TITLE

Icepak 4.3 electronics cooling design software, part of the ANSYS suite of products, introduces key new technologies in the thermal design of electronic systems. Direct representation of CAD geometries expands the ability of Icepak software to handle complex geometry with this new capability, providing additional flexibility and a higher degree of automation while modeling complex shapes in today’s electronics components and systems.

This image shows temperature distribution on an enclosure represented using CAD-shaped geometry.

Download image

Hex-dominant mesh on a radial fin heatsink (CAD).

Download image

Trace modeling of a printed circuit board.

Download image