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11 Results for Author Craig Hillman

Craig Hillman is a director of software development at ANSYS. He served as the CEO and managing partner of DfR Solutions prior to its acquisition by ANSYS. Hillman holds a Ph.D. in materials science from the University of California – Santa Barbara and a B.S. in metallurgical engineering and materials science from Carnegie Mellon. He has expertise in design for reliability (DfR) best practices, lead-free (Pb-free) transition strategies, commodity/engineered products supplier qualification, passive component technology and printed board failure mechanisms. Author: Craig Hillman
About the Author: Craig Hillman is a director of software development at ANSYS. He served as the CEO and managing partner of DfR Solutions prior to its acquisition by ANSYS. Hillman holds a Ph.D. in materials science from the University of California – Santa Barbara and a B.S. in metallurgical engineering and materials science from Carnegie Mellon. He has expertise in design for reliability (DfR) best practices, lead-free (Pb-free) transition strategies, commodity/engineered products supplier qualification, passive component technology and printed board failure mechanisms.

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Showing 1 to 11 of 11 posts
Automotive Electronics Reliability
How the SAE J3168 Standard Will Improve Automotive Electronic Hardware
/ 3 min read
Automotive Electronics Reliability
Overcome Automotive Electronics Reliability Engineering Challenges
/ 3 min read
How to Overcome PCB Modeling Challenges | Ansys Blog
How to Overcome PCB Modeling Challenges [Updated for 2020]
/ 5 min read
The Importance of Material Characterization for Electronic Simulation
The Importance of Material Characterization for Electronic Simulation
/ 6 min read
Thermal Management Systems: How Hot Is Too Hot?
Thermal Management Systems: How Hot Is Too Hot?
/ 2 min read
What is Right to Repair and How Will it Affect Product Design?
What is Right to Repair and How Will it Affect Product Design?
/ 4 min read
Digital Image Correlation: A Key Technique for Materials Characterization
Digital Image Correlation: A Key Technique for Materials Characterization
/ 3 min read
Mitigate BGA and QFN Failures Using Redesigns, Underfills, Edge Bonds or Corner Staking
Mitigate BGA and QFN Failures Using Redesigns, Underfills, Edge Bonds or Corner Staking
/ 3 min read
What Is Physics of Failure?
What Is Physics of Failure?
/ 2 min read
How to Ensure Electronic Product Reliability When You Don’t Have Time to Test
How to Ensure Electronic Product Reliability When You Don’t Have Time to Test
/ 5 min read
Thermal Degradation of Electronics: How Hot is Too Hot?
Thermal Degradation of Electronics: How Hot is Too Hot?
/ 5 min read
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Showing 1 to 11 of 11 posts