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Differential Energy Analysis for Improved Performance/Watt in Mobile GPU

Mobile devices demand high performance in a very constrained environment. As a leader in perf/watt, Qualcomm® Adreno™ GPUs, a product of Qualcomm Technologies, Inc., leverages many effective methods to improve power efficiency. In this regard, Qualcomm has developed a differential energy analysis methodology based on ANSYS PowerArtist to identify the power optimization opportunity in GPU. This methodology can help to locate the inefficient part that needs further optimization in the pre-silicon stage. Experimental results based on identifying unnecessary register toggles demonstrate the effectiveness of this proposed methodology. View this on-demand webinar to learn more.

Speakers: 
Preeti Gupta, is head of RTL product management, for the ANSYS semiconductor business unit.

Yadong Wang is currently a staff engineer in the GPU system power team at Qualcomm Technologies, Inc., San Diego, California. He has about 10 years of ASIC low-power design experience. At Qualcomm, he is responsible for power modeling and analysis of Adreno™ GPUs, and explores and develops many effective methods to improve power efficiency. Before joining Qualcomm, he worked as a hardware power engineer at NVIDIA. Yadong earned an M.S. degree in electrical engineering from Tongji University (Shanghai, China) in 2009.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS PowerArtist
Product Category: Semiconductors
Industry: High Tech
Sub Industry: Semiconductor Design, Semiconductors


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Developing Safety-Critical HMI Applications with OpenGL Drivers - Webinar

Developing next-generation embedded human machine interfaces and interactive display software in aircraft, automobiles and industrial systems requires increasingly robust, portable, safety-critical, cost-effective solutions. To add to these challenges, the solutions must conform to open software environments and interfaces.

This on-demand webinar demonstrates how ANSYS SCADE Display, a model-based COTS tool, can help you with prototyping, modeling, simulating and later automatically generating certified code. SCADE Display is fully complementary with CoreAVI ArgusCore Safety Critical OpenGL SC2.0 software drivers. We will also discuss Vulkan, next generation graphics drivers and conformance to FACE standards.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS SCADE Display
Product Category: Embedded Software
Industry: High Tech


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Winning in the Digital Economy - Engineering Smart, Connected Products, Operations and Services - Webinar

The digital economy presents a unique, never-before opportunity to connect humanity. The Internet of Things (IoT) and digital technologies (e.g., digital twins) are revolutionizing nearly every industry imaginable, and personalized healthcare, connected cars and wearable electronics are just a few of the many applications. Engineering simulation provides a competitive edge for companies looking to develop better products – faster.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS HFSS
Product Category: Electronics - Electromechanical, Electronics - High Frequency Electromagnetics, Electronics - Integrated Circuits, Electronics - Signal Integrity, Embedded Software, Electronics, Semiconductors
Industry: Healthcare - BioMed, High Tech, Consumer Products, Automotive
Sub Industry: Biomedical Devices, Computer and Storage Devices, Consumer Electronics, Diagnosis and Personalized Medicine, Electrical and Electronics, Household Goods, Mobile Computing


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ANSYS Discovery: Simulation-driven Design for Every Engineer - Webinar

View this informative webinar in conjunction with the commercial release of the ANSYS Discovery family of products. These will allow engineers to discover their designs’ full potential — significantly faster than previously imagined.

In this webinar, you’ll hear users like Rossignol and Wibotic discuss how they’ve gained significant time-savings and product performance confidence with ANSYS Discovery and, as a result, delivered more innovative products to market in a shorter timeframe. We’ll also showcase ANSYS Discovery Live and some enhancements that we’ve made since the technology preview in 2017.

See how ANSYS continues to pioneer pervasive simulation in the upfront stages of product development.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Discovery AIM, ANSYS Discovery Live, ANSYS Discovery SpaceClaim
Product Category: Multiphysics
Industry: Aerospace and Defense, Automotive, Construction, Consumer Products, Energy, Healthcare - BioMed, High Tech, Industrial Equipment, Materials and Chemical Processing


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Running ANSYS Simulations at Scale with Ease in the Nimbix Cloud - Webinar

Nimbix is a pure high-performance computing (HPC) cloud built for volume, speed and simplicity — precisely the attributes you are looking for in running your ANSYS simulations.

Watch this webinar to learn how you can perform your simulations quickly and easily at scale in the Nimbix Cloud. We will show you how easy it is to get started, including signing up for access from any device, uploading your data securely, running parallel solvers, and performing pre- and post-processing — all on-demand. Discover how the Nimbix Cloud can be used to run the entire ANSYS product portfolio, including structures, fluids, electronics, and multiphysics, to solve all your product design challenges.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS Cloud Hosting Partners
Product Category: Platform, Cloud and IT Solutions
Industry: Aerospace and Defense, Automotive, Construction, Consumer Products, Energy, Healthcare - BioMed, High Tech, Industrial Equipment, Materials and Chemical Processing


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Thermal, EM and ESD Reliability Signoff for Next Generation FinFET Designs - Webinar

This webinar highlights the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge (ESD) robustness in advanced SoCs. Providing high reliability is critical for next-generation automotive, mobile and high-performance computing applications; it can be addressed in a systematic way using ANSYS reliability platforms throughout the design cycle.

Learn how ANSYS solutions offer comprehensive chip-package-system thermal analysis, as well as thermal aware EM sign-off, for finFET designs. Discover how ANSYS PathFinder can help ensure ESD integrity from the IO/IP level to the SoC for human body model (HBM) and charged device model (CDM) analysis. This session will also cover best practices for ESD model hand-off from IP to SoC for chip ESD validation, and generating SoC-level ESD models for system-level ESD simulations.

Author: ANSYS Type: Webinar Date:
Product Name: ANSYS RedHawk, ANSYS Totem, ANSYS PathFinder
Industry: Aerospace and Defense, Automotive, Consumer Products, High Tech
Sub Industry: Semiconductor Design, Semiconductors


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N7 Signoff: Expanding Simulation Coverage Using Big Data Techniques - Webinar

Next-generation automotive, mobile and high-performance computing systems demand the use of 16/7nm SoCs that are bigger, faster and more complex than ever. For these SoCs, the margins are smaller, schedules are tighter and costs are higher. Faster convergence with exhaustive coverage is imperative for on-time silicon success. The growing interdepencies among various multiphysics attributes such as timing, power and thermal properties in N16/N7 designs poses significant challenges for design closure. Existing solutions are not architected to solve for such a multidimensional optimization problem.

Join us for this webinar to learn how to maximize design coverage and accelerate convergence for SoC power signoff using the latest ANSYS SeaScape platform in big data systems. With unparalleled scalability across hundreds of cores using big data techniques, SeaScape helps you sign off on 1 billion+ instance designs within a few hours on commodity hardware. You will also learn how you can leverage multivariable analytics to achieve significantly better signoff confidence and drive meaningful design optimization.

Author: ANSYS Type: Webinar Date:
Industry: Automotive, High Tech


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Advances in Electrical Machine Electromagnetic & Multiphysics Simulation - Webinar


Electrical machine research and development engineers are increasingly reliant on advanced design and simulation software to assist in product development.

The ANSYS software tools provide a unique workflow and a comprehensive capability for electrical machine design, 2D/3D electromagnetic (with ANSYS Maxwell) including circuits and thermal/structural integrity simulation.

This webinar will update you on the latest advances in design methods, electromagnetic and multiphysics simulation for electrical machines. The newest functionality in ANSYS Maxwell and the other tools will be highlighted.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Maxwell
Product Category: Electronics
Industry: High Tech


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Electromagnetics Field Simulation with ANSYS Maxwell - Webinar


During this webinar you will be updated on the latest capabilities of ANSYS Maxwell for low-frequency electromagnetic field simulation for a variety of applications. The newest functionality in ANSYS Maxwell as well as the supporting circuit-simulation and co-simulation methodologies will also be presented.

Author: ANSYS, Inc. Type: Webinar Date:
Product Name: ANSYS Maxwell
Product Category: Electronics
Industry: High Tech


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Improve Your Chip Reliability using Thermal EM and ESD Simulations - Webinar

Full-chip reliability is critical for achieving successful silicon. This requires analysis that considers the impact of noise coupling, ESD and thermal effects from early in the design cycle to sign-off. FinFETs offer higher performance at the same power budget, or equal performance at a lower power budget, when compared to other chip designs. But lower noise margins and higher current density lead to thermal effects, including self-heat in FinFET transistors.

Attend this webinar to learn how ANSYS solutions can help you ensure chip-level reliability on the latest FinFET-based designs. Discover how ANSYS simulations can solve reliability issues, including noise coupling with on-chip mixed-signal, electromigration (EM), ESD, local self-heating and the overall thermal impact on noise and EM.

Author: ANSYS Type: Webinar Date:
Product Category: Electronics - High Frequency Electromagnetics
Industry: High Tech


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