ANSYS Icechip

Accurate thermal simulation of electronic components.

ANSYS Icechip brings powerful and easy-to-use thermal analysis to Cadence APD and Sigrity UPD (previously Synopsys Encore). Make thermal analysis a seamless part of the design process.

• Simulate all common packaging types -- leaded, leadless, BGA, Multi-chip packages, stacked die, system-in-package and multi-chip packages including traces, vias and wire bonds
  
  
• Easy and intuitive user interface brings thermal analysis to designers without the need for a specialized background in heat transfer.
  
  
• Perform trade studies to optimize the thermal design
  
  
• The direct ECAD interface imports every die (even stacked die), trace, via, solderballs, encapsulant and bond wires.
  
  
• Import complex geometry like lead frames or heat spreaders from MCAD tools.
  
  
• Define non uniform power at the die level to predict hot spots.
  
  
• Export the model to ANSYS for stress analysis
  
  
• Put the component on a standard JEDEC board and simulate JEDEC thermal tests.
  
  
• Fast solve time, typically minute