ANSYS HPC for Academia

High-Performance Computing

High-performance computing (HPC) is an important consideration for academia. Complex research projects often involve simulating large assemblies, or even entire systems, which demand considerable computational resources when rapid results are required. The widespread availability of multicore processors, even in laptops, allows for impressive performance gains for medium- to large-numerical problem sizes. The ANSYS Academic products meet these HPC requirements by providing two levels of HPC:

  • Built-in HPC: For Teaching, Research and Associate licenses HPC capability is built into each task of the Academic base licenses. For most physics solvers, this is both shared and distributed memory HPC capability for up to 16 cores, plus GPU access is enabled for ANSYS Mechanical, Fluent and electronics solvers.
  • Add-on HPC: For Research and Associate licenses, the built-in HPC capability can be extended by purchasing additional ANSYS Academic HPC licenses. For most physics solvers, the shared and distributed memory HPC and GPU capability can be extended.

The ANSYS Academic solvers support the same HPC methods provided by our commercial HPC products. For example, if the ANSYS Academic product contains ANSYS HFSS, then the HPC methods available to the Academic HFSS product user are the same as that for the commercial solution. It is also important to note that the type of HPC available varies by solver and physics type, and not all solvers support all HPC methods. Please see the following PDF brochure and web page for more specific details of solver support for HPC:

所有捆绑了求解器(支持HPC功能)的ANSYS学术产品都内置四个HPC任务。这四个HPC任务可用于一个CPU内核或GPU卡/插槽。这就是说多达四个CPU内核或四个GPU卡可用来加速仿真求解时间。

结构、热以及流体学术产品

  • 内置HPC功能可分配到(或局限于)每个任务。例如,对于支持25个任务的ANSYS学术研究许可证而言,每个用户/任务可访问多达4个内核,从而可为每个求解提供多达4个内核。
  • 包括共享存储器(SMP)、分布式存储器并行(DMP)和域分解方法。
  • 针对ANSYS Mechanical和ANSYS Fluent求解器启用GPU存取。四个内置HPC任务中的每一个都可用于1个GPU卡/插槽,也就是说每个学术产品许可证能存取多达4个GPU卡/插槽。注意,我们不限制每个GPU卡/插槽的GPU内核数量。
  • 内置的扫频VT和VT加速器可用于ANSYS Mechanical APDL求解器。这是一种传统HPC扫频解决方案,现在已基本被DesignXplorer和Design Point Update取代了。
  • 以下结构、热和流体求解器可支持HPC:
    • ANSYS CFX (SMP, DMP)
    • ANSYS Fluent (SMP, DMP)
    • ANSYS Mechanical (SMP, DMP, 域分解))
    • ANSYS Autodyn (SMP, DMP)
    • ANSYS Polyflow (SMP, DMP)
    • ANSYS Icepak (SMP, DMP)

电磁学术产品

  • 内置HPC功能不分配到(或局限于)每个任务。例如,对于支持25个任务的ANSYS学术研究HF许可证而言,可内置100个HPC任务,这样单个用户可使用所有100个HPC任务,而25个用户也为每个求解使用4个内核。
  • 启用传统共享存储器(SMP)多处理器功能,可使用任何数量的SMP内核,但超过4个内核后扩展性不是很好。这基本上已经被其它HPC方法取代了。
  • 包含分布式并行存储 (DMP) 和域分解方法。
  • 不启用GPU存取。
  • 以下电磁场求解器可支持HPC:
    • ANSYS HFSS (SMP, 域分解, 分布式扫频)
    • ANSYS Maxwell (SMP, 分布式扫频)
    • ANSYS Designer (SMP, 分布式扫频)
    • ANSYS Q3D (SMP, DMP)
    • ANSYS SIwave (SMP)
    • ANSYS TPA (MP, 分布式PKG分析)
  • 学术Redhawk和PowerArtist产品目前不使用HPC。

所有ANSYS Academic Research和ANSYS Academic Associate产品都能通过附加HPC许可证扩展其内置的HPC功能。ANSYS Academic Teaching产品可能无法扩展其内置HPC功能。共有四种附加HPC产品许可证,如下所示:

附加学术HPC产品
(按照核心 & 工作组)

扩展下列
基础产品的内置

ANSYS Academic Associate HPC

ANSYS Academic Associate

ANSYS Academic Associate CFD



ANSYS Academic Research HPC

ANSYS Academic Research

ANSYS Academic Research CFD

ANSYS Academic Research Mechanical

ANSYS Academic Research Autodyn

ANSYS Academic Research Polyflow

ANSYS Academic Research Electronics Thermal

ANSYS Academic Associate Electronics HPC

ANSYS Academic Associate EM

ANSYS Academic Associate HF

ANSYS Academic Research Electronics HPC

ANSYS Academic Research EM

ANSYS Academic Research HF

对于任何可支持基础产品中HPC功能的求解器来说,ANSYS Academic Research/Associate HPC的任务能扩展其基本HPC功能(参见内置HPC部分,更详细地了解每个求解器适用的HPC方法)。每个任务添加一个内核。

SMP以及DMP和域分解方法都被附加HPC 学术用产品扩展到附加内核。请参照以上的内置部分,详细了解哪种捆绑式求解器支持哪种HPC。

对于结构、热学和流体学术用产品而言,“附加”HPC许可证无法扩展GPU功能,因为GPU存取已通过内置HPC实现(参见内置HPC部分)。

目录 & 产品名称 是否内置HPC? 是否可使用附加学术HPC许可? 是否可使用附加学术电子HPC许可?
Academic Multiphysics Campus Solutions
ANSYS Academic Multiphysics Campus Solution
Academic Associate
Mechanical and Fluids      
ANSYS Academic Associate Mechanical and CFD N/A
ANSYS Academic Associate CFD N/A
Electronics      
ANSYS Academic Associate Electronics Suite N/A
ANSYS Academic Associate HF N/A
ANSYS Academic Associate EM N/A
ANSYS Academic Associate RedHawk N/A
ANSYS Academic Associate PowerArtist N/A
Academic Research
Mechanical and Fluids      
ANSYS Academic Research Mechanical and CFD N/A
ANSYS Academic Research Mechanical YES YES N/A
ANSYS Academic Research CFD N/A
ANSYS Academic Research Polyflow N/A
ANSYS Academic Research Electronics Thermal N/A
ANSYS Academic Research LS-DYNA 1 N/A
Electronics      
ANSYS Academic Research Electronics Suite N/A
ANSYS Academic Research HF N/A
ANSYS Academic Research EM N/A
ANSYS Academic Research RedHawk N/A
ANSYS Academic Research PowerArtist N/A
Academic Teaching1
Mechanical and Fluids      
ANSYS Academic Teaching Mechanical and CFD N/A
ANSYS Academic Teaching Mechanical N/A
ANSYS Academic Teaching CFD N/A
Electronics      
ANSYS Academic Teaching Electronics Suite N/A
ANSYS Academic Teaching HF N/A
ANSYS Academic Teaching EM N/A
ANSYS Academic Teaching RedHawk N/A
ANSYS Academic Teaching PowerArtist N/A
Academic Toolbox
ANSYS Academic Meshing Tools N/A N/A
ANSYS Academic Fuel Cell Tools N/A N/A
ANSYS Academic EKM Shared N/A N/A
ANSYS Academic Composite Tools N/A N/A

Table Notes:

1. ANSYS 学术研究产品LS-DYNA可以增加HPC能力,成为ANSYS 学术研究 LS-DYNA HPC高性能计算能力产品。