Detailed electronic component models using our TAS software to chip level models at the sub micron level.

Whether it is helping in the design process or thermally characterizing a component.  Create detailed thermal models of your components.  Provide your customers with accurate thermal properties of your devices.

ANSYS Icechip (Formerly Package Thermal Designer) is specifically designed for accurate component simulation. ANSYS Icechip has direct interfaces with the electrical tool you use for designing components. ANSYS Icechip is easy to use and accurate 3D models are automatically generated.

Gallium Arsenide FET modeling

The TAS software has been used for many years in thermally analyzing Gallium Arsenide (GaAs) amplifiers.  Power dissipated by these devices is very localized (submicron) resulting in very high local temperature gradients.  The thermal conductivity of GaAs is highly temperature dependent, getting worse at elevated temperatures.  All this must be accounted for to accurately predict their temperatures.

Ask about the FET Proprocessor to automate building models.