The printed circuit board is represented three-dimensionally. Whether you define a single layer with effective properties or define all 16 layers of the board, the temperature gradient through the board is accurately captured. If an ECAD database is imported, all the trace, pads, power and ground layer data is automatically defined. The animation below shows temperature at each layer of a board from the top to the bottom. Notice that you can see the component lead footprints on the top layer temperatures. This is because TASPCB accurately represents conduction down the leads. The footprints fade away due to conduction in the internal power and ground planes.
