ANSYS Solutions for the Electronics Industry

Friday, April 4, 2008,
9:00 a.m. to 3:00 p.m.

Location: ExecuTrain – San Jose, CA
Location Details

Register

Agenda:

8:30 a.m. – 9:00 a.m. Registration
9:00 a.m. – 9:30 a.m. Welcome/Introduction of products and ANSYS® Workbench™
9:30 a.m. – 10:30 a.m. Thermal management
  • Chip, board and system level analysis with ANSYS® Icepak® and ANSYS® Iceboard® software
  • Advanced cooling and acoustics modeling with FLUENT® and ANSYS® CFX® software
10:40 a.m. – 11:40 a.m. Structural and mechanical modeling
  • Thermal–mechanical stress and package reliability
  • Drop test and vibration analysis
11:40 a.m. – 12:30 p.m. Electromagnetic modeling
  • Parasitic extraction
12:30 p.m. – 1:30 p.m. Lunch
1:30 p.m. – 2:30 p.m. Multiphysics simulation
  • Piezoelectric and piezoresistivity
  • Thermal–structural–electric coupling
2:30 p.m. – 3:00 p.m. Product roadmap and close

Questions: tyler.mihevc@ansys.com

 

©2008 ANSYS, Inc. All Rights Reserved.