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Cool Smartphones - Article - ANSYS Advantage - V12 I2

Keeping a smartphone from overheating is becoming more challenging as increasing numbers of transistors and devices are made to fit into a small, sleek design. Qualcomm engineers have developed a way to use simulation to create a smaller model of the power sources in a smartphone. This model can be solved in a fraction of the time of a full thermal analysis, so that they can look at more operating scenarios. The goal is to create a dynamic power management strategy to selectively direct power where it is needed and keep temperatures down.

Author: Qualcomm Type: Article Date:
Product Name: ANSYS Icepak, ANSYS Simplorer
Product Category: Electronics, Electronics - Cooling
Industry: High Tech
Sub Industry: Consumer Electronics


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Cutting the Cords - Article - ANSYS Advantage - V12 I2

Networking experts predict that, by 2021, 66 percent of all internet traffic will be used for high throughput services such as wireless docking, video streaming, cloud backup and virtual reality. Peraso Technologies enables users to cut the cord and go wireless by providing chipsets based on the emerging 802.11ad (WiGig) standard that delivers high-speed wireless throughput in a USB 3.0 stick form factor. Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high power transmitters into a tiny enclosure.

Author: Peraso Technologies Inc. Type: Article Date:
Product Name: ANSYS Icepak, ANSYS SIwave, ANSYS SpaceClaim
Product Category: Electronics - Signal Integrity, 3D Design, Electronics - Cooling
Industry: High Tech


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Safe Travels - Article - ANSYS Advantage - V12 I1

Automotive electronics have always had to withstand difficult environment conditions. Today, with the safety of the vehicle’s occupants increasingly dependent on these same electronics, the consequences of failure are greater than ever before. Engineering simulation is essential to diagnose and validate automotive electronics reliability before investing in expensive prototypes and field testing.

Author: ANSYS Type: Article Date:
Product Name: ANSYS Icepak, ANSYS RedHawk
Product Category: Semiconductors
Industry: Automotive


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전자 기기의 혁신 촉진 - ANSYS Advantage - Issue 3 | 2017

선두 전자 기업들은 엔지니어링 시뮬레이션을 활용하여 에너지 소비를 줄이고, 다른 기기와의 간섭을 방지하고, 개발 시간을 단축합니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Maxwell, ANSYS Mechanical, ANSYS HPC, ANSYS HFSS, ANSYS Fluent, EMIT, ANSYS SIwave, ANSYS Icepak
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Signal Integrity, Fluids
Industry: Aerospace and Defense


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교차된 신호 - ANSYS Advantage - Issue 3 | 2017

엔지니어들이 고속 인쇄 회로의 신호 무결성 분석을 수행하는 데 필요한 시간을 단축했습니다.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Mechanical, ANSYS Icepak
Product Category: Electronics, Electronics - Cooling, Electronics - Signal Integrity, Structures


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Driving Innovation with Electronics - Article - ANSYS Advantage - V11 I3

Electronics are pervasive in our world today. From electric machines to high-speed electronic devices to antennas and wireless communication, the demand continues to grow. However, designing innovative products to work reliably in the real world becomes more difficult with the need to reduce energy consumption, avoid interference with other devices and decrease development time. Leading companies leverage engineering simulation to quickly bring to market pioneering products that meet and exceed expectations.

Author: ANSYS, Inc. Type: Article Date:
Product Name: ANSYS Maxwell, ANSYS Mechanical, ANSYS HPC, ANSYS HFSS, ANSYS Fluent, EMIT, ANSYS Icepak, ANSYS SIwave
Product Category: Electronics, Electronics - Cooling, Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Fluids, Structures, Electronics - Signal Integrity
Industry: Aerospace and Defense


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Crossed Signals - Article - ANSYS Advantage - V11 I3

Smart Modular Technologies engineers leverage the ANSYS Electronics Desktop platform to reduce the time required to perform signal integrity analysis of a high-speed printed circuit from days to hours. By using unified electromagnetic, thermal and structural simulation, engineers developed a reliable adapter.

Author: Smart Modular Technologies Type: Article Date:
Product Name: ANSYS Icepak, ANSYS Mechanical
Product Category: Electronics, Electronics - Cooling, Electronics - Signal Integrity, Structures


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The Big Data Chill - Article - ANSYS Advantage - V10 I2

To help reduce massive power demands, many data centers are increasingly using liquid cooling to complement or even replace air cooling systems. The leading provider of closed-loop liquid cooling systems for data centers, Asetek, uses thermal simulation with ANSYS Icepak to optimize cooling system components.

Author: Asetek A/S Type: Article Date:
Product Name: ANSYS Icepak
Product Category: Electronics, Electronics - Cooling
Industry: High Tech


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Ruggedized Systems: Cool and Collected - Article - ANSYS Advantage - V10 I2

To meet demanding military specifications for mobile and interconnected surveillance, communication and operational devices, Kontron uses sophisticated thermal simulation to balance size, weight, power and cooling (SWaP-C) trade-offs for 'ruggedized' modular chassis that support customized solutions for mission-critical operations.

Author: Kontron Type: Article Date:
Product Name: ANSYS Icepak, ANSYS DesignModeler, ANSYS DesignXplorer
Product Category: Fluids, High Performance Computing, Electronics - Cooling
Industry: High Tech, Aerospace and Defense
Sub Industry: A and D Electronics


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Keeping the Block Cool - ANSYS Advantage - Article - V10 I1

As cars become more complex, companies that manufacture the supporting electronic systems must make them reliable and safe. Automotive electronics system manufacturer Kyungshin improved the thermal management of its smart junction blocks while cutting production time by 80 percent and costs by over 50 percent.

Author: Kyungshin Type: Article Date:
Product Name: ANSYS Icepak, ANSYS SIwave
Product Category: Fluids, Multiphysics, Electronics - Integrated Circuits
Industry: Automotive, High Tech
Sub Industry: Car and Light Truck OEMs


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