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Differential Energy Analysis to Optimize Mobile GPU Power

Operating power has become one of the most important metrics for modern electronic devices. Qualcomm Technologies, a world-class mobile solution provider, significantly reduced power consumption in an already challenging market by performing power analysis at RTL using ANSYS PowerArtist. Qualcomm Technologies was able to reduce dynamic power by 10 percent through this approach.

Author: ANSYS Inc. Type: White Paper Date:
Product Name: ANSYS PowerArtist, ANSYS RedHawk
Product Category: Semiconductors
Sub Industry: Electrical and Electronics


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ANSYS® 5G SoC Solutions

System-On-Chips for 5G smartphones and networks are complicated since they need to manage huge amounts of antenna data and offer significantly high processing capabilities in a power and thermally constrained environments. ANSYS tools provide thermal, reliability, power-timing and electromagnetic analyses of SoCs that can reveal design weaknesses and prevent system failures. Multiphysics solutions from ANSYS can simultaneously solve these challenges across the chip, package, and system and help increase the reliability of next generation SoCs. To learn more, download this white paper.

Author: Type: White Paper Date:
Product Name: ANSYS RedHawk, ANSYS Totem, ANSYS PowerArtist
Industry: High Tech


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低功耗设计方法助力尽早实现功耗收敛

商用功耗分析工具推出已十年有余,主要应用在门级和晶体管级的抽象层面上。对模拟、混合信号和定制设计来说,晶体管级的工具既可当作设计工具使用,也可当作验证工具使用。它们可帮助设计人员分析功耗,并能作为最终“验收”工具使用,以确保满足功耗规格。在综合驱动的基于标准单元的ASIC和SoC设计上,门级和晶体管级功耗分析工具一般都作为最终验证工具使用。如果在验证过程中发现有要求重新综合设计的强制性设计修改,那么就需要进入广泛的验证阶段了。由于在流程中需要使用多种工具进行多次迭代,这样就会导致更长的设计收敛时间。本白皮书将介绍一种低功耗设计(DFP)方法,它从设计流程的寄存器传输级(RTL)阶段开始,旨在满足设计的功耗预算以及设计收敛时间和产品上市时间的要求。

Author: ANSYS Type: White Paper Date:
Product Name: ANSYS PowerArtist
Product Category: Semiconductors
Industry: Construction
Sub Industry: Semiconductors


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Early Power Closure Using a Design for Power Methodology - White Paper

A whitepaper on RTL power analysis, estimation and optimization using ANSYS PowerArtist.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS PowerArtist
Product Category: Semiconductors
Industry: Automotive, Healthcare - BioMed
Sub Industry: Mobile Computing


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Integrated Chip–Package–System Simulation: The Complete Electronics Solution from ANSYS and Apache - White Paper

With electronic systems evolving at a rapid pace, chip designs become increasingly complex, even for mundane tasks. The challenge is managing design specifications (performance) and margins (price) while meeting the demands of a rapidly changing market. Solutions to these engineering challenges rely on accurate, predictive simulation software. ANSYS and Apache Design together offer electronics customers a simulation-driven chip–package–system development methodology that is multiscale, multiphysics and multiuser.

Author: ANSYS, Inc. Type: White Paper Date:
Product Name: ANSYS Icepak, ANSYS PowerArtist, ANSYS Sentinel, ANSYS Totem, ANSYS SIwave, ANSYS Designer, ANSYS HFSS
Product Category: Electronics, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Semiconductors, Electronics - Cooling
Industry: High Tech


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