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ANSYS at International Microwave Symposium 2019

 

ANSYS Booth 818

Designing 5G communication systems, advanced driver assistance systems (ADAS), IoT and other high-performance wireless and digital systems is driving high levels of integration, pushing the limits of battery life, and continuing the drive to design smaller electronic components. ANSYS simulation software will help you meet these design challenges. ANSYS is the gold standard software for the design of RF/microwave components, signal integrity, power integrity, EMI analysis and electronics reliability.

Visit ANSYS in Booth 818 to experience the industry-leading design flow for antenna synthesis, antenna placement and radio frequency interference (RFI) diagnosis. Learn how to combine ANSYS HFSS with thermal and mechanical analysis to create a true multiphysics platform to design reliable mission-critical electronic systems. ANSYS delivers the simulation features you need to create reliable, optimized wireless communications, autonomous systems and components, and achieve first-pass design success.

5G and Autonomy

5G and Autonomy

 RF and Microwave Reliability

RF and Microwave Reliability

EMI/EMC

EMI/EMC

In-Booth Presentations

Charlotte Blair

Charlotte Blair, Ph.D.

Lead Application Engineer
ANSYS Inc.

ANSYS Electro-Thermal Analysis with National Instruments/AWR Microwave Office

Tuesday, June 4 – 11 am

Dr. Larry Dunleavy

Dr. Larry Dunleavy

Professor University of South Florida,
President & CEO, Modelithics, Inc.

Solving RF & Microwave Design Issues Using 3D Component Modeling

Tuesday, June 4 – 4 pm

Jason Bommer

Jason Bommer

Senior Application Engineer
ANSYS Inc.

Mitigating Receiver Desense in Consumer Electronics

Wednesday, June 5 – 11 am

Arien Sligar

Arien Sligar

Principal Engineer
ANSYS Inc.

5G: A Simulation Vision

Wednesday, June 5 – 4 pm

ANSYS 3D Components Exclusive Session at IMS 2019

Improve collaboration, reduce engineering time and increase sales with ANSYS HFSS 3D components.

Date:
Wednesday, June 5, 2019
Time:
10:00 am to 11:00 am
Location:
Boston Convention & Exhibition Center,
Room 204B

Workshop: 5G Design Innovation Through Simulation

Dr. Larry Williams
Director of Technology, ANSYS, Inc.

Date:
Monday, June 3, 2019
Time:
8:00 am to 11:50 am
Location:
Boston Convention & Exhibition Center,
Room 157BC

Technical Sessions

THIF1-14: Enabling Safe Autonomous Vehicles by Advanced mm-Wave Radar Simulations
Thursday June 6, 2019 | 13:30 - 15:10 | Room 253ABC

Authors: Juan D. Castro, Sahitya Singh, Sara Louie, Damir Senic
Presenter: Akshaj Arora, ANSYS

Abstract

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