利用經生產驗證的多重物理量分析,建立可靠且高效率的設計
Ansys 雲端原生解決方案提供了無可比擬的容量,即使是最大的 FinFET 積體電路 (IC) 和 3D/2.5D 多晶粒系統,也能加速完成時間。這些強大的多重物理量分析與驗證工具,是經由 Foundry 認可的黃金簽核驗證,可降低功耗、提高性能和可靠性,並降低專案風險。
產品系列
查看所有產品Ansys致力於為當今的學生打下成功的基礎,通過向學生提供免費的模擬工程軟體。
Ansys 雲端原生解決方案提供了無可比擬的容量,即使是最大的 FinFET 積體電路 (IC) 和 3D/2.5D 多晶粒系統,也能加速完成時間。這些強大的多重物理量分析與驗證工具,是經由 Foundry 認可的黃金簽核驗證,可降低功耗、提高性能和可靠性,並降低專案風險。
雲端原生彈性運算架構,提供完整晶片容量
This video briefly overviews the challenges and solutions addressed by Ansys Semiconductor software products for the Electronic Design Automation (EDA) market. Semiconductor design is going through an inflection point as designers face two significant challenges rooted in manufacturing advances: The first is the ongoing march of Moore’s Law into advanced finFET process technology below 5nm. We see newtransistor architectures like nanosheet gate-all-around (GAA) and back-side power delivery.The second set of challenges facing semiconductor designers relates to multi-die design, 2.5D/3D-IC packaging, and heterogeneous integration. Leading design teams have adopted these advances as they face various novel multiphysics challenges to succeed with 3D-IC. New multiphysics challenges include
"Analyzing the dynamic voltage drop in highly complex chips has always been a challenge. Using sigmaDVD simulation technique by Ansys, it is possible to generate tens of thousands of unique switching scenarios and a higher coverage of IR-drop hotspots."
"Using Ansys RedHawk-SC and OptisLang, we could speed up the Power Distribution Network (PDN) exploration process by a factor of 10, taking it from weeks to hours."
"Using sigmaDVD technique by Ansys, NXP achieved a significant reduction by 4X in the overall time required for voltage drop analysis across the Power Distribution Network (PDN) ."
"Illuvatar maximized the power efficiency of GPGPU by 10X (10 times) by optimizing the RTL power, using Ansys PowerArtist."
"Ansys RedHawk-SC Security enabled us to verify the full-chip resiliency against Laser Fault Injection (LFI) and allowed us to make precise layout-level design fixes for critical cells that failed the LFI threshold."
半導體產品線為先進節點晶片的性能和容量帶來了重大進步,為多晶粒設計的熱和多重物理量分析導入了新功能。
Ansys 半導體產品提供了一套全面性的多重物理量 EM/IR、熱能和電磁模擬引擎套組,目的在支援第三方 IC 執行流程以達成數位和電晶體層級設計。
核心產品建構在超高容量的雲端原生 SeaScape™ 平台上。該平台使用靈活運算的大量資料機器學習架構,可在數千個 CPU 核心上提供近乎線性的可擴充性。
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