author: ANSYS, Inc. Type: Presentation Date:
Industry: High Tech


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アナログミックスシグナルIP設計におけるデザイン早期からサインオフに至るまでの電源ノイズと信頼性クロージャ

ANSYS Convergence 2016 & ANSYS Electronics Simulation Expo 2016 の講演資料です。本プレゼンテーションでは、アナログミックスシグナルIP設計におけるデザイン早期からサインオフに至るまでの電源ノイズと信頼性クロージャについて説明します。

Author: ANSYS, Inc. Type: Presentation Date:
Product Name: ANSYS Totem
Industry: High Tech
Sub Industry: Semiconductors


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ANSYS 5G天线解决方案

5G设计的多个物理场和多种技术需要一个普适的工程平台来准确地仿真,该平台能运用先进的高性能计算,并且部署在整个企业范围内,能帮助设计人员和工程专家开展协作,研发具备5G功能的系统。而ANSYS设计平台正能充分满足这些要求,为用户提供实现5G工程创新所需的仿真解决方案。

Author: ANSYS, Inc. Type: White Paper Date:
Industry: High Tech


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Simulation in the News

A roundup of news items featuring simulation.

Author: Type: Article Date:
Product Category: Semiconductors, Systems, Embedded Software, Electronics
Industry: Automotive, Energy, High Tech, Aerospace and Defense
Sub Industry: Renewable Energy, Semiconductors, Space, Car and Light Truck OEMs, Aircraft


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Early Simulation Avoids Chip Burn - ANSYS Advantage - V13 I2 - Article

Thermal constrained performance is a challenge for GPU designs. Using ANSYS PowerArtist to perform a unique differential energy analysis early in the chip design process (during RTL design), Qualcomm engineers were able to identify and fix redundant switching in their GPU to improve the power efficiency of key design blocks by 10%.

Author: Qualcomm Type: Article Date:
Product Name: ANSYS PowerArtist
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductors


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ANSYS HFSS – 2019 R2 Update

Engineers worldwide use ANSYS HFSS to design high-frequency, high-speed electronics found in communications systems, radar systems, advanced driver assistance systems (ADAS), satellites, internet-of-things (IoT) products and other high-speed RF and digital devices. This webinar describes updates to HFSS in release 2019 R2, including extension of the capability to more efficiently model complex antenna scenarios, new capabilities in the ADAS solution space for advanced Doppler processing, improvements to ECAD/MCAD mesh assembly and lightweight MCAD in layout, and the ability to launch HFSS on the ANSYS cloud service.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech


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Implementing Reliability Physics into the Design Process: What Every Manager and Engineer Needs to Know

Most engineers and management will agree that critical decisions regarding design and reliability should be based on robust analyses and data. Despite this concurrence, product teams within the technology space continue to use outmoded approaches for reliability assurance and risk mitigation. This includes empirical handbook predictions like MIL-HDBK-217 and equivalent, arbitrary derating rules, reliability by similarity, prior experience or even no reliability assessment until physical test.

This inertia is partially due to the difficulty of inserting new practices into an ongoing product development process. And the risk is high, since key performance indicators (KPIs) for directors and vice presidents are based on hitting cost and schedule targets, and not on bettering reliability practices.

This presentation reviews the most common design flows and the common insertion points for existing reliability practices. Design flows will include revolutionary (new design), evolutionary (minor changes, such as obsolescence or price reduction) and original design manufacturer (ODM). Within each design flow, ANSYS consultants will provide detailed recommendations on where reliability physics will provide the greatest value, and offer specific details around the activity, information needed and purpose.

At the end of this presentation, engineers and managers will have the foundational knowledge to improve existing processes and educate peers and supervisors as to the value proposition, while minimizing any potential disruption. The long-term goal will be to reduce the engineering resources and time to market necessary to release products into the field, while still reaching or exceeding reliability goals.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Sherlock
Product Category: Electronics
Industry: High Tech


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