ANSYS^® Icechip^®

• Simulate any package style - Single, multi-die packages and/or stacked die, Ball Grid Array, System-In-Package, leaded or leadless packages
• Launch ANSYS Icechip from within Cadence APD or Sigrity UPD.

• Imports all the data

	Every trace, via, bond wire, solderball, substrate layer and die is imported The simulation accounts for the heat transfer through every trace and via automatically.  No guessing at the properties like with other tools.
ANSYS Icechip can handle complex geometry
	Import complex geometry like lead frames and heat spreaders from DXG or DWG files
	Optimize the package thermal design by easily changing materials, geometry or boundary conditions.  View a complete summary of the results.
	Accurately predict temperature gradients over the die surface by defining exactly where the power is dissipated.  Import the power dissipation from a file as well.

ANSYS Icechip captures all the details in the thermal model yet still solves in minutes.

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